Laser system and processing conditions for manufacturing bioabsorbable stents

Patent metadata

Field	Value
Publication number	US-10525552-B2
Application number	US-201715643221-A
Country	US
Kind code	B2
Filing date	Jul 6, 2017
Priority date	Jun 10, 2010
Publication date	Jan 7, 2020
Grant date	Jan 7, 2020

Abstract

The present invention involves laser machining polymer substrates to form a stent with laser parameters that minimize damage to the substrate in a surface region adjacent to the machined edge surface. The wavelength and pulse width are selected for this unique application and they can be controlled to minimize the surface modifications (such as voids, cracks which are induced by the laser-material interaction) which contribute to the variation in mechanical properties with distance from the edge surface, bulk mechanical properties, or a combination thereof.

First claim

What is claimed is:

1. A method of laser machining a substrate to form a stent, comprising:
providing a thin-walled polymer substrate;
laser machining the thin-walled polymer substrate with a laser beam with a pulse width and wavelength that cuts through the wall to form structural elements having a machined edge surface,
wherein the laser beam modifies the substrate in a surface region adjacent to the machined edge surface,
wherein the modifications include voids, and characterized by selecting the pulse width and wavelength so that the voids are present at no greater than a depth of 2 microns.

2. The method of claim 1 , wherein the polymer is poly(L-lactide)(PLLA) or polyglycolide (PLGA).

3. The method of claim 1 , wherein the polymer is PLLA and the wavelength is 532 nm and the pulse width is less than or equal to 10 ps and greater than or equal to 1 ps.

4. The method of claim 1 , wherein the repetition rate is 80-100 kHz.

5. The method of claim 1 , wherein the selected pulse width and wavelength of the laser beam minimize damage to the surface region adjacent to the machined edge surface arising from thermal and nonthermal ablation, and wherein the minimized damage comprises of the voids which arise from nonthermal ablation and melting arising from thermal ablation.

6. The method of claim 1 , wherein the polymer is PLLA and the wavelength and the pulse width are adjusted to within the green range and to 1-12 ps.

7. The method of claim 6 , wherein the laser beam causes variation in modulus of the polymer with distance from the edge surface, wherein the modulus converges at a distance less than 10 microns when the wavelength of the laser beam is within the green range.

8. The method of claim 7 , further directing a cooling gas at a region of the substrate machined by the laser beam.

9. A polymer stent body, comprising:
a plurality of interconnected structural elements formed by laser machining a thin-walled poly(L-Lactide) (PLLA) polymer substrate with a laser beam that cuts through the wall to form the structural elements,
wherein the structural elements have sidewalls corresponding to machined edge surfaces,
wherein a surface region adjacent to the sidewalls has damage caused by interaction of the laser beam with the substrate, characterized in that the damage comprises voids dispersed in the surface region,
wherein the voids dispersed in the surface region are present at no greater than a depth of 2 microns from the edge surface.

10. The stent body of claim 9 , wherein the damage further comprises variation in the modulus of the polymer with distance from the edge surface, wherein the modulus converges at a distance no greater than 5 microns.

Assignees

• Abbott Cardiovascular Systems Inc

Inventors

• Harrington Joel
• Vaughan Ryan
• Jow Kevin
• Pippey William
• Chen Yung-Ming

Classifications

• A61F2240/001

  Designing or manufacturing processes · CPC title

• B23K26/702

  Auxiliary equipment · CPC title

• A61F2/91 Primary

  made from perforated sheets or tubes, e.g. perforated by laser cuts or etched holes · CPC title

• B23K2103/50

  Inorganic materials other than metals or composite materials · CPC title

• A61F2/915

  with bands having a meander structure, adjacent bands being connected to each other · CPC title