Electrically conductive adhesives

Patent metadata

Field	Value
Publication number	US-10524364-B2
Application number	US-201213344649-A
Country	US
Kind code	B2
Filing date	Jan 6, 2012
Priority date	Jul 8, 2009
Publication date	Dec 31, 2019
Grant date	Dec 31, 2019

Abstract

The present invention relates to adhesives that are suitable for use as electrically conductive materials in the fabrication of electronic devices, integrated circuits, semiconductor devices, solar cells and/or solar modules. The adhesives comprise at least one resin component, at least one nitrogen-containing curative, at least one low melting point metal filler, and optionally at least one electrically conductive filler, which is different from the metal filler.

First claim

I claim:

1. A bonded assembly comprising:
two substrates aligned in a spaced apart relationship, each of which having an inwardly facing surface and an outwardly facing surface, wherein between the inwardly facing surfaces of each of the two substrates an electrically conductive bond is formed by a cured electrically conductive adhesive, consisting of:
a) a resin component consisting of:
i) 2 to 8% by weight of a cyanate ester component selected from polyfunctional monomeric cyanates, polyfunctional polymeric cyanates, and combinations thereof, and
ii) 3 to 10% by weight of an epoxy resin;

b) 1.5 to 3% by weight of at least one nitrogen-containing curative selected from amine-epoxy adducts;
c) 1.5 to 3% by weight of indium;
d) 70 to 90% by weight of silver flakes;
e) core shell rubber particles; and
f) optionally one or more additives selected from the group consisting of oils, pigments, dyes, defoamers, thickeners, humectants, dispersing agents, and water;
wherein the quantity of each of a)-f) is based on the total weight of the adhesive, wherein the adhesive is cured between 90° C. to 150° C. in 0.1 to 5 seconds.

2. The bonded assembly according to claim 1 , wherein the epoxy resin is selected from monofunctional glycidyl ethers, polyfunctional glycidyl ethers, and combinations thereof.

3. The bonded assembly according to claim 2 , wherein the cyanate ester component is 4,4′-ethylidenediphenyldicyanate.

4. The bonded assembly according to claim 1 , wherein upon exposure to an accelerated aging test of 4000 hours of 85° C. and relative humidity of 85%, the electrical contact resistance of the adhesive is increased by less than 20%, based on the initial electrical contact resistance.

5. A bonded assembly comprising:
two substrates aligned in a spaced apart relationship, each of which having an inwardly facing surface and an outwardly facing surface, wherein between the inwardly facing surfaces of each of the two substrates an electrically conductive bond is formed by a cured electrically conductive adhesive consisting of:
a) a resin component consisting of:
i) 2 to 8% by weight of a cyanate ester component selected from polyfunctional monomeric cyanates, polyfunctional polymeric cyanates, and combinations thereof, and
ii) 3 to 10% by weight of an epoxy resin;

b) 1.5 to 3% by weight of at least one nitrogen-containing curative selected from amine-epoxy adducts;
c) 1.5 to 3% by weight of indium;
d) 70 to 90% by weight of silver flakes; and
e) core shell rubber particles;
wherein the quantity of each of a)-e) is based on the total weight of the adhesive, wherein the adhesive is cured between 90° C. to 150° C. in 0.1 to 5 seconds.

6. A bonded assembly comprising:
a solar cell;
an external electrical circuit comprising contact tabs;
a lead free electrically conductive adhesive laminating together the solar cell and the contact tabs, the adhesive consisting of:
a) a resin component consisting of:
i) 2 to 8% by weight of a cyanate ester component selected from polyfunctional monomeric cyanates, polyfunctional polymeric cyanates, and combinations thereof, and
ii) 3 to 10% by weight of an epoxy resin;

b) 1.5 to 3% by weight of at least one nitrogen-containing curative selected from amine-epoxy adducts;
c) 1.5 to 3% by weight of indium;
d) 70 to 90% by weight of silver flakes; and
e) core shell rubber particles;
wherein the quantity of each of a)-e) is based on the total weight of the adhesive, and wherein the adhesive is cured between 90° C. to 150° C. in 0.1 to 5 seconds.

7. An electrically conductive adhesive consisting of:
a) a resin component consisting of:
i) 2 to 8% by weight of a cyanate ester component selected from polyfunctional monomeric cyanates, polyfunctional polymeric cyanates, and combinations thereof, and
ii) 3 to 10% by weight of an epoxy resin;

b) 1.5 to 3% by weight of at least one nitrogen-containing curative selected from amine-epoxy adducts;
c) 1.5 to 3% by weight of indium and/or indium alloys;
d) 70 to 90% by weight of silver flakes; and
e) optionally one or more additives selected from the group consisting of oils, pigments, dyes, defoamers, thickeners, humectants, dispersing agents, and water;
wherein the quantity of each of a)-e) is based on the total weight of the adhesive, wherein the adhesive is curable between 90° C. to 150° C.

8. The electrically conductive adhesive according to claim 7 , wherein the epoxy resin is selected from monofunctional glycidyl ethers, polyfunctional glycidyl ethers, and combinations thereof.

9. The electrically conductive adhesive according to claim 8 , wherein the cyanate ester component is 4,4′-ethylidenediphenyldicyanate.

10. The electrically conductive adhesive according to claim 7 , wherein upon exposure to an accelerated aging test of 4000 hours of 85° C. and relative humidity of 85%, the electrical contact resistance of the adhesive is increased by less than 20%, based on the initial electrical contact resistance.

Assignees

• Henckens Anja
• Henkel Ag & Co Kgaa

Inventors

• Henckens Anja

Classifications

• H10W70/60

  Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) · CPC title

• H05K3/321 Primary

  by conductive adhesives · CPC title

• C09J9/02 Primary

  Electrically-conducting adhesives · CPC title

• H05K1/09

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title

• H05K2203/0425

  Solder powder or solder coated metal powder · CPC title