Electroactive Materials for Metal-Ion Batteries
US-2017200939-A1 · Jul 13, 2017 · US
US10522824B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10522824-B2 |
| Application number | US-201515327744-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 21, 2015 |
| Priority date | Jul 23, 2014 |
| Publication date | Dec 31, 2019 |
| Grant date | Dec 31, 2019 |
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The present invention relates to a method for preparing silicon-based active material particles for a secondary battery and silicon-based active material particles. The method for preparing silicon-based active material particles according to an embodiment of the present invention comprises the steps of: providing silicon powder; dispersing the silicon powder into an oxidant solvent to provide a mixture prior to grinding; fine-graining the silicon powder by applying mechanical compression and shear stress to the silicon powder in the mixture prior to grinding to produce silicon particles; producing a layer of chemical oxidation on the fine-grained silicon particles with the oxidant solvent while applying mechanical compression and shear stress to produce silicon-based active material particles; and drying the resulting product comprising the silicon-based active material particles to yield silicon-based active material particles.
Opening claim text (preview).
The invention claimed is: 1. A method of preparing silicon-based active material particles, the method comprising: providing silicon powders; preparing a pre-pulverization mixture by dispersing the silicon powders in an oxidant solvent; forming silicon particles by refining the silicon powders of the pre-pulverization mixture by applying mechanical compression and shearing stress to the silicon powders; forming silicon-based active material particles by forming a chemical oxidation layer on the refined silicon particles by using the oxidant solvent while applying the mechanical compression and shearing stress, to provide a resulting product comprising the silicon-based active material particles; and yielding the silicon-based active material particles by drying the resulting product, wherein the silicon-based active material particles have a silicon crystal domain size of less than 50 nm. 2. The method of claim 1 , wherein the oxidant solvent comprises water, de-ionized water, an alcoholic solvent or a mixture of two or more thereof. 3. The method of claim 2 , wherein the alcoholic solvent comprises any one of ethyl alcohol, methyl alcohol, glycerol, propylene glycol, isopropyl alcohol, isobutyl alcohol, polyvinyl alcohol, cyclohexanol, octyl alcohol, decanol, hexatecanol, ethylene glycol, 1,2-octane diol, 1,2-dodecane diol, and 1,2-hexadecane diol, or a mixture thereof. 4. The method of claim 2 , wherein the alcoholic solvent is ethyl alcohol. 5. The method of claim 1 , wherein the applying of the mechanical compression and shearing stress is performed in a mill-pulverizing operation using a mixture of abrasive particles and the oxidant solvent. 6. The method of claim 1 , wherein the applying of the mechanical compression and shearing stresses is achieved by a grinding technique for providing the pre-pulverization mixture between a spinning abrasive plate and a fixed plate and performing pressing and polishing simultaneously. 7. The method of claim 1 , wherein the circularity of the silicon-based active material particles is equal to or greater than 0.5 and less than or equal to 0.9, and the circularity is determined according to Equation 1 below: Circularity = 2 π A P [ Equation 1 ] (A denotes an area of projection of a 2-dimensionally projected silicon particle and P denotes the circumferential length of the 2-dimensionally projected silicon particle). 8. The method of claim 1 , wherein the core of the silicon particle has a solid-type shape, a fiber-type shape, or a tube-type shape. 9. The method of claim 1 , wherein the area of the {110} surface of the core of the silicon particle is greater than the area of the {100} surface and the area of the {111} surface. 10. The method of claim 9 , wherein the {110} surface of the core of the silicon particle is a pulverized surface of a polished surface. 11. The method of claim 1 , wherein an average diameter of the silicon-based active material particles is in the range of 30 nm to 300 nm. 12. The method of claim 1 , wherein oxygen content of the silicon-based active material particles with respect to the total weight of the silicon-based active material particles is limited to from 9 wt % to 20 wt %. 13. The method of claim 1 , wherein a conductive layer is further formed on the chemical oxidation layer.
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