Organic electronic device having dimension tolerance between encapsulating layer and metal layer less than or equal to 200 microns

Patent metadata

Field	Value
Publication number	US-10522786-B2
Application number	US-201816125244-A
Country	US
Kind code	B2
Filing date	Sep 7, 2018
Priority date	May 21, 2013
Publication date	Dec 31, 2019
Grant date	Dec 31, 2019

Abstract

Provided are an organic electronic device (OED) and a method of manufacturing the same. The OED may effectively block moisture or oxygen permeating into the OED from an external environment, provide high reliability by increasing a life span and durability of an organic electronic diode, and minimize an align error in a process of attaching a film encapsulating the organic electronic diode to a substrate.

First claim

What is claimed is:

1. An organic electronic device (OED), comprising:
a substrate;
an organic electronic diode formed on the substrate; and
an encapsulation film comprising an encapsulating layer which comprises an encapsulating resin and a grinded moisture adsorbent, which encapsulates an entire surface of the organic electronic diode, and a metal-containing layer formed on the encapsulating layer, of which a dimension tolerance (d) between the metal-containing layer and the encapsulating layer of the encapsulation film satisfies Equation 1:
| d |≤200 μm  [Equation 1]

wherein d is a difference in distance between an arbitrary side surface of the metal-containing layer and a side surface of the encapsulating layer corresponding to the arbitrary side surface of the metal-containing layer, and
wherein the grinded moisture adsorbent is a powderized moisture adsorbent.

2. The organic electronic device according to claim 1 , wherein the metal-containing layer has a thermal conductivity of 50 W/mK or more.

3. The organic electronic device according to claim 1 , wherein the metal-containing layer comprises any one of a metal oxide, a metal nitride, a metal carbide, a metal oxynitride, a metal oxyboride, and a mixture thereof.

4. The organic electronic device according to claim 3 , wherein the metal-containing layer comprises any one of silicon oxide, aluminum oxide, titanium oxide, indium oxide, tin oxide, indium tin oxide, tantalum oxide, zirconium oxide, niobium oxide, and a mixture thereof.

5. The organic electronic device according to claim 1 , wherein the metal-containing layer further comprises a base substrate.

6. The organic electronic device according to claim 5 , wherein the base substrate is any one of polyethyleneterephthalate, polytetrafluoroethylene, polyethylene, polypropylene, polybutene, polybutadiene, a vinyl chloride copolymer, polyurethane, ethylene-vinyl acetate, an ethylene-propylene copolymer, an ethylene-ethyl acrylate copolymer, an ethylene-methyl acrylate copolymer, polyimide, nylon, and a combination thereof.

7. The organic electronic device according to claim 1 , wherein the encapsulating layer is a single layer or at least two layers.

8. The organic electronic device according to claim 7 , wherein when the encapsulating layer is formed of at least two layers, at least one layer has a tensile modulus of 0.001 to 500 MPa at room temperature.

9. The organic electronic device according to claim 8 , wherein the encapsulating layer includes a first layer having a tensile modulus of 0.001 to 500 MPa at room temperature, and a second layer having a tensile modulus of 200 to 1000 MPa at room temperature.

10. The organic electronic device according to claim 1 , wherein the encapsulating layer has a tensile modulus of 0.001 to 500 MPa at room temperature.

11. The organic electronic device according to claim 1 , wherein the encapsulating resin is a styrene-based resin, a polyolefin-based resin, a thermoplastic elastomer, a polyoxyalkylene-based resin, a polyester-based resin, a polyvinylchloride-based resin, a polycarbonate-based resin, a polyphenylenesulfide-based resin, a mixture of hydrocarbon, a polyamide-based resin, an acrylate-based resin, an epoxy-based resin, a silicon-based resin, a fluorine-based resin, or a mixture thereof.

12. The organic electronic device according to claim 1 , wherein the encapsulating resin comprises a curable resin.

13. The organic electronic device according to claim 12 , wherein the curable resin comprises at least one curable functional group selected from a glycidyl group, an isocyanate group, a hydroxy group, a carboxyl group, an amide group, an epoxide group, a cyclic ether group, a sulfide group, an acetal group, and a lactone group.

14. The organic electronic device according to claim 12 , wherein the curable resin is an epoxy resin comprising a cyclic structure in a molecular structure.

15. The organic electronic device according to claim 12 , wherein the curable resin is a silane-modified epoxy resin.

16. The organic electronic device according to claim 1 , wherein the organic electronic diode is an organic light emitting diode.

17. A method of manufacturing an organic electronic device, comprising:
applying an encapsulation film comprising an encapsulating layer comprising an encapsulating resin and a grinded moisture adsorbent, and a metal-containing layer formed on the encapsulating layer to a substrate on which an organic electronic diode is formed to encapsulate an entire surface of the organic electronic diode; and
curing the encapsulating layer of the encapsulation film,
wherein a dimension tolerance (d) between the metal-containing layer and the encapsulating layer of the encapsulation film satisfies Equation 1:
| d |≤200 μm  [Equation 1]

wherein d is a difference in distance between an arbitrary side surface of the metal-containing layer and a side surface of the encapsulating layer corresponding to the arbitrary side surface of the metal-containing layer, and
wherein the grinded moisture adsorbent is a powderized moisture adsorbent.

18. The method according to claim 17 , wherein the encapsulating layer of the encapsulation film covers the entire surface of the organic electronic diode.

Assignees

• Lg Chemical Ltd

Inventors

• Yoo Hyun Jee
• Lee Seung Min
• Kim Hyun Suk
• Chang Suk Ky
• Moon Jung Ok

Classifications

• B32B9/045

  of synthetic resin · CPC title

• B32B9/04

  comprising such {particular} substance as the main or only constituent of a layer, {which is} next to another layer of {the same or of} a {different material (next to a glass layer B32B17/06; layered products with at least two ceramic layers composed mainly of ceramic B32B18/00)} · CPC title

• B32B15/08

  of synthetic resin · CPC title

• B32B27/285

  comprising polyethers · CPC title

• B32B9/002

  comprising natural stone or artificial stone · CPC title