Coil fixing structure

US10522284B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10522284-B2
Application numberUS-201815921703-A
CountryUS
Kind codeB2
Filing dateMar 15, 2018
Priority dateMar 30, 2017
Publication dateDec 31, 2019
Grant dateDec 31, 2019

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A coil fixing structure includes a substrate, which has a thickness in a vertical direction, and a coil, which is wound around an axis extending in a vertical direction and fixed to the substrate. The substrate includes a conductor portion and an insulating portion disposed on the conductor portion. The conductor portion includes a first land portion and a second land portion, which are exposed from an upper surface of the substrate. A first lead wire drawn from the coil has an end portion connected to the first land portion. A second lead wire drawn from the coil has an end portion connected to the second land portion. When viewed in a plan in the vertical direction, the first land portion and the second land portion are disposed to surround the coil.

First claim

Opening claim text (preview).

What is claimed is: 1. A coil fixing structure comprising: a substrate, which has a thickness in a vertical direction; and a coil, which is wound around an axis extending in a vertical direction and fixed to the substrate, wherein the substrate includes a conductor portion and an insulating portion disposed on the conductor portion, wherein the conductor portion includes a first land portion and a second land portion, which are exposed from an upper surface of the substrate, wherein a first lead wire drawn from the coil has an end portion connected to the first land portion, wherein a second lead wire drawn from the coil has an end portion connected to the second land portion, and wherein, when viewed in a plan in the vertical direction, the first land portion and the second land portion are disposed to surround the coil. 2. The coil fixing structure according to claim 1 , wherein the coil is bonded to the substrate with a bonding agent. 3. The coil fixing structure according to claim 2 , wherein the first land portion and the second land portion have substantially equal lengths in a circumferential direction around the axis. 4. The coil fixing structure according to claim 3 wherein, when viewed in a plan in the vertical direction, a shape including an inner edge of the first land portion and an inner edge of the second land portion is similar in shape to an outer edge of the coil. 5. The coil fixing structure according to claim 4 , wherein the first land portion and the second land portion each include a plurality of sub-land portions arranged in the circumferential direction around the axis, and at least one connector connecting adjacent two of the sub-land portions. 6. The coil fixing structure according to claim 4 , wherein the first land portion and the second land portion each include a plurality of sub-land portions arranged in the circumferential direction around the axis, and wherein, when viewed in a plan in the vertical direction, the insulating portion is disposed between adjacent two of the sub-land portions.

Assignees

Inventors

Classifications

  • Windings characterised by the conductor shape, form or construction, e.g. with bar conductors · CPC title

  • Fastening of winding heads, equalising connectors, or connections thereto · CPC title

  • with moving magnets and stationary coil systems · CPC title

  • Non-printed inductor · CPC title

  • H01F27/292Primary

    Surface mounted devices · CPC title

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Frequently asked questions

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What does patent US10522284B2 cover?
A coil fixing structure includes a substrate, which has a thickness in a vertical direction, and a coil, which is wound around an axis extending in a vertical direction and fixed to the substrate. The substrate includes a conductor portion and an insulating portion disposed on the conductor portion. The conductor portion includes a first land portion and a second land portion, which are exposed…
Who is the assignee on this patent?
Nidec Seimitsu Corp
What technology area does this patent fall under?
Primary CPC classification H01F27/292. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Dec 31 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).