Display with vias for concealed printed circuit and component attachment

Patent metadata

Field	Value
Publication number	US-10522072-B2
Application number	US-201715796675-A
Country	US
Kind code	B2
Filing date	Oct 27, 2017
Priority date	Oct 28, 2011
Publication date	Dec 31, 2019
Grant date	Dec 31, 2019

Abstract

An electronic device may include a display. The display may be an organic light-emitting diode display. The organic light-emitting diode display may have a substrate layer, a layer of organic light-emitting diode structures, and a layer of sealant. Vias may be formed in the substrate layer by laser drilling. The vias may be filled with metal using electroplating or other metal deposition techniques. The vias may be connected to contacts on the rear surface of the display. Components such as flexible printed circuits, integrated circuits, connectors, and other circuitry may be mounted to the contacts on the rear surface of the display.

First claim

What is claimed is:

1. An electronic device comprising:
a housing;
an organic light-emitting diode display mounted in the housing, wherein the organic light-emitting diode display has an active area and an inactive area and comprises:
a glass substrate;
a thin-film transistor layer on the glass substrate;
organic light-emitting diodes on the glass substrate in the active area;
a sealant layer that overlaps the organic light-emitting diodes; and
a conductive via that extends through the glass substrate in the inactive area and that is electrically connected to the thin-film transistor layer;

a rigid printed circuit board having first and second opposing surfaces, wherein the via is electrically connected to a conductive structure on the first surface; and
a display driver integrated circuit mounted to the second surface, wherein the via electrically connects the display driver integrated circuit to the thin-film transistor layer.

2. The electronic device defined in claim 1 , wherein the conductive via has electroplated metal sidewalls.

3. The electronic device defined in claim 2 , wherein the organic light-emitting diodes form an array of pixels that displays images to a user.

4. The electronic device defined in claim 3 , wherein the inactive area is an inactive border region of the display that surrounds the array of pixels.

5. The electronic device defined in claim 4 , further comprising:
a plurality of additional conductive vias that extend through the glass substrate, wherein the plurality of additional conductive vias are formed in the inactive border region.

6. The electronic device defined in claim 5 , further comprising:
a transparent display cover layer over the display.

7. An electronic device, comprising:
a housing;
a display mounted in the housing, wherein the display comprises:
a glass substrate;
an array of organic light-emitting diode pixels on the glass substrate that form an active region of the display;
an inactive region that surrounds the active region; and
a conductive via that extends through the glass substrate in the inactive region and that is electrically connected to the array of organic light-emitting diode pixels;

a printed circuit board electrically connected to the conductive via; and
a display driver integrated circuit mounted to the printed circuit board, wherein the printed circuit board is interposed between the display driver integrated circuit and the glass substrate.

8. The electronic device defined in claim 7 , wherein the display comprises:
a layer of organic emissive material on the glass substrate that forms the array organic light-emitting diode pixels; and
a thin-film transistor layer on the glass substrate that is electrically connected to the array of organic light-emitting diode pixels.

9. The electronic device defined in claim 8 , wherein the display driver integrated circuit provides signals to the thin-film transistor layer through the conductive via.

10. The electronic device defined in claim 9 , wherein the display further comprises:
a sealant layer that overlaps the layer of organic emissive material and the thin-film transistor layer, wherein the layer of organic emissive material is between the glass substrate and the sealant layer.

11. The electronic device defined in claim 7 , wherein the conductive via has electroplated metal sidewalls.

12. The electronic device defined in claim 11 , further comprising:
a plurality of additional conductive vias that extend through the glass substrate in the inactive region and that are electrically connected to the array of organic light-emitting diode pixels.

13. The electronic device defined in claim 12 , wherein each of the plurality of additional conductive vias has electroplated metal sidewalls.

14. The electronic device defined in claim 7 , further comprising:
a transparent display cover layer that overlaps the display.

15. An electronic device, comprising:
a housing;
an organic light-emitting diode display mounted in the housing, wherein the organic light-emitting diode display comprises:
a glass substrate;
a thin-film transistor layer on the glass substrate;
organic light-emitting diodes on the glass substrate that form an array of pixels that displays images; and
a via in the glass substrate in an inactive edge region of the display that runs along the array of pixels, wherein the via has electroplated metal sidewalls that extend through the glass substrate;

a printed circuit board connected to the via; and
a display driver integrated circuit mounted to the printed circuit board, wherein the printed circuit board is interposed between the display driver integrated circuit and the glass substrate and provides signals to the array of pixels through the via.

16. The electronic device defined in claim 15 , wherein the printed circuit board has first and second opposing surfaces, wherein the first surface is interposed between the second surface and the glass substrate, and wherein the display driver integrated circuit is mounted on the second surface.

17. The electronic device defined in claim 16 , wherein the printed circuit board comprises a first conductive contact on the first surface that is electrically connected to a second conductive contact on the glass substrate.

18. The electronic device defined in claim 17 , wherein the second conductive contact is electrically connected to the via.

19. The electronic device defined in claim 18 , wherein the printed circuit board is a rigid printed circuit board.

20. The electronic device defined in claim 15 further comprising:
a plurality of additional vias in the glass substrate in the inactive edge region of the display, wherein each of the plurality of additional vias has electroplated metal sidewalls that extend through the glass substrate.

Assignees

• Apple Inc

Inventors

• Wright Derek
• Rothkopf Fletcher R
• Myers Scott A

Classifications

• H05K1/115

  Via connections; Lands around holes or via connections (H05K1/112 takes precedence) · CPC title

• G09G2300/0426

  Layout of electrodes and connections · CPC title

• G09G3/3208 Primary

  organic, e.g. using organic light-emitting diodes [OLED] · CPC title

• H01L27/3276

  Electricity · mapped topic

• H01L51/52

  Electricity · mapped topic