Memory module cooler with rotatable cooling tube

Patent metadata

Field	Value
Publication number	US-10520259-B2
Application number	US-201715679517-A
Country	US
Kind code	B2
Filing date	Aug 17, 2017
Priority date	Aug 17, 2017
Publication date	Dec 31, 2019
Grant date	Dec 31, 2019

Abstract

An example memory module cooler may include a first liquid manifold, a second liquid manifold, and a cooling tube connected to the first and second liquid manifolds such that. The cooling tube may be connected to the manifolds such that (1) liquid coolant can flow from the first liquid manifold through the cooling tube to the second liquid manifold, and (2) the cooling tube can be rotated relative to the first and second liquid manifolds around a longitudinal axis of the cooling tube. The cooling tube may have an oblong cross-sectional profile.

First claim

What is claimed is:

1. An apparatus to cool memory modules of a computing device, comprising:
a first liquid manifold;
a second liquid manifold;
a cooling tube connected to the first and second liquid manifolds such that:
liquid coolant can flow from the first liquid manifold through the cooling tube to the second liquid manifold; and
the cooling tube can be rotated relative to the first and second liquid manifolds around a longitudinal axis of the cooling tube,
wherein the cooling tube has an oblong cross-sectional profile and is configured such that, when the apparatus is installed in the computing device, the cooling tube extends between two of the memory modules and is rotatable relative to the first and second liquid manifolds around the longitudinal axis of the cooling tube between a first configuration and a second configuration, and
wherein in the first configuration the cooling tube does not touch the memory modules and in the second configuration the cooling tube touches both of the memory modules.

2. The apparatus of claim 1 , wherein the cooling tube is semi-rigid and, when the apparatus is installed in the computing device and the cooling tube is in the second configuration, the cooling tube is deformed by its corresponding memory modules.

3. The apparatus of claim 1 ,
wherein the cooling tube has a thermal conductivity of at least 1 W/(mK).

4. The apparatus of claim 1 , further comprising:
a rotatable connector that connects the cooling tube to the first manifold;
a lever connected to the rotatable connector such that moving the lever causes the cooling tube to rotate about its longitudinal axis.

5. The apparatus of claim 1 , further comprising:
rotatable connector that connects the cooling tube to the first manifold;
a gear enmeshed with teeth on the rotatable connector such that rotating the gear causes the cooling tube to rotate about its longitudinal axis.

6. A computing device comprising, comprising:
a plurality of memory modules connected to a printed circuit board;
a first liquid manifold;
a second liquid manifold;
a plurality of cooling tubes connected to the first and second liquid manifolds such that for each of the plurality of cooling tubes:
liquid coolant can flow from the first liquid manifold through the respective cooling tube to the second liquid manifold; and
the respective cooling tube can be rotated relative to the first and second liquid manifolds around a longitudinal axis of the respective cooling tube,
wherein each of the plurality of cooling tubes: is arranged between a corresponding pair of memory modules of the plurality of memory modules, has an oblong cross-sectional profile, and is thermally conductive and semi-rigid, and
for each of the plurality of cooling tubes:
the respective cooling tube is rotatable relative to the first and second liquid manifolds around its longitudinal axis between a first configuration and a second configuration,
in the first configuration the respective cooling tube does not touch its corresponding memory modules and in the second configuration the cooling tube touches both of its corresponding memory modules.

7. The computing device of claim 1 , wherein the plurality of cooling tubes are such that, when the plurality of cooling tubes are in the second configuration, each of the plurality of cooling tubes is deformed by its corresponding memory modules.

8. The computing device of claim 6 ,
wherein each of the plurality of cooling tubes has a thermal conductivity of at least 1 W/(mK).

9. The computing device of claim 6 , further comprising:
rotatable connectors that connect the plurality of cooling tubes, respectively, to the first manifold; and
a plurality of levers, each connected to one of the rotatable connectors, and a bar connected to each of the plurality of levers, such that moving the bar causes the plurality of cooling tubes to rotate about their respective longitudinal axis.

10. The computing device of claim 6 , further comprising:
rotatable connectors that connect the plurality of cooling tubes, respectively, to the first manifold; and
a plurality of gears, each enmeshed with teeth on at least one of the rotatable connectors such that rotating one of the plurality gears causes the plurality of cooling tubes to rotate about their respective longitudinal axes.

11. The computing device of claim 6 ,
wherein the first and second liquid manifolds are affixed to the printed circuit board, and
for each of the plurality of cooling tubes:
the respective cooling tube is rotatable relative to the first and second liquid manifolds around its longitudinal axis between a first configuration and a second configuration,
in the first configuration the respective cooling tubes does not touch its corresponding memory modules and in the second configuration the cooling tube touches both of its corresponding memory modules.

12. A method of servicing the computing device of claim 11 , comprising:
rotating the plurality of cooling tubes from the second configuration into the first configuration; and then
removing one of the plurality of memory modules from the printed circuit board without disconnecting either of the first and second liquid manifolds from the printed circuit board and without disconnecting any of the plurality of cooling tubes from either of the first and second liquid manifolds.

13. The method of claim 12 , comprising:
with the plurality of cooling tubes in the first configuration, connecting a replacement memory module to the printed circuit board; and then
rotating the plurality of cooling tubes from the first configuration into the second configuration.

14. A method of manufacturing a computing device, comprising:
providing a printed circuit board that includes a number of memory sockets;
providing a memory module cooler that includes a first liquid manifold, a second liquid manifold, and a number of cooling tubes that have oblong cross-sectional profiles and are connected to the first and second liquid manifolds such that:
liquid coolant can flow from the first liquid manifold through the cooling tube to the second liquid manifold; and
the cooling tube can be rotated relative to the first and second liquid manifolds around a longitudinal axis of the cooling tube between a first configuration and a second configuration,
installing the memory module cooler on the printed circuit board by:
positioning the memory module cooler such that each of the cooling tubes is adjacent to and extends substantially parallel to at least one of the memory sockets; and
affixing the first and second liquid manifolds to the printed circuit board; and

in a state in which the memory module cooler has been installed on the printed circuit board and a number of memory modules have been installed in the memory sockets, rotating the cooling tubes from the first configuration, in which the cooling tubes vertically oriented, to the second configuration in which each of the cooling tubes is in contact with one of the memory modules that is adjacent thereto.

15. The method of claim 14 ,
wherein installing the memory module cooler is performed in a state in which the memory modules have been installed in the memory sockets, and
positioning the memory module cooler such that each of the cooling tubes is adjacent to and extends substantially parallel to at least one of the memory sockets includes, while the cooling tubes are in the first configuration, inserting at least one of the cooling tubes between a pair of adjacent memory modules.

16. The method of claim 14 ,
wherein in

Assignees

• Hewlett Packard Entpr Dev Lp

Inventors

• Chialastri David Scott

Classifications

• F28F9/10

  by screw-type connections, e.g. gland · CPC title

• F28F9/0229

  Double end plates; Single end plates with hollow spaces · CPC title

• F28F9/06

  by dismountable joints · CPC title

• F28D1/05366

  Assemblies of conduits connected to common headers, e.g. core type radiators · CPC title

• F28D2021/0029

  Heat sinks · CPC title