Polysilicon package

Patent metadata

Field	Value
Publication number	US-10518964-B2
Application number	US-201515503103-A
Country	US
Kind code	B2
Filing date	Sep 18, 2015
Priority date	Sep 26, 2014
Publication date	Dec 31, 2019
Grant date	Dec 31, 2019

Abstract

A package in which a bag formed from a polyethylene-based resin film having a small thickness, more specifically a thickness of 300 μm or less is filled with crushed polysilicon (Si chunks) and damage to the bag by the Si chunks is effectively prevented.
In a polysilicon package in which the bag 1 formed from a polyethylene-based resin having an average thickness of 300 μm or less is filled with the Si chunks 4 , the bag 1 has a heat-sealed bonded part 2 at the bottom and is filled with the Si chunks 4 to ensure that the maximum expansion of the bag 1 becomes 5% or less when the bag 1 is held in an upright state with the bottom as a ground contact surface.

First claim

The invention claimed is:

1. A polysilicon package in which a bag formed from a linear low-density polyethylene (LLDPE)-based resin film having an average thickness of 300 μm or less is filled with crushed polysilicon that is obtained by mechanically crushing a polysilicon rod, wherein:
the bag has a heat-sealed bonded part at a bottom and filled with crushed polysilicon to ensure that a maximum expansion of the bag is not less than 0% but is 5% or less while the bag is held in an upright state with the bottom as a ground contact surface, and
the linear low-density polyethylene-based resin film forming the bag is metallocene-catalyzed linear low-density polyethylene.

2. The polysilicon package according to claim 1 , wherein the bag has the heat-sealed bonded part at a top opposite to the bottom, and the heat-sealed bonded part at the top is formed by closing after filling crushed polysilicon.

3. The polysilicon package according to claim 2 , wherein a ratio (h/L 1 ) of a loading height “h” of the crushed polysilicon filled in the bag to inner peripheral length “L 1 ” of the bag before the crushed polysilicon are filled is 0.1 to more.

4. The polysilicon package according to claim 1 , wherein average of maximum length of the crushed polysilicon is 5 to 150 mm.

5. The polysilicon package according to claim 1 , wherein polyethylene-based resin film forming the bag has a thrust strength (JIS-Z1707) of 5 N or more.

6. A polysilicon double package in which the polysilicon package of claim 1 is sealed in an outer bag formed from polyethylene-based resin film.

7. A process for producing a polysilicon package, comprising steps of:
holding a bag formed from a linear low-density polyethylene (LLDPE)-based resin film having an average thickness of 300 μm or less in an upright state with a filling opening thereof facing up and a bottom as a ground contact surface when crushed polysilicon that is obtained by mechanically crushing a polysilicon rod are to be filled; and
filling crushed polysilicon from the filling opening to ensure that a maximum expansion of the bag is not less than 0% but is 5% or less,
wherein the expansion of the bag to be filled with the crushed polysilicon is suppressed by inserting the bag into a frame to fill the crushed polysilicon, and
wherein the linear low-density polyethylene-based resin film is metallocene-catalyzed linear low-density polyethylene.

Assignees

• Tokuyama Corp

Inventors

• Yoshimura Satoko
• Asano Takuya

Classifications

• B65D77/12

  by collapsing and flattening the mouth portion of the container and securing without folding, e.g. by pressure-sensitive adhesive, heat-sealing, welding or applying separate securing members · CPC title

• C08J5/18

  Manufacture of films or sheets · CPC title

• B65D85/30 Primary

  for articles particularly sensitive to damage by shock or pressure · CPC title

• B65D77/04

  Articles or materials enclosed in two or more containers disposed one within another · CPC title

• B65B29/00

  Packaging of materials presenting special problems · CPC title