Silver powder
US-2015314370-A1 · Nov 5, 2015 · US
Copper power and method for producing same
US10518323B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10518323-B2 |
| Application number | US-201314432646-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 20, 2013 |
| Priority date | Nov 26, 2012 |
| Publication date | Dec 31, 2019 |
| Grant date | Dec 31, 2019 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
Disclosed is copper powder having an average primary particle size D of 0.15 to 0.6 μm, having a ratio of D to DBET, D/DBET, of 0.8 to 4.0 wherein DBET is a sphere-equivalent average particle diameter calculated from a BET specific surface area, and having no layer for preventing agglomeration on the surface thereof. The copper powder is suitably produced by a method which includes a step of mixing (1) hydrazine and (2) a reactant mixture including a monovalent or divalent copper source and a liquid medium which includes water and an organic solvent having water miscibility and capable of reducing the surface tension of water, to reduce the copper source to form copper particles.
First claim
Opening claim text (preview).
The invention claimed is: 1. Copper powder having a crystallite size of 37 nm or smaller, an average primary particle size D of 0.15 to 0.6 μm, having a ratio of D to D BET (D/D BET ) of 0.8 to 4.0, wherein D BET is a sphere-equivalent average particle diameter calculated from a BET specific surface area, and having no layer for preventing agglomeration on the surface thereof. 2. The copper powder according to claim 1 , having a total content of carbon, phosphorus, silicon, titanium, and zirconium of 0.10 mass % or less. 3. The copper powder according to claim 2 , having a total content of sodium, sulfur, and chlorine of 0.10 mass % or less. 4. The copper powder according to claim 2 , having a sintering onset temperature of 170° to 240° C. 5. The copper powder according to claim 1 , having a total content of sodium, sulfur, and chlorine of 0.10 mass % or less. 6. The copper powder according to claim 5 , having a sintering onset temperature of 170° to 240° C. 7. The copper powder according to claim 1 , having a sintering onset temperature of 170° to 240° C.
Assignees
Inventors
Classifications
Using means for chemical reduction · CPC title
Inks comprising nanoparticles and specially adapted for being sintered at low temperature (H05K1/095 takes precedence) · CPC title
- B22F1/00Primary
Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties · CPC title
Submicron particles having a size above 100 nm up to 300 nm · CPC title
having metal particles · CPC title
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- What does patent US10518323B2 cover?
- Disclosed is copper powder having an average primary particle size D of 0.15 to 0.6 μm, having a ratio of D to DBET, D/DBET, of 0.8 to 4.0 wherein DBET is a sphere-equivalent average particle diameter calculated from a BET specific surface area, and having no layer for preventing agglomeration on the surface thereof. The copper powder is suitably produced by a method which includes a step of mi…
- Who is the assignee on this patent?
- Mitsui Mining & Smelting Co
- What technology area does this patent fall under?
- Primary CPC classification B22F1/00. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Dec 31 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).