Communication system with enhanced partial power source and method of manufacturing same

US10517507B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10517507-B2
Application numberUS-201414308548-A
CountryUS
Kind codeB2
Filing dateJun 18, 2014
Priority dateApr 28, 2005
Publication dateDec 31, 2019
Grant dateDec 31, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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Abstract

Official abstract text for this publication.

The system of the present invention includes a conductive element, an electronic component, and a partial power source in the form of dissimilar materials. Upon contact with a conducting fluid, a voltage potential is created and the power source is completed, which activates the system. The electronic component controls the conductance between the dissimilar materials to produce a unique current signature. The system can also measure the conditions of the environment surrounding the system.

First claim

Opening claim text (preview).

What is claimed is: 1. A device comprising a partial power source for communication, the device comprising: a support structure; a layer of adhesion material deposited onto a first location of the support structure, wherein the layer of adhesion material defines a plurality of holes, and the support structure remains a solid and continuous support material underneath each of the plurality of holes; a first material deposited onto the layer of adhesion material and over the plurality of holes such that the first material covers the plurality of holes, wherein the first material adheres to the layer of adhesion material; a layer of transition material deposited onto a second location of the support structure; and a second material deposited onto the layer of transition material, wherein the first material and the second material are configured to generate a voltage potential difference when the first material and the second material come into contact with a conducting fluid. 2. The device of claim 1 , wherein the layer of adhesion material comprises a layer of gold. 3. The device of claim 1 , wherein a surface of the adhesion material is roughened to enhance adhesion property. 4. The device of claim 1 , wherein the support structure is a silicon based material. 5. The device of claim 1 , wherein the first material is deposited via evaporating deposition using electron beams. 6. The device of claim 1 , wherein the layer of adhesion material is less than 100 microns thick and the first material is deposited via evaporating deposition using electron beams. 7. A device comprising a partial power source for communication, the device comprising: a support structure; a layer of adhesion material deposited onto a first location of the support structure, wherein the layer of adhesion material defines a plurality of holes; a first material deposited onto the layer of adhesion material and over the plurality of holes such that the first material covers the plurality of holes, wherein the first material adheres to the layer of adhesion material; a layer of transition material deposited onto a second location of the support structure; and a second material deposited onto the layer of transition material, wherein the first material and the second material are configured to generate a voltage potential difference when the first material and the second material come into contact with a conducting fluid, wherein the plurality of holes are confined to a center region of the layer of adhesion material such that each edge of the first material is not positioned over any hole of the plurality of holes when the first material adheres to the layer of adhesion material. 8. The device of claim 7 , wherein the layer of adhesion material comprises a layer of gold. 9. The device of claim 7 , wherein a surface of the adhesion material is roughened to enhance adhesion property. 10. The device of claim 7 , wherein the support structure is a silicon based material. 11. The device of claim 7 , wherein the first material is deposited via evaporating deposition using electron beams. 12. The device of claim 7 , wherein the layer of adhesion material is less than 100 microns thick and the first material is deposited via evaporating deposition using electron beams. 13. A device comprising a partial power source for communication, the device comprising: a support structure; a layer of adhesion material deposited onto a first location of the support structure, wherein the layer of adhesion material defines a plurality of holes; a first material deposited onto the layer of adhesion material and over the plurality of holes such that the first material covers the plurality of holes, wherein the first material adheres to the layer of adhesion material and the plurality of holes is configured to enhance adhesion of the first material to the layer of adhesion material; a layer of transition material deposited onto a second location of the support structure; and a second material deposited onto the layer of transition material, wherein the first material and the second material a voltage potential difference when the first material and the second material come into contact with a conducting fluid. 14. The device of claim 13 , wherein the layer of adhesion material comprises a layer of gold. 15. The device of claim 13 , wherein a surface of the adhesion material is roughened to enhance adhesion property. 16. The device of claim 13 , wherein the support structure is a silicon based material.

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What does patent US10517507B2 cover?
The system of the present invention includes a conductive element, an electronic component, and a partial power source in the form of dissimilar materials. Upon contact with a conducting fluid, a voltage potential is created and the power source is completed, which activates the system. The electronic component controls the conductance between the dissimilar materials to produce a unique curren…
Who is the assignee on this patent?
Proteus Digital Health Inc
What technology area does this patent fall under?
Primary CPC classification A61B5/073. Mapped technology areas include Human Necessities.
When was this patent published?
Publication date Tue Dec 31 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).