Bendable heat plate

US10517192B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10517192-B2
Application numberUS-201815917539-A
CountryUS
Kind codeB2
Filing dateMar 9, 2018
Priority dateOct 25, 2017
Publication dateDec 24, 2019
Grant dateDec 24, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A bendable heat plate is provided. The heat plate includes a housing, a micro-structural layer and a fluid. The housing has an inner surface and an enclosed internal space, and includes a bendable section provided with a channel maintaining structure. The micro-structural layer is formed on the inner surface of the housing. The fluid is filled in the internal space. Using the channel maintaining structure, the bendable section is provided with sufficient space for the fluid to pass through.

First claim

Opening claim text (preview).

What is claimed is: 1. A bendable heat plate, comprising: a housing having an inner surface and an enclosed internal space, comprising a bendable section, wherein the housing further comprises a first end portion and a second end portion located at two opposite sides of the bendable section, and the internal space is divided into a first space correspondingly in the first end portion, a second space correspondingly in the second end portion, and a communicating space correspondingly in the bendable section, and wherein the housing is formed by a first plate and a second plate, the first plate at the bendable section is a first bending portion, and the second plate at the bendable section is a second bending portion; a micro-structural layer formed on the inner surface of the housing; and a fluid filled in the internal space; wherein the housing is provided with a channel maintaining structure at the bendable section, and wherein the micro-structural layer further comprises a plurality of micro columns arranged between the first plate and the second plate, and a height of the micro column located at the bendable section is smaller. 2. The bendable heat plate according to claim 1 , wherein the channel maintaining structure is formed on the first bending portion and away from the second bending portion, and comprises a third space in communication with the communicating space. 3. The bendable heat plate according to claim 1 , wherein the channel maintaining structure is formed on the second bending portion and away from the first bending portion, and comprises a third space in communication with the communicating space. 4. A bendable heat plate, comprising: a housing having an inner surface and an enclosed internal space, comprising a bendable section, wherein the housing further comprises a first end portion and a second end portion located at two opposite sides of the bendable section, and the internal space is divided into a first space correspondingly in the first end portion, a second space correspondingly in the second end portion, and a communicating space correspondingly in the bendable section, and wherein the housing is formed by a first plate and a second plate, the first plate at the bendable section is a first bending portion, and the second plate at the bendable section is a second bending portion; a micro-structural layer formed on the inner surface of the housing; and a fluid filled in the internal space; wherein the housing is provided with a channel maintaining structure at the bendable section, and wherein the first plate and the second plate are welded around an edge, and a welding material at the bendable section is more than that at the first end portion and the second end portion. 5. The bendable heat plate according to claim 4 , wherein the channel maintaining structure is formed on the first bending portion and away from the second bending portion, and comprises a third space in communication with the communicating space. 6. The bendable heat plate according to claim 4 , wherein the channel maintaining structure is formed on the second bending portion and away from the first bending portion, and comprises a third space in communication with the communicating space. 7. The bendable heat plate according to claim 4 , wherein the channel maintaining structure is formed between the first bending portion and the second bending portion. 8. The bendable heat plate according to claim 7 , wherein the channel maintaining structure comprises a plurality of supporting members arranged at an interval between the first bending portion and the second bending portion so as to maintain the communicating space therebetween. 9. The bendable heat plate according to claim 4 , wherein the channel maintaining structure comprises a plurality of first ribs formed on the first bending portion and a plurality of second ribs formed on the second bending portion, the first ribs are arranged at an interval and correspondingly face the second ribs, and the second ribs are arranged at an interval and correspondingly face the first ribs; when the housing is bent, the first ribs and the second ribs correspondingly press against each other to maintain the communicating space therebetween.

Assignees

Inventors

Classifications

  • by welding · CPC title

  • having particular orientation, e.g. slanted, or being orientation-independent · CPC title

  • for cooling by change of state · CPC title

  • the tubes being flexible · CPC title

  • Flexible elements · CPC title

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Frequently asked questions

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What does patent US10517192B2 cover?
A bendable heat plate is provided. The heat plate includes a housing, a micro-structural layer and a fluid. The housing has an inner surface and an enclosed internal space, and includes a bendable section provided with a channel maintaining structure. The micro-structural layer is formed on the inner surface of the housing. The fluid is filled in the internal space. Using the channel maintainin…
Who is the assignee on this patent?
Getac Technology Corp
What technology area does this patent fall under?
Primary CPC classification F28D15/0233. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Dec 24 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).