Conductive member and method for producing conductive member

US10515739B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10515739-B2
Application numberUS-201615772662-A
CountryUS
Kind codeB2
Filing dateNov 7, 2016
Priority dateNov 12, 2015
Publication dateDec 24, 2019
Grant dateDec 24, 2019

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Sufficient welding of multiple metal wires in at least a portion of a conductive member that is constituted by multiple metal wires is enabled. The conductive member includes multiple metal wires each including a metal strand and a metal covering layer formed around the metal strand, and a joined portion in which the metal wires are joined by melting of alloy portions of the metal covering layers, the alloy portions including the metal that forms the metal strands. The joined portion can be formed by joining the metal wires to each other by performing heating at a temperature higher than the melting point of the alloy portions of the metal covering layers, the alloy portions including the metal that forms the metal strands.

First claim

Opening claim text (preview).

The invention claimed is: 1. A conductive member comprising: a plurality of metal wires each including a metal strand and a metal covering layer formed of a metal that is different from the metal of the metal strand and formed around the metal strand; and a joined portion in which the plurality of metal wires are joined by melting of alloy portions of the metal covering layers and portions of the metal strands, the alloy portions including a metal that forms the metal strands. 2. The conductive member according to claim 1 , wherein the metal strands are copper, and the metal covering layers are formed by performing tin plating around the copper. 3. The conductive member according to claim 1 , wherein the joined portion is formed with a terminal shape configured to be electrically and mechanically connected to a partner conductive portion. 4. The conductive member according to claim 1 , wherein the plurality of metal wires are combined to form an elongated shape. 5. A conductive member manufacturing method comprising: (a) preparing a group of a plurality of metal wires each including a metal strand and a metal covering layer formed of a metal that is different from the metal of the metal strand and formed around the metal strand; and (b) joining the plurality of metal wires to each other by performing heating at a temperature higher than a melting point of alloy portions of the metal covering layers and portions of the metal strands, the alloy portions including a metal that forms the metal strands. 6. The conductive member manufacturing method according to claim 5 , wherein the metal strands are copper, the metal covering layers are formed by performing tin plating around the copper, and the heating temperature is a temperature higher than a melting point of a copper-tin alloy.

Assignees

Inventors

Classifications

  • H01B5/02Primary

    Single bars, rods, wires, or strips · CPC title

  • C22F1/08Primary

    of copper or alloys based thereon · CPC title

  • Flexible cables, conductors, or cords, e.g. trailing cables · CPC title

  • Alloys based on copper · CPC title

  • Ultrasonic-, H.F.-, cold- or impact welding · CPC title

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Frequently asked questions

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What does patent US10515739B2 cover?
Sufficient welding of multiple metal wires in at least a portion of a conductive member that is constituted by multiple metal wires is enabled. The conductive member includes multiple metal wires each including a metal strand and a metal covering layer formed around the metal strand, and a joined portion in which the metal wires are joined by melting of alloy portions of the metal covering laye…
Who is the assignee on this patent?
Sumitomo Wiring Systems
What technology area does this patent fall under?
Primary CPC classification H01B5/02. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Dec 24 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).