Biometric Image Sensor Packaging and Mounting
US-2015187707-A1 · Jul 2, 2015 · US
US10514798B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10514798-B2 |
| Application number | US-201615201509-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 4, 2016 |
| Priority date | Jul 3, 2015 |
| Publication date | Dec 24, 2019 |
| Grant date | Dec 24, 2019 |
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A touch panel with a fingerprint identification function includes a cover plate, a mask layer, a flexible substrate, and a fingerprint sensing array. The mask layer is disposed on the cover plate for defining an operating region and a non-operating region of the touch panel. The flexible substrate is disposed on the mask layer and at least in the non-operating region. The fingerprint sensing array is directly disposed on the flexible substrate in the non-operating region. Through the configuration that the fingerprint sensing array is disposed on the flexible substrate, the distance between the fingerprint sensing array and a user's fingers is reduced, thereby increasing the sensitivity of fingerprint identification.
Opening claim text (preview).
What is claimed is: 1. A touch panel with a fingerprint identification function, comprising: a cover plate; a mask layer disposed on the cover plate for defining an operating region and a non-operating region of the touch panel; a flexible substrate disposed on the mask layer and at least in the non-operating region; an adhesive layer configured to bond the flexible substrate with the cover plate, wherein: the flexible substrate is disposed on a diametrically opposite side of the adhesive layer relative to the cover plate, and the adhesive layer directly contacts the flexible substrate and the mask layer; a fingerprint sensing array disposed on a diametrically opposite side of the flexible substrate relative to the cover plate and directly contacting the flexible substrate in the non-operating region; and a protective layer disposed on a diametrically opposite side of the flexible substrate relative to the cover plate and directly contacting the flexible substrate, wherein: the protective layer covers the fingerprint sensing array, and the fingerprint sensing array is disposed on a diametrically opposite side of the flexible substrate relative to the mask layer. 2. The touch panel of claim 1 , wherein a thickness of the flexible substrate is in a range from 5 micrometers to 35 micrometers. 3. The touch panel of claim 1 , further comprising: a touch sensing array, wherein: the flexible substrate is disposed both in the operating region and the non-operating region, and the touch sensing array is disposed on the flexible substrate in the operating region. 4. The touch panel of claim 1 , wherein the flexible substrate is a thin film having a thickness in a range from 1 micrometer to 15 micrometers. 5. The touch panel of claim 1 , wherein: a first portion of the cover plate corresponding to the fingerprint sensing array has a first thickness, a second portion of the cover plate in the operating region has a second thickness, and the first thickness is smaller than the second thickness. 6. The touch panel of claim 5 , wherein: the cover plate comprises a first recess disposed in the non-operating region, the first recess is disposed on a diametrically opposite side of the cover plate relative to the fingerprint sensing array, and an orthographic projection of the first recess on the cover plate overlaps with an orthographic projection of the fingerprint sensing array on the cover plate. 7. The touch panel of claim 6 , wherein: the cover plate comprises a second recess disposed on a diametrically opposite side of the cover plate relative to the first recess in the non-operating region, the mask layer conforms to the second recess, and at least one portion of the flexible substrate and the fingerprint sensing array are disposed in the second recess and conform to the second recess. 8. The touch panel of claim 1 , wherein the fingerprint sensing array is formed from at least one patterned conductive layer. 9. The touch panel of claim 1 , wherein the protective layer directly contacts the fingerprint sensing array. 10. A method for fabricating a touch panel with a fingerprint identification function, the method comprising: disposing a mask layer on a cover plate for defining an operating region and a non-operating region of the touch panel; forming a conductive layer on a flexible substrate; patterning the conductive layer to form a fingerprint sensing array on the flexible substrate; forming a protective layer directly on the flexible substrate to cover the fingerprint sensing array; and bonding the flexible substrate with the cover plate, wherein, after bonding the flexible substrate with the cover plate: the fingerprint sensing array is disposed on a diametrically opposite side of the flexible substrate relative to the mask layer in the non-operating region of the touch panel, the fingerprint sensing array is disposed on a diametrically opposite side of the flexible substrate relative to the cover plate, and the protective layer is disposed on a diametrically opposite side of the flexible substrate relative to the cover plate. 11. The method of claim 10 , wherein: the flexible substrate is a thin film, and bonding the flexible substrate with the cover plate is performed by attaching an adhesion layer between the mask layer and the flexible substrate. 12. The method of claim 10 , wherein patterning the conductive layer comprises: forming a touch sensing array on the flexible substrate, wherein the touch sensing array is disposed in the operating region after the cover plate is bonded with the flexible substrate. 13. The method of claim 10 , further comprising: forming the flexible substrate on a plate before the conductive layer is formed on the flexible substrate; and separating the flexible substrate from the plate after the conductive layer is patterned. 14. The method of claim 10 , further comprising: forming the flexible substrate on a plate before the conductive layer is formed on the flexible substrate; forming a protective layer on the fingerprint sensing array after the conductive layer is patterned; and separating the flexible substrate from the plate before the cover plate is bonded with the flexible substrate, wherein bonding the flexible substrate with the cover plate is performed by bonding a side of the flexible substrate with the cover plate. 15. The method of claim 10 , further comprising: forming a first recess on the cover plate in the non-operating region, wherein: the first recess is disposed on a diametrically opposite side of the cover plate relative to the fingerprint sensing array, and a orthographic projection of the first recess on the cover plate overlaps with a projection of the fingerprint sensing array on the cover plate. 16. The method of claim 15 , further comprising: forming a second recess on a diametrically opposite side of the cover plate relative to the first recess in the non-operating region, wherein bonding the flexible substrate with the cover plate comprises: attaching the flexible substrate and the fingerprint sensing array in the second recess, wherein the flexible substrate and the fingerprint sensing array conform to the second recess. 17. A touch panel with a fingerprint identification function, comprising: a cover plate; a mask layer disposed on the cover plate for defining an operating region and a non-operating region of the touch panel; a flexible substrate disposed on a diametrically opposite side of the mask layer relative to the cover plate at least in the non-operating region; a fingerprint sensing array disposed on a side of the flexible substrate facing to the cover plate and directly contacting the flexible substrate; and an adhesive layer, wherein: the adhesive layer is disposed on a diametrically opposite side of the flexible substrate relative to the mask layer, and the adhesive layer directly contacts the flexible substrate, the fingerprint sensing array and the mask layer. 18. The touch panel of claim 17 , wherein: the cover plate comprises a first recess disposed in the non-operating region, the first recess is disposed on a diametrically opposite side of the cover plate relative to the fingerprint sensing array, and an orthographic projection of the first recess on the cover plate overlaps with an orthographic projection of the fingerprint sensing array on the cover plate. 19. The touch panel of claim 17 , wherein: a first portion of the cover plate has a first thickness, a seco
Control or interface arrangements specially adapted for digitisers · CPC title
Physics · mapped topic
non-optical, e.g. ultrasonic or capacitive sensing · CPC title
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