Electronic part housing structure

Patent metadata

Field	Value
Publication number	US-10512197-B2
Application number	US-201816101571-A
Country	US
Kind code	B2
Filing date	Aug 13, 2018
Priority date	Feb 23, 2018
Publication date	Dec 17, 2019
Grant date	Dec 17, 2019

Abstract

A power converting device includes a heat sink including a heat sink base portion on an upper face side of which a depressed portion forming a refrigerant channel is provided and a heat sink upper plate covering the depressed portion of the heat sink base portion, wherein the refrigerant channel is sealed using a channel seal provided in an outer peripheral portion of the heat sink upper plate, an upper case caused to cover an upper face side of the heat sink, a lower case caused to cover a lower face side of the heat sink, and a terminal block forming a waterproofing wall that encloses a power module projecting from an upper face of the heat sink upper plate between the power module on the heat sink upper plate and the channel seal in the upper case.

First claim

What is claimed is:

1. An electronic part housing structure, comprising:
a heat sink including a heat sink base portion on an upper face side of which a depressed portion forming a refrigerant channel is provided and a heat sink upper plate caused to cover the depressed portion of the heat sink base portion, wherein the refrigerant channel is sealed using a seal portion provided in an outer peripheral portion of the heat sink upper plate;
an upper case caused to cover an upper face side of the heat sink;
an electronic part mounted on an upper face of the heat sink upper plate; and
a waterproofing wall provided between the electronic part and the seal portion in an internal space of the upper case and protruding from the upper face of the heat sink upper plate so as to enclose the electronic part.

2. The electronic part housing structure according to claim 1 , wherein the waterproofing wall is of a configuration including a sealing member provided in contact with the upper face of the heat sink upper plate, and a wall face portion provided so as to extend upward from the sealing member.

3. The electronic part housing structure according to claim 2 , wherein the wall face portion is provided to a height that does not interfere with an electronic part disposed in an internal space ceiling portion of the upper case, and includes a waterproofing cave protruding outward from an outer face upper portion of the wall face portion.

4. The electronic part housing structure according to claim 3 , wherein a conductive wiring portion is provided in an outer face portion of the wall face portion, and the wiring portion is disposed in a position higher than the waterproofing eave.

5. The electronic part housing structure according to claim 1 , comprising:
a lower case caused to cover a lower face side of the heat sink; and
a linking hole portion positioned on an outer side of the waterproofing wall, provided penetrating the heat sink base portion in a vertical direction, and linking internal spaces of the upper case and the lower case, wherein
a low voltage electronic part to which is applied a voltage lower than a voltage applied to the electronic part mounted on the upper face of the heat sink upper plate is mounted on an outer side of the waterproofing wall in a position in proximity to the linking hole portion.

6. The electronic part housing structure according to claim 1 , comprising:
a lower case caused to cover a lower face side of the heat sink; and
a linking hole portion positioned on an outer side of the waterproofing wall, provided penetrating the heat sink base portion in a vertical direction, and linking internal spaces of the upper case and the lower case, wherein
a low voltage electronic part to which is applied a voltage lower than a voltage applied to the electronic part mounted on the upper face of the heat sink upper plate is mounted on an outer side of the waterproofing wall in a position lower than the linking hole portion.

7. The electronic part housing structure according to claim 6 , wherein the low voltage electronic part is disposed in a bottom face portion of the lower case.

8. The electronic part housing structure according to claim 1 , wherein the seal portion is disposed so as to singly enclose the outer peripheral portion of the heat sink upper plate.

9. The electronic part housing structure according to claim 8 , wherein the seal portion is provided so as to have a width of 3 mm or less.

10. The electronic part housing structure according to claim 1 , wherein the heat sink base portion includes a columnar support portion protruding from an internal bottom face of the depressed portion and in contact with a face of the heat sink upper plate forming the refrigerant channel.

11. The electronic part housing structure according to claim 1 applied to a power converting device.

12. The electronic part housing structure according to claim 11 , wherein the electronic part disposed in the internal space ceiling portion of the upper case is a smoothing capacitor or a discharge resistor configuring the power converting device.

13. The electronic part housing structure according to claim 12 , wherein an electronic part to which is applied a voltage higher than that applied to a low voltage electronic part disposed in an internal space bottom face portion of the lower case caused to cover the lower face side of the heat sink is disposed in a position higher than the internal space bottom face portion of the lower case.

14. The electronic part housing structure according to claim 13 , wherein a position higher than the internal space bottom face portion of the lower case corresponds to a depressed portion provided in a lower face of the heat sink base portion forming an internal space ceiling portion of the lower case, or to a stepped portion provided protruding upward from the internal space bottom face portion.

15. The electronic part housing structure according to claim 13 , wherein the electronic part disposed in a position higher than the internal space bottom face portion of the lower case is a direct current input terminal, a three-phase output terminal, a reactor, or a step-down converter configuring the power converting device.

16. The electronic part housing structure according to claim 13 , wherein the low voltage electronic part disposed in the internal space bottom face portion of the lower case is a control substrate or a control signal connector.

Assignees

• Mitsubishi Electric Corp

Inventors

• Ishibashi Satoshi
• Kuramoto Yuji
• Watanabe Toshio

Classifications

• H10W40/47

  by flowing liquids, e.g. forced water cooling · CPC title

• H05K7/20927

  Liquid coolant without phase change · CPC title

• H02K11/33 Primary

  Drive circuits, e.g. power electronics (H02K11/38 takes precedence) · CPC title

• H05K7/2089 Primary

  for power electronics, e.g. for inverters for controlling motor · CPC title

• H05K5/06

  Hermetically-sealed casings {(specially adapted for small components H05K5/0095)} · CPC title