Power thermal awareness solution

Patent metadata

Field	Value
Publication number	US-10512196-B2
Application number	US-201515553821-A
Country	US
Kind code	B2
Filing date	May 27, 2015
Priority date	Mar 27, 2015
Publication date	Dec 17, 2019
Grant date	Dec 17, 2019

Abstract

One embodiment provides an apparatus. The apparatus includes power thermal awareness solution (PTAS) logic to select a model from a plurality of models based, at least in part, on a configuration of a cooling zone; and determine a cooling zone volumetric airflow based, at least in part, on the selected model.

First claim

What is claimed is:

1. An apparatus comprising:
power thermal awareness solution (PTAS) circuitry to:
receive information regarding a configuration for each of a plurality of cooling zones, each cooling zone including at least one fan, each cooling zone is associated with one or more devices;
initiate a test procedure that includes:
set a range of pulse width modulation (PWM) duty cycles for each fan in each cooling zone;
determine, for each PWM duty cycle, a fan speed for each fan in each cooling zone; and
determine, for each PWM duty cycle, a measured volumetric air flow associated with each cooling zone; and

for each cooling zone,
select an airflow prediction model from a plurality of airflow prediction models based at least in part on the measured volumetric airflow information for each cooling zone; and
determine, during operation of each cooling zone and the associated one or more device, an operational volumetric airflow based at least in part on the selected airflow prediction model for the cooling zone; and

cause a workload assigned to at least one of the one or more devices to be modified based on the operational volumetric airflow of each cooling zone.

2. The apparatus of claim 1 , wherein the PTAS circuitry is further to identify the configuration of at least one of the plurality of cooling zones.

3. The apparatus of claim 1 , wherein the PTAS circuitry is further to determine a cooling zone outlet temperature for each cooling zone based at least in part on the operational volumetric airflow for that cooling zone.

4. The apparatus of claim 1 , wherein the PTAS circuitry is further to determine a power consumption associated with each cooling zone.

5. A method comprising:
receiving, by power thermal awareness solution (PTAS) circuitry, information regarding a configuration for each of a plurality of cooling zones, each cooling zone including at least one fan, each cooling zone associated with one or more devices;
initiating, by the PTAS circuitry, a test procedure that includes:
set a range of pulse width modulation (PWM) duty cycles for each fan in each cooling zone;
determine, for each PWM duty cycle, a fan speed for each fan in each cooling zone; and
determine, for each PWM duty cycle, a measured volumetric airflow associated with each cooling zone; and

selecting, by the PTAS circuitry, an airflow prediction model from a plurality of airflow prediction models for each cooling zone based at least in part on the measured volumetric airflow information for each cooling zone;
determining, by the PTAS circuitry, during operation of each cooling zone and the associated one or more device, an operational volumetric airflow for each cooling zone based at least in part on the selected airflow prediction model; and
causing, by the PTAS circuitry, a workload assigned to at least one of the one or more devices to be modified based on the operational volumetric airflow of each cooling zone.

6. The method of claim 5 , further comprising identifying, by the PTAS circuitry, the configuration of each cooling zone.

7. The method of claim 5 , further comprising determining, by the PTAS circuitry, a cooling zone outlet temperature for each cooling zone based at least in part on the volumetric airflow.

8. The method of claim 5 , further comprising determining, by the PTAS circuitry, a power consumption associated with each cooling zone.

9. The method of claim 8 , wherein the power consumption is related to an exponential moving average of a series of measured power consumption values.

10. A system comprising:
a plurality of cooling zones, each cooling zone comprising at least one rack element and a fan zone comprising at least one fan; and
a rack management controller (RMC) comprising:
power thermal awareness solution (PTAS) circuitry to:
receive information regarding a configuration of each of the plurality of cooling zones, each cooling zone is associated with one or more devices;
initiate a test procedure that includes:
set a range of pulse width modulation (PWM) duty cycles for each fan in each cooling zone;
determine, for each PWM duty cycle, a fan speed for each fan in each cooling zone; and
determine, for each PWM duty cycle, a measured volumetric airflow associated with each cooling zone; and

select, for each cooling zone, an airflow prediction model from a plurality of airflow prediction models based at least in part on the measured volumetric airflow information for each cooling zone,
determine, during operation of each cooling zone and the associated one or more device, an operational volumetric airflow for each cooling zone based at least in part on the selected airflow prediction model; and
cause a workload assigned to at least one of the one or more devices to be modified based on the operational volumetric airflow for each cooling zone.

11. The system of claim 10 , wherein the PTAS circuitry is further to identify the configuration of each cooling zone.

12. The system of claim 10 , wherein the PTAS circuitry is further to determine a cooling zone outlet temperature for each cooling zone based at least in part on the operational volumetric airflow.

13. The system of claim 10 , wherein the PTAS circuitry is further to determine a power consumption associated with each cooling zone.

14. The system of claim 10 , wherein the at least one rack element comprises one or more of a compute component, a storage component, a networking component and a memory component.

15. The system of claim 10 , wherein the selected airflow prediction model is related to a number of fan zones.

Assignees

• Intel Corp

Inventors

• Song Chuan
• Ahuja Nishi
• Gong Haifeng

Classifications

• G06F1/206

  comprising thermal management · CPC title

• G05B13/04

  involving the use of models or simulators · CPC title

• H05K7/20836 Primary

  Thermal management, e.g. server temperature control · CPC title

• H05K7/20736

  within cabinets for removing heat from server blades · CPC title

• Y02D10/16

  Cross-Sectional Technologies · mapped topic