Conductive structure and manufacturing method therefor

Patent metadata

Field	Value
Publication number	US-10512160-B2
Application number	US-201615571465-A
Country	US
Kind code	B2
Filing date	Jun 1, 2016
Priority date	Jun 3, 2015
Publication date	Dec 17, 2019
Grant date	Dec 17, 2019

Abstract

The present specification relates to a conductive structure body and a method for manufacturing the same.

First claim

The invention claimed is:

1. A conductive structure body comprising:
a substrate; and
a conductive line configuring a screen part, a wiring part, and a pad part provided on the substrate,
wherein the conductive line includes a first metal layer, a light reflection reducing layer provided on the first metal layer, and a second metal layer provided on the light reflection reducing layer,
wherein the light reflection reducing layer includes metal oxynitride, and
wherein a thickness of the second metal layer is 6 nm or more and less than 10 nm,
wherein the screen part includes a conductive pattern including a plurality of openings and the conductive line partitioning the openings, and
wherein a line gap between adjacent conductive lines in the conductive line configuring the screen part is 0.1 μm or more and 100 μm or less; and
wherein a thickness of the first metal layer is 10 nm or more and 1 μm or less.

2. The conductive structure body of claim 1 , wherein the metal oxynitride is aluminum oxynitride.

3. The conductive structure body of claim 2 , wherein in the aluminum oxynitride, a value of Equation 1 below satisfies 1 or more and 2 or less:

3
⁢

Al

at
⁢

⁢
%

2
⁢

O

at
⁢

⁢
%

+

3
⁢

N

at
⁢

⁢
%

[

Equation
⁢

⁢
1

]

in Equation 1, N at % means the element content of nitrogen atoms with respect to the aluminum oxynitride, Al at % means the element content of aluminum atoms with respect to the aluminum oxynitride, and O at % means the element content of oxygen atoms with respect to the aluminum oxynitride.

4. The conductive structure body of claim 1 , wherein the second metal layer includes at least one metal of Al, Cu, Co, Ag, Mo, Ti, Ni, Mn, and Cr.

5. The conductive structure body of claim 1 , wherein a light reflectivity of the second metal layer is 40% or less in a wavelength of 550 nm.

6. The conductive structure body of claim 1 , wherein the light reflectivity of the conductive line is 40% or less.

7. The conductive structure body of claim 1 , wherein a specific resistance of the second metal layer is 10 −6 Ωcm or more and 10 −4 Ωcm or less.

8. The conductive structure body of claim 1 , further comprising:
a flexible printed circuit board (FPCB) on the conductive line configuring the pad part.

9. The conductive structure body of claim 8 , further comprising:
an anisotropic conductive film (ACF) between the conductive line configuring the pad part and the FPCB.

10. The conductive structure body of claim 1 , wherein a line width of the conductive line configuring the screen part is 0.1 μm or more and 100 μm or less.

11. A method for manufacturing a conductive structure body of claim 1 , the method comprising:
preparing a substrate;
forming a first metal layer on the substrate;
forming a light reflection reducing layer on the first metal layer;
forming a second metal layer on the light reflection reducing layer;
forming a conductive line configuring a screen part, a wiring part, and a pad part by patterning the first metal layer, the light reflection reducing layer, and the second metal layer, wherein a thickness of the second metal layer is 6 nm or more and less than 10 nm, and
wherein the screen part includes a conductive pattern including a plurality of openings and the conductive line partitioning the openings, and
wherein a line gap between adjacent conductive lines in the conductive line configuring the screen part is 0.1 μm or more and 100 μm or less; and
wherein a thickness of the first metal layer is 10 nm or more and 1 μm or less.

12. The method of claim 11 , wherein in the patterning, the first metal layer, the light reflection reducing layer, and the second metal layer are simultaneously patterned.

13. A display device comprising the conductive structure body of claim 1 .

14. A touch panel comprising the conductive structure body of claim 1 .

Assignees

• Lg Chemical Ltd

Inventors

• Lee Ilha
• Kim Ki-Hwan
• Jang Song Ho
• Park Jin Woo
• Park Chan Hyoung

Classifications

• G06F3/04164

  Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads · CPC title

• G06F3/045

  using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact · CPC title

• G06F2203/04103

  Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices · CPC title

• G06F2203/04102

  Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper · CPC title

• H05K1/09

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title