Optical devices, in particular computational cameras, and methods for manufacturing the same
US-9634051-B2 · Apr 25, 2017 · US
Optoelectronic modules including optoelectronic device subassemblies and methods of manufacturing the same
US10510932B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10510932-B2 |
| Application number | US-201916275422-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 14, 2019 |
| Priority date | Jun 29, 2016 |
| Publication date | Dec 17, 2019 |
| Grant date | Dec 17, 2019 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
The present disclosure describes wafer-level processes for fabricating optoelectronic device subassemblies that can be mounted, for example, to a circuit substrate, such as a flexible cable or printed circuit board, and integrated into optoelectronic modules that include one or more optical subassemblies stacked over the optoelectronic device subassembly. The optoelectronic device subassembly can be mounted onto the circuit substrate using solder reflow technology even if the optical subassemblies are composed of materials that are not reflow compatible.
First claim
Opening claim text (preview).
What is claimed is: 1. A method of manufacturing an optoelectronic module, the method comprising: mounting a singulated optoelectronic device subassembly onto a circuit substrate using solder reflow technology; and subsequently attaching one or more optical subassemblies to the optoelectronic device subassembly that is mounted on the circuit substrate. 2. The method of claim 1 wherein the one or more optical subassemblies are composed of materials that are not reflow compatible. 3. The method of claim 1 wherein mounting a singulated one of the optoelectronic device subassemblies onto a circuit substrate includes mounting the singulated optoelectronic device subassembly onto a flexible cable. 4. The method of claim 1 wherein mounting a singulated one of the optoelectronic device subassemblies onto a circuit substrate is performed at a temperature of at least 260° C. 5. The method of claim 1 wherein attaching one or more optical subassemblies to the optoelectronic device subassembly includes attaching at least two optical subassemblies in a stack over the optoelectronic device subassembly mounted on the circuit substrate. 6. The method of claim 5 wherein the at least two optical subassemblies include a light guide and at least one optical diffuser or IR absorber. 7. A method of manufacturing an optoelectronic module, the method comprising: mounting an optoelectronic device subassembly onto a circuit substrate; and subsequently attaching one or more optical subassemblies to the optoelectronic device subassembly that is mounted on the circuit substrate, wherein the one or more optical subassemblies include at least one optical diffuser or IR absorber. 8. The method of claim 7 wherein attaching one or more optical subassemblies to the optoelectronic device subassembly includes placing at least one of the optical subassemblies onto a ledge of the optoelectronic device subassembly. 9. The method of claim 7 wherein attaching one or more optical subassemblies to the optoelectronic device subassembly includes placing a first optical subassembly onto a first ledge of the optoelectronic device subassembly and placing a second optical subassembly onto a second ledge of the optoelectronic device subassembly. 10. The method of claim 7 wherein mounting the singulated optoelectronic device subassembly onto the circuit substrate includes using solder reflow technology, and wherein the one or more optical subassemblies are composed of materials that are not reflow compatible. 11. The method of claim 7 wherein the one or more optical subassemblies include a dielectric filter. 12. The method of claim 7 wherein the one or more optical subassemblies include an interference filter. 13. The method of claim 7 wherein the one or more optical subassemblies include a diffuser foil. 14. The method of claim 7 wherein the one or more optical subassemblies include a light guide. 15. The method of claim 7 wherein the one or more optical subassemblies include an IR absorber.
Assignees
Inventors
Classifications
Die-attach connectors and bond wires · CPC title
- H10W90/00Primary
Package configurations · CPC title
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US10510932B2 cover?
- The present disclosure describes wafer-level processes for fabricating optoelectronic device subassemblies that can be mounted, for example, to a circuit substrate, such as a flexible cable or printed circuit board, and integrated into optoelectronic modules that include one or more optical subassemblies stacked over the optoelectronic device subassembly. The optoelectronic device subassembly c…
- Who is the assignee on this patent?
- Ams Sensors Singapore Pte Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10W90/00. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Dec 17 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).