Monolithic ceramic electronic component and method for manufacturing the same
US-2015213959-A1 · Jul 30, 2015 · US
US10510496B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10510496-B2 |
| Application number | US-201816158331-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 12, 2018 |
| Priority date | Jul 16, 2015 |
| Publication date | Dec 17, 2019 |
| Grant date | Dec 17, 2019 |
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A multilayer ceramic capacitor includes a multilayer body that includes ceramic layers and inner conductor layers arranged in a stacking direction and that includes a first surface in which the inner conductor layers are exposed, and an outer electrode on the first surface of the multilayer body. The inner conductor layers contain Ni. The outer electrode includes a base layer that directly covers at least a portion of the first surface and is connected to the inner conductor layers. The base layer contains a metal and glass and includes a Ni diffusion portion connected to the inner conductor layers, the Ni diffusion portion containing Ni. A ratio of a diffusion depth of the Ni diffusion portion to a thickness of the base layer is smaller on two of the inner conductor layers that are located outermost than on other inner conductor layers.
Opening claim text (preview).
What is claimed is: 1. A method for making a multilayer ceramic capacitor, the method comprising: a step of applying a conductive paste containing Cu powder to a first surface of a multilayer body that includes a plurality of ceramic layers and a plurality of inner conductor layers arranged in a stacking direction, the inner conductor layers being exposed at the first surface; and a step of baking the conductive paste on the first surface; wherein the Cu powder has an average particle diameter of about 0.5 μm or more and about 2.0 μm or less; and in the step of baking the conductive paste, water is added to a baking atmosphere while a peak temperature is maintained. 2. The method for making a multilayer ceramic capacitor according to claim 1 , wherein, in the step of baking the conductive paste, water is added in a later stage of a period during which the peak temperature is maintained. 3. The method for making a multilayer ceramic capacitor according to claim 1 , wherein the conductive paste further contains glass, and the average particle diameter of the Cu powder is smaller than an average particle diameter of the glass.
Stacked capacitors (H01G4/33 takes precedence) · CPC title
Fried electrodes · CPC title
Apparatus or processes for applying terminals · CPC title
Ceramic dielectrics {(H01G4/085 takes precedence)} · CPC title
characterised by the material of the terminals · CPC title
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