Multilayer ceramic electronic component

Patent metadata

Field	Value
Publication number	US-10510486-B2
Application number	US-201715822654-A
Country	US
Kind code	B2
Filing date	Nov 27, 2017
Priority date	Nov 28, 2016
Publication date	Dec 17, 2019
Grant date	Dec 17, 2019

Abstract

A multilayer ceramic electronic component includes a multilayer body that includes a second main surface defining and functioning as a mounting surface. Outer electrodes include underlying electrode layers including a conductive metal and a glass component and conductive resin layers including a thermosetting resin and a metal component. The underlying electrode layers extend from first and second end surfaces onto at least the second main surface. The conductive resin layers extend onto the underlying electrode layers provided on the second main surface, portions of the second main surface, and portions of the underlying electrode layers provided on the first end surface and the second end surface and cover portions of the first and second end surfaces, the portions including areas corresponding to about 9% or more and about 82% or less of areas of the first and the second end surfaces.

First claim

What is claimed is:

1. A multilayer ceramic electronic component comprising:
a multilayer body that includes a plurality of dielectric layers and a plurality of inner electrode layers, the dielectric layers and the inner electrode layers being laminated, and that includes first and second main surfaces opposite to each other in a lamination direction, first and second side surfaces opposite to each other in a width direction perpendicular or substantially perpendicular to the lamination direction, and first and second end surfaces opposite to each other in a longitudinal direction perpendicular or substantially perpendicular to the lamination direction and the width direction;
a first outer electrode provided on the first end surface; and
a second outer electrode provided on the second end surface; wherein
the second main surface of the multilayer body defines and functions as a mounting surface;
the first outer electrode includes a first underlying electrode layer and a first conductive resin layer;
the second outer electrode includes a second underlying electrode layer and a second conductive resin layer;
the first underlying electrode layer and the second underlying electrode layer each include a conductive metal and a glass component;
the first conductive resin layer and the second conductive resin layer each include a thermosetting resin and a metal component;
the first underlying electrode layer extends from the first end surface onto at least the second main surface;
the second underlying electrode layer extends from the second end surface onto at least the second main surface;
the first conductive resin layer extends onto the first underlying electrode layer provided on the second main surface, directly onto a portion of the second main surface, and onto a portion of the first underlying electrode layer provided on the first end surface;
the second conductive resin layer extends onto the second underlying electrode layer provided on the second main surface, directly onto a portion of the second main surface, and onto a portion of the second underlying electrode layer provided on the second end surface; and
a shape of the first conductive resin layer is different from a shape of the second conductive resin layer.

2. The multilayer ceramic electronic component according to claim 1 , wherein
the first conductive resin layer provided on the portion of the first underlying electrode layer provided on the first end surface covers a portion of the first end surface, the portion of the first end surface including an area corresponding to about 9% or more and about 82% or less of an area of the first end surface; and
the second conductive resin layer provided on the portion of the second underlying electrode layer provided on the second end surface covers a portion of the second end surface, the portion of the second end surface including an area corresponding to about 9% or more and about 82% or less of an area of the second end surface.

3. The multilayer ceramic electronic component according to claim 1 , wherein the metal component includes a Cu powder or a Ag powder.

4. The multilayer ceramic electronic component according to claim 1 , wherein a plating layer is provided on the first and second underlying electrode layers and the first and second conductive resin layers.

5. The multilayer ceramic electronic component according to claim 1 , wherein the multilayer body includes a rectangular parallelepiped or a substantially rectangular parallelepiped shape.

6. The multilayer ceramic electronic component according to claim 1 , wherein corner portions defined by an intersection of one of the first and second main surfaces, one of the first and second side surfaces, and one of first and second end surfaces includes a rounded shape.

7. The multilayer ceramic electronic component according to claim 1 , wherein ridge portions defined by an intersection between any two of the first and second main surfaces, the first and second side surfaces, and the first and second end surfaces includes a rounded shape.

8. The multilayer ceramic electronic component according to claim 1 , wherein a material of each of the plurality of dielectric layers includes a dielectric ceramic.

9. The multilayer ceramic electronic component according to claim 1 , wherein
the plurality of dielectric layers includes a first outer layer portion located closest to the first main surface and a second outer layer portion located closest to the second main surface;
the plurality of dielectric layers includes an inner layer portion located between the first outer layer portion and the second outer layer portion; and
each of the plurality of dielectric layers of the inner layer portion is thinner than either of the first outer portion and the second outer layer portion.

10. The multilayer ceramic electronic component according to claim 1 , wherein the plurality of inner electrode layers includes a plurality of first inner electrode layers and a plurality of second inner electrode layers that are alternately provided in the lamination direction.

11. The multilayer ceramic electronic component according to claim 10 , wherein
each of the plurality of first inner electrode layers includes a first facing-electrode portion and a first extended electrode portion;
each of the plurality of second inner electrode layers includes a second facing-electrode portion and a second extended electrode portion;
the first facing-electrode portions and the second facing-electrode portions at least partially overlap one another in a lamination direction;
each of the first extended electrode portions extends to and is exposed at the first end surface of the multilayer body; and
each of the second extended electrode portions extends to and is exposed at the second end surface of the multilayer body.

12. The multilayer ceramic electronic component according to claim 1 , wherein a percentage of an area of one of the plurality of inner electrode layers covering one of the plurality of dielectric layers, viewed from the lamination direction, is between about 50% and about 95%.

13. The multilayer ceramic electronic component according to claim 1 , wherein the thermosetting resin of each of the first conductive resin layer and the second conductive resin layer is an epoxy resin.

14. The multilayer ceramic electronic component according to claim 1 , wherein a content of the conductive filler in each of the first conductive resin layer and the second conductive resin layer is between about 35% and about 75%, by volume, of a total volume of the first conductive resin layer and the second conductive resin layer.

15. The multilayer ceramic electronic component according to claim 1 , wherein at least one of the first conductive resin layer and the second conductive resin layer includes a rectangular or substantially rectangular shape.

16. The multilayer ceramic electronic component according to claim 1 , wherein at least one of the first conductive resin layer and the second conductive resin layer includes a triangular or substantially triangular shape.

17. The multilayer ceramic electronic component according to claim 1 , wherein at least one of the first conductive resin layer and the second conductive resin layer includes a curved shape.

18. The multilayer ceramic electronic component according to claim 17 , wherein the curved shape is a fan shape.

19. The multilayer ceramic electronic component according to claim 1 , wherein at least one of the first conductive resin layer and the secon

Assignees

• Murata Manufacturing Co

Inventors

• Yamada Mayumi

Classifications

• H01G2/065

  for surface mounting, e.g. chip capacitors · CPC title

• H01G4/12 Primary

  Ceramic dielectrics {(H01G4/085 takes precedence)} · CPC title

• H01G4/232 Primary

  electrically connecting two or more layers of a stacked or rolled capacitor · CPC title

• H01G4/2325 Primary

  characterised by the material of the terminals · CPC title

• H01G4/30

  Stacked capacitors (H01G4/33 takes precedence) · CPC title