Electronic device housing
US-2018260003-A1 · Sep 13, 2018 · US
US10509443B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10509443-B2 |
| Application number | US-201615760478-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 6, 2016 |
| Priority date | Sep 18, 2015 |
| Publication date | Dec 17, 2019 |
| Grant date | Dec 17, 2019 |
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A housing includes: a bottom cover; a top cover; and a reinforcing structure that is disposed in a space divided by the bottom cover and the top cover and has a flat portion, a rising wall member erected on a rim of the flat portion, and a joining portion extending from a rim of the rising wall member, or a curved portion, and a joining portion extending from a rim of the curved portion, the joining portion of the reinforcing structure being joined to the bottom cover or the top cover. The area of the joining portion is within a range of 10 cm2 or more and 100 cm2 or less, and the maximum value of the height of the reinforcing structure is within a range of 3 mm or more and 30 mm or less.
Opening claim text (preview).
The invention claimed is: 1. A housing comprising: a bottom cover; a top cover; and a reinforcing structure that is disposed in a space divided by the bottom cover and the top cover and has a flat portion, a rising wall member erected on a rim of the flat portion, and a joining portion extending from a rim of the rising wall member, or a curved portion, and a joining portion extending from a rim of the curved portion, the joining portion of the reinforcing structure being joined to the bottom cover or the top cover, wherein the area of the joining portion is within a range of 10 cm 2 or more and 100 cm 2 or less, and the maximum value of the height of the reinforcing structure is within a range of 3 mm or more and 30 mm or less, and wherein the flat portion of the reinforcing structure is arranged apart from the bottom cover and the top cover. 2. The housing according to claim 1 , wherein the projected area of the reinforcing structure in a direction of the bottom cover or the top cover to which the joining portion is joined is within a range of 60% or more and 95% or less of the area of the bottom cover or the top cover to which the joining portion is joined. 3. The housing according to claim 1 , wherein the volume of a hollow structure formed by joining the joining portion to the bottom cover or the top cover is within a range of 55% or more and 95% or less of the volume of the space. 4. The housing according to claim 1 , wherein the reinforcing structure is bonded to the bottom cover or the top cover by thermal welding. 5. The housing according to claim 1 , wherein the reinforcing structure is joined to the bottom cover or the top cover in such a manner that the peeling load at 23° C. is within a range of 60 N/cm 2 or more and 5000 N/cm 2 or less, and the peeling load at 200° C. is within a range of less than 60 N/cm 2 . 6. The housing according to claim 1 , wherein the reinforcing structure, and the bottom cover or the top cover to which the reinforcing structure is joined are formed of a fiber-reinforced composite material, a thermoplastic resin is provided in or on a joining portion of at least one of the reinforcing structure and the top cover or the bottom cover to which the reinforcing structure is joined, and the reinforcing structure and the bottom cover or the top cover are joined with the thermoplastic resin. 7. The housing according to claim 1 , comprising a heat generation member disposed on a surface of the reinforcing structure in the hollow structure formed by joining the reinforcing structure and the bottom cover or the top cover. 8. The housing according to claim 1 , comprising another reinforcing structure in the hollow structure formed by joining the reinforcing structure and the bottom cover or the top cover. 9. The housing according to claim 8 , wherein an electronic component is disposed in a space other than the hollow structure. 10. The housing according to claim 1 , wherein no other reinforcing structure is arranged between the reinforcing structure and the bottom cover or the top cover to which the joining portion is not joined. 11. A housing comprising: a bottom cover; a top cover; and a reinforcing structure that is disposed in a space divided by the bottom cover and the top cover and has an opening, the reinforcing structure having a rim, the rim being joined to the bottom cover or the top cover, wherein the projected area of the reinforcing structure in a direction of the bottom cover or the top cover to which the rim of the reinforcing structure is joined is within a range of 60% or more and 95% or less of the area of the bottom cover or the top cover to which the rim of the reinforcing structure is joined, and wherein the flat portion of the reinforcing structure is arranged apart from the bottom cover and the top cover. 12. The housing according to claim 11 , wherein the volume of a hollow structure formed by joining the rim to the bottom cover or the top cover is within a range of 55% or more and 95% or less of the volume of the space. 13. The housing according to claim 11 , wherein the reinforcing structure is bonded to the bottom cover or the top cover by thermal welding. 14. The housing according to claim 11 , wherein the reinforcing structure is joined to the bottom cover or the top cover in such a manner that the peeling load at 23° C. is within a range of 60 N/cm 2 or more and 5000 N/cm 2 or less, and the peeling load at 200° C. is within a range of less than 60 N/cm 2 . 15. The housing according to claim 11 , wherein the reinforcing structure, and the bottom cover or the top cover to which the reinforcing structure is joined are formed of a fiber-reinforced composite material, a thermoplastic resin is provided in or on a joining portion of at least one of the reinforcing structure and the top cover or the bottom cover to which the reinforcing structure is joined, and the reinforcing structure and the bottom cover or the top cover are joined with the thermoplastic resin. 16. The housing according to claim 11 , comprising a heat generation member disposed on a surface of the reinforcing structure in the hollow structure formed by joining the reinforcing structure and the bottom cover or the top cover. 17. The housing according to claim 11 , comprising another reinforcing structure in the hollow structure formed by joining the reinforcing structure and the bottom cover or the top cover. 18. The housing according to claim 17 , wherein an electronic component is disposed in a space other than the hollow structure. 19. The housing according to claim 11 , wherein no other reinforcing structure is arranged between the reinforcing structure and the bottom cover or the top cover to which the joining portion is not joined. 20. A housing comprising: a bottom cover; a top cover; and a reinforcing structure that is disposed in a space divided by the bottom cover and the top cover and has an opening, the reinforcing structure having a rim, the rim being joined to the bottom cover or the top cover, wherein the volume of a hollow structure formed by joining the rim of the reinforcing structure to the bottom cover or the top cover is within a range of 55% or more and 95% or less of the volume of the space, in the above-described invention, and wherein the flat portion of the reinforcing structure is arranged apart from the bottom cover and the top cover. 21. The housing according to claim 20 , wherein the reinforcing structure is bonded to the bottom cover or the top cover by thermal welding. 22. The housing according to claim 20 , wherein the reinforcing structure is joined to the bottom cover or the top cover in such a manner that the peeling load at 23° C. is within a range of 60 N/cm 2 or more and 5000 N/cm 2 or less, and the peeling load at 200° C. is within a range of less than 60 N/cm 2 . 23. The housing according to claim 20 , wherein the reinforcing structure, and the bottom cover or the top cover to which the reinforcing structure is joined are formed of a fiber-reinforced composite material, a thermoplastic resin is provided in or on a joining portion of at least one of the reinforcing structure and the top cover or the bottom cover to which the reinforcing structure is joined, and the reinforcing structure and the bottom cover or the top cover are joined with the thermoplastic resin. 24. The housing according to claim 20 , comprising a heat generation member disposed on a surface of the reinforcin
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Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories (mounting of accessories to a computer display G06F1/1607; display hoods G06F1/1603; cooling arrangements for portable computers G06F1/203) · CPC title
Materials therefor · CPC title
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