Light source module and backlight assembly having the same

Patent metadata

Field	Value
Publication number	US-10509159-B2
Application number	US-201715407641-A
Country	US
Kind code	B2
Filing date	Jan 17, 2017
Priority date	Aug 22, 2016
Publication date	Dec 17, 2019
Grant date	Dec 17, 2019

Abstract

A light source module according to some example embodiments includes a first substrate and a plurality of second substrates. The first substrate includes a plurality of connectors configured to at least receive a supply of electrical power and a plurality of first connection pads that are configured to be electrically connected to the plurality of connectors. The second substrates each include a plurality of mounting elements on an upper surface and a plurality of second connection pads on a lower surface of the second substrate and configured to be electrically connected to the plurality of mounting elements. Each mounting element may be connected to a separate light-emitting device. A plurality of connection members may electrically connect the first connection pads of the first substrate to the plurality of second connection pads of the plurality of second substrates.

First claim

What is claimed is:

1. A light source module, comprising:
a first substrate including,
a plurality of connectors configured to at least receive a supply of electrical power, and
a plurality of first connection pads configured to be electrically connected to the plurality of connectors;

a plurality of second substrates on the first substrate, each second substrate including,
a plurality of light-emitting devices on an upper surface of the second substrate, wherein each light-emitting device is a chip,
a plurality of second connection pads on a lower surface of the second substrate, the plurality of second connection pads configured to be electrically connected to the plurality of light-emitting devices, the lower surface of the second substrate being on an opposite side of the second substrate in relation to the upper surface of the second substrate, and
a plurality of vias extending through an interior of the second substrate between the lower surface of the second substrate and the upper surface of the second substrate, the plurality of vias configured to electrically connect the plurality of light-emitting devices to separate, respective sets of second connection pads of the plurality of second connection pads; and

a plurality of connection members configured to electrically connect the plurality of first connection pads of the first substrate with the plurality of second connection pads of the plurality of second substrates.

2. The light source module of claim 1 , wherein,
the first substrate is a single layer printed circuit board (PCB),
the plurality of connectors and the plurality of first connection pads are on a common surface of the first substrate, and
the second substrate is a double layer PCB.

3. The light source module of claim 1 , wherein the plurality of connection members include solder balls or solder bumps.

4. The light source module of claim 3 further comprising:
an insulating material between the first substrate and at least one second substrate of the plurality of the second substrates, the insulating material further between the plurality of connection members.

5. The light source module of claim 1 , wherein the second substrate is surface mounted on the first substrate.

6. The light source module of claim 1 , wherein the plurality of light-emitting devices are mounted on the upper surface of the second substrate according to flip-chip bonding.

7. The light source module of claim 1 , wherein,
the plurality of light-emitting devices extends along a longitudinal axis of the second substrate, and
the plurality of second substrates extends along a longitudinal axis of the first substrate.

8. The light source module of claim 7 , wherein the plurality of connectors are located in at least one end region of the first substrate.

9. A light source module, comprising:
a first substrate including,
a plurality of connectors configured to at least receive a supply of electrical power, and
a plurality of first connection pads configured to be electrically connected to the plurality of connectors;

a plurality of second substrates on the first substrate, each second substrate including,
a plurality of package substrates on an upper surface of the second substrate,
a plurality of light-emitting devices on the plurality of package substrates, each light-emitting device on a separate package substrate of the plurality of package substrates,
a plurality of second connection pads on a lower surface of the second substrate, the plurality of second connection pads configured to be electrically connected to the plurality of light-emitting devices, the lower surface of the second substrate being on an opposite side of the second substrate in relation to the upper surface of the second substrate, and
a plurality of vias extending through an interior of the second substrate between the lower surface of the second substrate and the upper surface of the second substrate, the plurality of vias configured to electrically connect the plurality of light-emitting devices to separate, respective sets of second connection pads of the plurality of second connection pads;
a plurality of connection members configured to electrically connect the plurality of first connection pads of the first substrate with the plurality of second connection pads of the plurality of second substrates.

10. The light source module of claim 9 , wherein each package substrate includes a wavelength conversion material that covers each light-emitting device of the plurality of light emitting devices.

11. The light source module of claim 10 , wherein the wavelength conversion material includes a fluorescent material or a quantum dot.

12. The light source module of claim 9 , wherein,
the first substrate is a single layer PCB,
the plurality of connectors and the plurality of first connection pads are on a common surface of the first substrate, and
the second substrate is a double layer PCB.

13. The light source module of claim 9 , wherein the second substrate is surface mounted on the first substrate.

14. A light source module, comprising:
a first substrate including,
a plurality of connectors configured to at least receive a supply of electrical power, and
a plurality of first connection pads configured to be electrically connected to the plurality of connectors;

a plurality of second substrates on the first substrate, each second substrate including,
a plurality of mounting elements on an upper surface of the second substrate, each mounting element configured to electrically connect with a separate light-emitting device that is a chip,
a plurality of second connection pads on a lower surface of the second substrate, each second connection pad configured to be electrically connected to a separate mounting element of the plurality of mounting elements, the lower surface of the second substrate being on an opposite side of the second substrate in relation to the upper surface of the second substrate, and
a plurality of vias extending through an interior of the second substrate between the lower surface of the second substrate and the upper surface of the second substrate, the plurality of vias configured to electrically connect the plurality of mounting elements to separate. respective sets of second connection pads of the plurality of second connection pads; and

a plurality of connection members configured to electrically connect the plurality of first connection pads of the first substrate with the plurality of second connection pads of the plurality of second substrates.

15. The light source module of claim 14 , wherein,
the first substrate is a single layer printed circuit board (PCB),
the plurality of connectors and the plurality of first connection pads are on a common surface of the first substrate, and
the second substrate is a double layer PCB.

16. The light source module of claim 14 further comprising:
an insulating material between the first substrate and at least one second substrate of the plurality of the second substrates, the insulating material further between at least a portion of connection members of the plurality of connection members.

17. The light source module of claim 14 , wherein,
each second substrate is configured to electrically connect to a separate plurality of light-emitting devices such that the separate plurality of light-emitting devices extends along a longitudinal axis of the second substrate, and
the plurality of second substrates extends along a longitudinal axis of the first substrate.

18. The li

Assignees

• Samsung Electronics Co Ltd

Inventors

• Lee Dong-Soo
• LIM Seog-ho
• Shin Chang-Ho
• Kim Sun
• HA Myoung-sun
• BANG Jae-jun

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W72/01308

  using permanent auxiliary members, e.g. using alignment marks · CPC title

• H10W90/00 Primary

  Package configurations · CPC title

• G02B6/0053

  Prismatic sheet or layer; Brightness enhancement element, sheet or layer · CPC title