Anti-detachment capper for LED retrofit lamps

US10508776B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10508776-B2
Application numberUS-201615373707-A
CountryUS
Kind codeB2
Filing dateDec 9, 2016
Priority dateApr 22, 2016
Publication dateDec 17, 2019
Grant dateDec 17, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A bipartite capper component for an illuminating lamp includes a first portion formed of a first material and a second portion formed of a second material different from the first material. The second portion of the capper component is in contact with the first portion of the capper component. The first portion of the capper component is configured to threadedly engage within a standard threaded metal base component of the illuminating lamp.

First claim

Opening claim text (preview).

The invention claimed is: 1. A capper component for an illuminating lamp, comprising a first portion formed of a first material and a second portion formed of a second material different from the first material, the second portion in contact with the first portion, the first portion configured to threadedly engage within a standard threaded metal base component of the illuminating lamp, wherein the second portion is formed by a forming process on an inner surface of the first portion and an outer surface of the first portion, said second portion touching said inner surface of the first portion and said outer surface of the first portion. 2. The capper component of claim 1 , wherein the first material is electrically and thermally conductive and the second portion performs an electrically insulative function relative to the first portion. 3. The capper component of claim 2 , wherein the first material is metal or an electrically conductive ceramic. 4. The capper component of claim 3 , wherein the first material is aluminum. 5. The capper component of claim 1 , wherein the forming process on the inner surface of the first portion and the outer surface of the first portion is selected from the group consisting of overmolding, casting, computer numerical control (CNC) forming, three-dimensional (3-D) printing, insert molding and double-shot molding. 6. The capper component of claim 5 , wherein the second portion is formed by overmolding on both of (a) the inner surface of the first portion and (b) the outer surface of the first portion. 7. The capper component of claim 5 , wherein the second material is a plastic material, the plastic material selected from the group consisting of PBT (polybutyleneterephthalate), PC (polycarbonate), PS (polystyrene) P SF (polysulfone), PEEK (polyetheretherketone), PI (polyimide), PAI (polyamide-imide), PPO (polyphenylene oxide) and PPS (phenylenesulfide). 8. An illuminating lamp, comprising: a standard metal base having a threaded configuration; a capper component having a first portion formed of a first material, the first portion threadedly engaged within the standard metal base, the capper component having a second portion formed of a second material different from the first material, the second portion in contact with the first portion, wherein the second portion is formed by a forming process on an inner surface of the first portion and an outer surface of the first portion, said second portion touching said inner surface of the first portion and said outer surface of the first portion; a substantially cylindrical plastic cover in contact with the second portion of the capper component; a heat sink housed within the plastic cover; a plurality of metal-core printed circuit boards housed within the plastic cover and in contact with the heat sink; and a plurality of light-emitting diodes (LEDs) mounted on the printed circuit boards. 9. The illuminating lamp of claim 8 , wherein the first material is electrically conductive and the second portion performs an electrically insulative function relative to the first portion. 10. The illuminating lamp of claim 9 , wherein the first material is metal or an electrically conductive ceramic. 11. The illuminating lamp of claim 10 , wherein the first material is aluminum. 12. The illuminating lamp of claim 8 , wherein the forming process on the inner surface of the first portion and the outer surface of the first portion us selected from the group consisting of overmolding, casting, computer numerical control (CNC) forming, three-dimensional (3-D) printing, insert molding and double-shot molding. 13. The illuminating lamp of claim 12 , wherein the second portion is formed by overmolding on both of (a) the inner surface of the first portion and (b) the outer surface of the first portion. 14. The illuminating lamp of claim 12 , wherein the second material is plastic.

Assignees

Inventors

Classifications

  • Processes of additive manufacturing · CPC title

  • characterised by passive heat-dissipating elements, e.g. heat-sinks · CPC title

  • the substrate is supporting also the light source · CPC title

  • Safety devices structurally associated with lighting devices (gas- tight or water-tight arrangements F21V31/00; in general F16P; protective circuit arrangements per se H02H7/00) · CPC title

  • Light-emitting diodes [LED] · CPC title

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Frequently asked questions

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What does patent US10508776B2 cover?
A bipartite capper component for an illuminating lamp includes a first portion formed of a first material and a second portion formed of a second material different from the first material. The second portion of the capper component is in contact with the first portion of the capper component. The first portion of the capper component is configured to threadedly engage within a standard threade…
Who is the assignee on this patent?
Current Lighting Solutions Llc
What technology area does this patent fall under?
Primary CPC classification F21V15/015. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Dec 17 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).