Laser welded structure, electronic controller and manufacture method for laser welded structure

US10507617B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10507617-B2
Application numberUS-201515517858-A
CountryUS
Kind codeB2
Filing dateSep 29, 2015
Priority dateOct 10, 2014
Publication dateDec 17, 2019
Grant dateDec 17, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A laser welded structure is formed by laser welding together a resin molded body formed from a thermoplastic polymer alloy containing a crystalline resin and an amorphous resin and a metal body made of a metal. A glass transition temperature of the amorphous resin is lower than a melting start temperature of the crystalline resin.

First claim

Opening claim text (preview).

The invention claimed is: 1. A laser welded structure comprising a resin molded body and a metal body made of a metal which are laser welded together, the resin molded body formed from a thermoplastic polymer alloy containing a crystalline resin and an amorphous resin, wherein a glass transition temperature of the amorphous resin is lower than a melting start temperature of the crystalline resin, wherein at least a joint surface of the resin molded body with the metal body is subjected to an oxygen function amplifying treatment. 2. A laser welded structure comprising a resin molded body and a metal body made of a metal which are laser welded together, the resin molded body formed from a thermoplastic polymer alloy containing a crystalline resin and another resin, wherein a crystallization speed of the polymer alloy is lower than a crystallization speed of the crystalline resin, or a recrystallization temperature of the polymer alloy is lower than a recrystallization temperature of the crystalline resin, wherein at least a joint surface of the resin molded body with the metal body is subjected to an oxygen function amplifying treatment. 3. The laser welded structure according to claim 1 , wherein a crystallization speed of the polymer alloy is lower than a crystallization speed of the crystalline resin, or a recrystallization temperature of the polymer alloy is lower than a recrystallization temperature of the crystalline resin. 4. The laser welded structure according to claim 1 , wherein the polymer alloy contains a copolymer of the crystalline resin. 5. The laser welded structure according to claim 1 , wherein a content percentage of the amorphous resin in the polymer alloy is 5 to 40%. 6. The laser welded structure according to claim 1 , wherein an inorganic filler is added to the polymer alloy. 7. The laser welded structure according to claim 1 , wherein a joint surface of the metal body with the resin molded body has a surface roughness Ra of 0.1 μm to 5.0 μm. 8. The laser welded structure according to claim 1 , wherein at least a part of the metal body is embedded in the resin molded body. 9. An electronic controller including the laser welded structure according to claim 1 , the electronic controller comprising an electronic circuit portion received in an accommodation space defined by the metal body and the resin molded body, wherein the accommodation space is sealed by laser welding the resin molded body and the metal body. 10. The electronic controller according to claim 9 , wherein the resin molded body is an integral molded body formed by integrally molding a cover for covering the electronic circuit portion, and a connector retaining terminals to be electrically connected to the electronic circuit portion. 11. The electronic controller according to claim 9 , comprising: a cover for covering the electronic circuit portion; and a connector separate from the cover and retaining terminals to be electrically connected to the electronic circuit portion, wherein the cover and the connector are each composed of the resin molded body and are united with each other. 12. A manufacture method for laser welded structure comprising: preparing a resin molded body made of a thermoplastic polymer alloy containing a crystalline resin and an amorphous resin, and a metal body made of a metal; the amorphous resin having a glass transition temperature lower than a melting start temperature of the crystalline resin; giving an oxygen function amplifying treatment to at least a portion of the resin molded body that is laser welded to the metal body; heating the resin molded body to a temperature to or above the glass transition temperature of the amorphous resin; and laser welding the resin molded body and the metal body together in a state where the resin molded body is in pressure contact with the metal body. 13. The manufacture method for laser welded structure according to claim 12 , wherein the resin molded body and the metal body are laser welded together in a state where the resin molded body is heated to a temperature equal to or higher than a recrystallization temperature of the polymer alloy and equal to or lower than a melting start temperature of the polymer alloy.

Assignees

Inventors

Classifications

  • Transparent to electromagnetic radiation, e.g. to visible light · CPC title

  • in explicit relation to another variable, e.g. X-Y diagrams · CPC title

  • characterised by the composition of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps · CPC title

  • Aluminium or alloys of aluminium · CPC title

  • the to-be-joined area of at least one of the parts to be joined being crystalline · CPC title

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What does patent US10507617B2 cover?
A laser welded structure is formed by laser welding together a resin molded body formed from a thermoplastic polymer alloy containing a crystalline resin and an amorphous resin and a metal body made of a metal. A glass transition temperature of the amorphous resin is lower than a melting start temperature of the crystalline resin.
Who is the assignee on this patent?
Hitachi Automotive Systems Ltd
What technology area does this patent fall under?
Primary CPC classification B29C65/1629. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Dec 17 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).