Workpiece manufacturing apparatus

US10507591B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10507591-B2
Application numberUS-201816002066-A
CountryUS
Kind codeB2
Filing dateJun 7, 2018
Priority dateJun 20, 2017
Publication dateDec 17, 2019
Grant dateDec 17, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A workpiece manufacturing apparatus includes a punch, which is provided in a lower die assembly and punches out a workpiece from an unprocessed material, and an ejector, which is provided in an upper die assembly so as to be capable of approaching and moving away from the lower die assembly. The manufacturing apparatus further includes a spring, which is provided in the upper die assembly and urges the ejector toward the lower die assembly, and a locking device, which locks the ejector with respect to the upper die assembly at a position at which the punch punches out the workpiece and releases the ejector when the die assemblies are opened. The locking device includes an actuator, which is provided in the upper die assembly and slides a slider between a locking position, at which the ejector is locked, and a releasing position, at which the ejector is released.

First claim

Opening claim text (preview).

The invention claimed is: 1. A workpiece manufacturing apparatus comprising: an upper die assembly and a lower die assembly, which are arranged on opposite sides of an unprocessed material, wherein the upper and lower die assemblies are moved relative to each other toward each other to be clamped and moved relative to each other away from each other to be opened; a punch, which is provided in the lower die assembly and punches out a workpiece from the unprocessed material in a clamped state of the die assemblies; an ejector, which is provided in the upper die assembly so as to be capable of approaching and moving away from the lower die assembly and to be located at a position corresponding to the punch; a spring, which is provided in the upper die assembly and urges the ejector toward the lower die assembly; and a locking device, which locks the ejector with respect to the upper die assembly at a position at which the punch punches out the workpiece from the unprocessed material and releases the ejector when the die assemblies are opened, wherein the locking device comprises: a slider, which is provided in the upper die assembly and is capable of sliding between a locking position, at which the ejector is locked, and a releasing position, at which the ejector is released, an actuator, which is provided in the upper die assembly and causes the slider to slide, and a control section, which controls the actuator, a roller being provided above the ejector, the roller being coupled to the ejector to be capable of moving integrally with the ejector, the roller being in contact with the slider by an urging force of the spring acting on the ejector, the slider slides in a horizontal direction between the locking position and the releasing position, the slider comprising: a releasing surface, which contacts the roller when the slider is in the releasing position, a locking surface, which is located at a higher level than the releasing surface, the roller contacting the locking surface when the slider is in the locking position, and a slope, which connects the releasing surface and the locking surface with each other, when the slider is in the locking position, the roller is pressed by the locking surface to compress the spring, thereby locking the ejector with respect to the upper die assembly, and when the slider is in the releasing position, the releasing surface is caused to contact the roller to weaken the urging force of the spring as compared with that during the compression, thereby releasing the ejector. 2. The workpiece manufacturing apparatus according to claim 1 , wherein the spring is configured by a first spring member and a second spring member provided in an urging mechanism, which urges the ejector toward the lower die assembly, the urging mechanism is configured to compress the first spring prior to the second spring when the ejector is displaced away from the lower die assembly, a force required to compress the first spring member is smaller than a force required to compress the second spring member, a displacement amount of the first spring member during compression is larger than a displacement amount of the second spring member during compression, a force with which the actuator slides the slider from the releasing position to the locking position is set to a magnitude that can push up the roller against the urging force of the first spring member along the slope of the slider and cannot push up the roller against the urging force of the second spring member, and when the upper die assembly and the lower die assembly are clamped, the control section operates the actuator to slide the slider from the releasing position to the locking position.

Assignees

Inventors

Classifications

  • B26D7/1818Primary

    by pushing out · CPC title

  • using a press, e.g. of the ram type (presses in general B30B) · CPC title

  • Combined ejecting and stripping-off devices · CPC title

  • Means to move product out of contact with tool · CPC title

  • Punching tool · CPC title

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Frequently asked questions

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What does patent US10507591B2 cover?
A workpiece manufacturing apparatus includes a punch, which is provided in a lower die assembly and punches out a workpiece from an unprocessed material, and an ejector, which is provided in an upper die assembly so as to be capable of approaching and moving away from the lower die assembly. The manufacturing apparatus further includes a spring, which is provided in the upper die assembly and u…
Who is the assignee on this patent?
Toyota Boshoku Kk
What technology area does this patent fall under?
Primary CPC classification B26D7/1818. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Dec 17 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).