Semiconductor device with substrate temperature monitor circuit

Patent metadata

Field	Value
Publication number	US-10505518-B2
Application number	US-201515520636-A
Country	US
Kind code	B2
Filing date	Jan 20, 2015
Priority date	Jan 20, 2015
Publication date	Dec 10, 2019
Grant date	Dec 10, 2019

Abstract

First and second circuits, a photocoupler and a substrate temperature monitor circuit are formed on a substrate. A photocoupler includes a primary-side light emitting diode that converts an electric signal received from the first circuit into an optical signal, and a light receiving device that converts the optical signal into an electric signal and outputs the electric signal to the second circuit. The substrate temperature monitor circuit reads a Vf voltage value of the primary-side light emitting diode of the photocoupler to monitor temperature of the substrate.

First claim

The invention claimed is:

1. A semiconductor device comprising:
a substrate;
first and second circuits formed on the substrate;
a photocoupler formed on the substrate and including a light emitting diode that converts an electric signal received from the first circuit into an optical signal, and a light receiving device that converts the optical signal into an electric signal and outputs the electric signal to the second circuit;
a substrate temperature monitor circuit reading a Vf voltage value of the light emitting diode of the photocoupler to monitor temperature of the substrate; and
a power supply circuit supplying a voltage to each of the first and second circuits, wherein
the substrate temperature monitor circuit corrects a temperature variation in an output voltage value of the power supply circuit according to the monitored temperature of the substrate.

2. The semiconductor device according to claim 1 , wherein
the power supply circuit is a single power supply circuit that supplies the voltage to each of the first and second circuits in parallel.

3. A semiconductor device comprising:
a substrate;
first and second circuits formed on the substrate;
a photocoupler formed on the substrate and including a light emitting diode that converts an electric signal received from the first circuit into an optical signal, and a light receiving device that converts the optical signal into an electric signal and outputs the electric signal to the second circuit;
a substrate temperature monitor circuit reading a Vf voltage value of the light emitting diode of the photocoupler to monitor temperature of the substrate; and
a power supply circuit supplying a voltage to each of the first and second circuits, wherein
the power supply circuit includes an aluminum electrolytic capacitor, and
the substrate temperature monitor circuit accumulates thermal histories of the aluminum electrolytic capacitor from the monitored temperature of the substrate to predict a life of the aluminum electrolytic capacitor.

4. The semiconductor device according to claim 3 , wherein the substrate temperature monitor circuit outputs an error signal when the predicted life of the aluminum electrolytic capacitor has reached life criteria.

5. The semiconductor device according to claim 3 , wherein
the power supply circuit is a single power supply circuit that supplies the voltage to each of the first and second circuits in parallel.

6. A semiconductor device comprising:
a substrate;
first and second circuits formed on the substrate;
a photocoupler formed on the substrate and including a light emitting diode that converts an electric signal received from the first circuit into an optical signal, and a light receiving device that converts the optical signal into an electric signal and outputs the electric signal to the second circuit; and
a substrate temperature monitor circuit reading a Vf voltage value of the light emitting diode of the photocoupler to monitor temperature of the substrate, wherein
the photocoupler includes a plurality of photocouplers, and
the substrate temperature monitor circuit reads the Vf voltage value of the light emitting diode of each of the plurality of photocouplers and averages the read voltage values to monitor the temperature of the substrate.

7. The semiconductor device according to claim 6 , wherein
the plurality of photocouplers are each formed on the same substrate.

Assignees

• Mitsubishi Electric Corp

Inventors

• KOMO Hideo
• Taguchi Koichi
• Omaru Takeshi

Classifications

• H10W90/00

  Package configurations · CPC title

• H03K3/017

  Adjustment of width or dutycycle of pulses (pulse width modulation H03K7/08 {; to maintain energy constant H03K3/015}) · CPC title

• G01K7/00

  Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat (giving results other than momentary value of temperature G01K3/00) {; Power supply therefor, e.g. using thermoelectric elements} · CPC title

• H01G9/28

  Structural combinations of electrolytic capacitors, rectifiers, detectors, switching devices with other electric components not covered by this subclass · CPC title

• G01K3/10

  in respect of time, e.g. reacting only to a quick change of temperature · CPC title