Method for packaging thermoelectric module
US-9859485-B1 · Jan 2, 2018 · US
US10505093B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10505093-B2 |
| Application number | US-201615279220-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 28, 2016 |
| Priority date | May 30, 2016 |
| Publication date | Dec 10, 2019 |
| Grant date | Dec 10, 2019 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A housing for a thermoelectric module can stably protect individual elements of the thermoelectric module such as thermoelectric elements, electrodes, and insulating boards, while maintaining power generation performance of the thermoelectric module. The housing for a thermoelectric module includes: a housing enveloping at least one thermoelectric module; and a heat barrier unit configured to prevent a flow of heat from being transferred through a sidewall of the housing.
Opening claim text (preview).
What is claimed is: 1. A housing for a thermoelectric module, the housing comprising: a first housing including a first base and a first sidewall disposed on edges of the first base; a second housing including a second base and a second sidewall disposed on edges of the second base; and a heat barrier unit provided between the first sidewall and the second sidewall, including: a bonding member formed of a resin material and configured to seal the first sidewall and the second sidewall; a first fitting part provided at a bottom of the first sidewall, the first fitting part including a first horizontal portion extending horizontally from the bottom of the first sidewall, and a first bent portion extending upwardly perpendicular to the first horizontal portion; and a second fitting part provided at a top of the second sidewall, the second fitting part including a second horizontal portion extending horizontally from the top of the second sidewall, and a second bent portion extending downwardly perpendicular to the second horizontal portion, wherein, the bonding member has a first bonding portion wrapping the first fitting part and a second bonding portion wrapping the second fitting part, and wherein the first bonding portion is bonded directly to the first fitting part and the second bonding portion is bonded directly to the second fitting part. 2. The housing according to claim 1 , wherein the bonding member is formed of a heat shrinkable film. 3. The housing according to claim 1 , wherein the first horizontal portion extends from the first sidewall toward an internal space of the housing, and wherein the second horizontal portion extends from the second sidewall toward the internal space of the housing. 4. The housing according to claim 1 , wherein the first horizontal portion extends from the first sidewall toward an exterior space of the first housing, and wherein the second horizontal portion extends from the second sidewall toward an interior space of the second housing. 5. The housing according to claim 1 , further comprising a thermal resistance increasing part increasing thermal resistance with respect to a flow of heat transferred through the first and second sidewalls. 6. The housing according to claim 5 , wherein the thermal resistance increasing part includes a thin wall portion provided in a portion of at least one of the first and second sidewalls, and the thin wall portion is thinner than the sidewall. 7. The housing according to claim 5 , wherein the thermal resistance increasing part includes a non-straight portion provided in a portion of at least one of the first and second sidewalls.
Electricity · mapped topic
Venting apertures; Constructional details thereof · CPC title
Electricity · mapped topic
Electricity · mapped topic
Side-by-side or stacked arrangements · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.