Wafer Level Package (WLP) and Method for Forming the Same
US-2017092597-A1 · Mar 30, 2017 · US
US10504809B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10504809-B2 |
| Application number | US-201615775345-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 17, 2016 |
| Priority date | Nov 26, 2015 |
| Publication date | Dec 10, 2019 |
| Grant date | Dec 10, 2019 |
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Official abstract text for this publication.
A method for producing an electrical device including an electrical component at least partially covered by a covering material having a cement material includes supplying the cement material, mixing an additive into the cement material, applying the covering material having the cement material with the additive onto the electrical component, and treating the covering material. The treatment allows the additive from the cement material to reach a surface of the cement material and to form a protective layer on the surface.
Opening claim text (preview).
The invention claimed is: 1. A method of producing an electrical device including an electrical component at least partly enveloped by an envelope material having a cement material, the method comprising: mixing an admixture into the cement material; applying the envelope material including the cement material comprising the admixture to the electrical component; and treating the envelope material so as to cause the admixture from the cement material to arrive at a surface of the cement material and to form a protective layer at the surface. 2. The method as claimed in claim 1 , wherein the cement material includes calcium aluminate cement. 3. The method as claimed in claim 1 , wherein the protective layer is water vapor-impermeable. 4. The method as claimed in claim 1 , wherein treating the envelope material comprises at least one of the following treatments: subjecting the envelope material to vibration, agitation movements and/or spinning movements; heat-treating the envelope material; exposing the envelope material in a defined gas atmosphere; subjecting the envelope material to a defined pressure; and subjecting the envelope material to electromagnetic radiation. 5. The method as claimed in claim 1 , wherein treating the envelope material causes the admixture to float up and/or to diffuse and/or to coagulate and/or to swell up to the surface of the cement material. 6. The method as claimed in claim 5 , wherein the admixture: floats up to the surface of the cement material in the liquid cement material during a gelation phase; and/or diffuses to the surface of the cement material via a particle size gradient and/or a density gradient in the cement material during a drying phase; and/or coagulates based on its concentration; and/or swells up as a result of a reaction. 7. The method as claimed in claim 5 , wherein the admixture swells up to the surface of the cement material, polymerizes, and cures to form the protective layer. 8. The method as claimed in claim 1 , wherein the admixture is selected from the group consisting of monomers, polymers, silicone, inorganic substances, oxides, nitride, and ceramics. 9. The method as claimed in claim 1 , wherein treating the envelope material comprises: mixing a binder and/or a swellant into the cement material in order to keep the admixture at the surface of the cement material. 10. An electrical device, comprising: an envelope material including a cement material; an electrical component at least partly enveloped by the envelope material; and a protective layer disposed at a surface of the cement material and including an admixture configured to arrive from an interior of the cement material at the surface of the cement material so as to form the protective layer at the surface, wherein the admixture is also disposed in the interior of the cement material. 11. The electrical device as claimed in claim 10 , wherein the admixture is further configured to be mixed into the cement material and to float and/or diffuse out of the interior of the cement material to the surface of the cement material, and/or coagulate and/or swell so as to form the protective layer at the surface. 12. The electrical device as claimed in claim 10 , wherein the protective layer is configured to break down or to carbonate at a particular temperature not less than 250° C. 13. The electrical device as claimed in claim 10 , wherein the electrical component is a semiconductor component, a sensor element, an inductance, a capacitance, a battery cell, a battery module, or a circuit.
the semiconductor body being only partially enclosed · CPC title
by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation · CPC title
characterised by their materials · CPC title
Manufacture or treatment · CPC title
Arrangements for protection of devices (arrangements for thermal protection H10W40/00) · CPC title
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