Insulated wire, coil and electric or electronic equipment

US10504636B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10504636-B2
Application numberUS-201816001205-A
CountryUS
Kind codeB2
Filing dateJun 6, 2018
Priority dateDec 8, 2015
Publication dateDec 10, 2019
Grant dateDec 10, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An insulated wire, containing a conductor, an adhesion layer provided in direct contact with the conductor, and an insulating layer composed of a polyimide resin, which is provided on the adhesion layer, in which, in the adhesion layer, the content rate of a total formula weight of an imide structure represented by Formula (a) in a polyimide resin skeleton is 27% or more and 33% or less; and, in the polyimide resin of the insulating layer, the content rate of a total formula weight of the imide structure in a polyimide resin skeleton is more than 27% and 37% or less: a coil; and an electric or electronic equipment.

First claim

Opening claim text (preview).

The invention claimed is: 1. An insulated wire, comprising: a conductor; an adhesion layer composed of a polyimide resin, which is provided in direct contact with the conductor; and an insulating layer with a film thickness of 20 μm or more, composed of a polyimide resin, which is provided on the adhesion layer, wherein, in the adhesion layer, the content rate of a total formula weight of an imide structure represented by Formula (a) in a polyimide resin skeleton is 27% or more and 33% or less; wherein, in the polyimide resin of the insulating layer, the content rate of a total formula weight of the imide structure in a polyimide resin skeleton is more than 27% and 37% or less: and wherein the insulating layer is composed of two or more layers, and a difference in the content rate of the total formula weight of the imide structure between insulating layers adjacent to each other is from 4.0 to 10.0%. 2. The insulated wire according to claim 1 , wherein a difference in the content rate of the total formula weight of the imide structure between the adhesion layer and the insulating layer is from 4.0 to 10.0%. 3. The insulated wire according to claim 1 , wherein a difference in the content rate of the total formula weight of the imide structure between the adhesion layer and the insulating layer is from 4.0 to 10.0%, and the content rate of the total formula weight of the insulating layer is greater than the adhesion layer. 4. The insulated wire according to claim 1 , wherein the polyimide resin has a partial structure represented by Formula (1): 5. The insulated wire according to claim 1 , further comprising a reinforcing insulating layer composed of a thermoplastic resin, wherein the thermoplastic resin contains at least one kind of resin selected from a polyetherether ketone resin and a polyphenylene sulfide resin. 6. A coil, which is obtained by winding working the insulated wire according to claim 1 . 7. An electric or electronic equipment, comprising the coil according to claim 6 .

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What does patent US10504636B2 cover?
An insulated wire, containing a conductor, an adhesion layer provided in direct contact with the conductor, and an insulating layer composed of a polyimide resin, which is provided on the adhesion layer, in which, in the adhesion layer, the content rate of a total formula weight of an imide structure represented by Formula (a) in a polyimide resin skeleton is 27% or more and 33% or less; and, i…
Who is the assignee on this patent?
Furukawa Electric Co Ltd, Furukawa Magnet Wire Co Ltd
What technology area does this patent fall under?
Primary CPC classification H01B7/02. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Dec 10 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).