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Heat storage molded body, heat storage laminate, and heat storage molded body production method
US10502499B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10502499-B2 |
| Application number | US-201715831602-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 5, 2017 |
| Priority date | Jun 23, 2015 |
| Publication date | Dec 10, 2019 |
| Grant date | Dec 10, 2019 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A heat storage molded body includes a heat storage medium dispersed in a resin matrix, wherein the resin matrix includes a resin composition containing a thermoplastic resin and a non-phthalate plasticizer, and wherein the Hansen Solubility Parameter (HSP) distance between the non-phthalate plasticizer and the heat storage medium is 6 or more.
First claim
Opening claim text (preview).
What is claimed is: 1. A heat storage molded body comprising a heat storage medium dispersed in a resin matrix, wherein the heat storage medium is heat storage particles containing a latent heat storage material encapsulated therein and the latent heat storage material shows a solid/liquid phase transition in a temperature range of −20° C. to 120° C., wherein the resin matrix comprises a resin composition containing a thermoplastic resin and a non-phthalate plasticizer, and wherein the Hansen Solubility Parameter (HSP) distance between the non-phthalate plasticizer and the heat storage medium is 6 or more. 2. The heat storage molded body according to claim 1 , wherein the HSP distance between the non-phthalate plasticizer and the thermoplastic resin is 15 or less. 3. The heat storage molded body according to claim 1 , wherein the non-phthalate plasticizer has a gelation end point temperature of 150° C. or less. 4. The heat storage molded body according to claim 1 , wherein the heat storage molded body is molded at 150° C. or less. 5. The heat storage molded body according to claim 1 , wherein the content of the non-phthalate plasticizer in the resin composition is from 30 to 150 parts by mass per 100 parts by mass of the thermoplastic resin. 6. The heat storage molded body according to claim 1 , wherein the content of the heat storage medium in the heat storage molded body is from 10 to 80 mass %. 7. The heat storage molded body according to claim 1 , wherein the heat storage molded body has a sheet shape. 8. A heat storage laminate comprising at least one of a heat diffusion layer and a heat insulation layer laminated on the heat storage molded body according to claim 1 . 9. A heat storage laminate comprising a nonflammable layer laminated on the heat storage molded body according to claim 1 .
Assignees
Inventors
Classifications
Encapsulated ingredients · CPC title
Flame resistant or retardant, fire resistant or retardant · CPC title
Materials absorbing or liberating heat during crystallisation; Heat storage materials · CPC title
Impregnation, embedding, or binder material · CPC title
comprising vinyl resins; comprising acrylic resins · CPC title
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Frequently asked questions
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- What does patent US10502499B2 cover?
- A heat storage molded body includes a heat storage medium dispersed in a resin matrix, wherein the resin matrix includes a resin composition containing a thermoplastic resin and a non-phthalate plasticizer, and wherein the Hansen Solubility Parameter (HSP) distance between the non-phthalate plasticizer and the heat storage medium is 6 or more.
- Who is the assignee on this patent?
- Dainippon Ink & Chemicals
- What technology area does this patent fall under?
- Primary CPC classification B32B27/18. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Dec 10 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).