Printed circuit board (pcb) with wrapped conductor
US-2015382460-A1 · Dec 31, 2015 · US
US10501859B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10501859-B2 |
| Application number | US-201615379128-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 14, 2016 |
| Priority date | Oct 31, 2016 |
| Publication date | Dec 10, 2019 |
| Grant date | Dec 10, 2019 |
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A partial plating method of an automobile resin part may include a painting step of partially applying masking paint for plating on one side surface of an injection molded automobile resin product to form a painting portion where the masking paint for plating is applied and a non-painting portion where the masking paint for plating is not applied, and a wet electroplating step of attaching a current electrode for wet electroplating on the non-painting portion and performing the wet electroplating to form a plating layer on the entire surface of the automobile resin part except for the painting portion.
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What is claimed is: 1. A partial plating method of an automobile resin part, including: a painting step of partially applying masking paint for plating on one side surface of an injection molded automobile resin product to form a painting portion where the masking paint for plating is applied and a non-painting portion where the masking paint for plating is not applied; and a wet electroplating step of attaching a current electrode for wet electroplating on the non-painting portion and performing the wet electroplating to form a plating layer on an entire surface of the automobile resin part except for the painting portion, wherein the masking paint for plating contains a masking resin composition for plating, the masking resin composition for plating contains a polymer resin, an organic solvent, a plasticizer, and an inorganic additive, and wherein the polymer resin is a mixture of poly vinyl chloride (PVC) and an ethylene-vinyl acetate copolymer (EVA), and wherein the plasticizer is trioctyl benzene-1,3,5-tricarboxylate, and wherein the organic solvent includes methyl isobutyl ketone, toluene, n-butanol, and ethyl acetate, and wherein the inorganic additive includes sodium (Na), aluminum (Al), potassium (K), calcium (Ca), titanium (Ti), and iron (Fe). 2. The partial plating method of the automobile resin part of claim 1 , wherein in the wet electroplating step, the wet electroplating is not performed on the painting portion. 3. The partial plating method of the automobile resin part of claim 1 , wherein in the painting step, the masking paint for plating is applied on a surface of the automobile resin part molded at a thickness of 20 to 30 μm. 4. The partial plating method of the automobile resin part of claim 1 , wherein the wet electroplating step includes a pre-treating step of activating chemical plating by adsorbing a metal catalyst so that the chemical plating is performed on a surface of the automobile resin part, a chemical plating step of forming a conductor configured for performing electroplating by using chemical nickel by the metal catalyst, and an electroplating step of plating the automobile resin part gone through the chemical plating step using copper (Cu), nickel (Ni), and chromium (Cr). 5. The partial plating method of the automobile resin part of claim 1 , wherein a concentration of the masking resin composition for plating is 60 wt % or more and 99 wt % or less in the masking paint for plating.
Including graded layers in composition or in physical properties, e.g. density, porosity, grain size · CPC title
Coating with nickel, cobalt or mixtures thereof with phosphorus or boron (C23C18/50 takes precedence) · CPC title
using masking means · CPC title
Use of metal, e.g. activation, sensitisation with noble metals · CPC title
with use of organic or inorganic compounds other than metals, first · CPC title
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