Base polymer for hot melt adhesive

US10501663B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10501663-B2
Application numberUS-201515537142-A
CountryUS
Kind codeB2
Filing dateDec 22, 2015
Priority dateDec 22, 2014
Publication dateDec 10, 2019
Grant dateDec 10, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A base polymer for hot-melt adhesive, containing a propylenic polymer (A) having a tensile modulus of elasticity of 60 MPa or more, and an olefinic polymer (B) having a tensile modulus of elasticity of less than 60 MPa, wherein, relative to 100 parts by mass of the total amount of the propylenic polymer (A) and the olefinic polymer (B), the content of the propylenic polymer (A) is 1 part by mass or more and less than 50 parts by mass, and the content of the olefinic polymer (B) is more than 50 parts by mass and 99 parts by mass or less; and a hot-melt adhesive containing the base polymer, and further containing at least one of (C) a tackifier resin and (D) an oil.

First claim

Opening claim text (preview).

The invention claimed is: 1. A base polymer for hot-melt adhesive, comprising: a propylenic polymer (A) having a tensile modulus of elasticity at 23° C. of 60MPa or more, and an olefinic polymer (B) having a tensile modulus of elasticity at 23° C. of less than 60 MPa, wherein: relative to 100 parts by mass of the total amount of the propylenic polymer (A) and the olefinic polymer (B), the content of the propylenic polymer (A) is 1 part by mass or more and less than 50 parts by mass, and the content of the olefinic polymer (B) is more than 50 parts by mass and 99 parts by mass or less, wherein weight-average molecular weight (Mw) of the propylenic polymer (A) is 10,000 to 52,000. 2. The base polymer for hot-melt adhesive according to claim 1 , wherein the content of the propylenic polymer (A) is 1 part by mass or more and 40 parts by mass or less, and the content of the olefinic polymer (B) is 60 parts by mass or more and 99 parts by mass or less. 3. The base polymer for hot-melt adhesive according to claim 1 , wherein the propylenic polymer (A) is a propylene homopolymer. 4. The base polymer for hot-melt adhesive according to claim 1 , wherein the tensile modulus of elasticity at 23° C. of the propylenic polymer (A) is 90 MPa or more. 5. The base polymer for hot-melt adhesive according to claim 1 , wherein the olefinic polymer (B) is a copolymer of at least two selected from the group consisting of propylene, ethylene and α-olefins each having 4 to 24 carbon atoms, a propylene homopolymer, or an ethylene homopolymer. 6. The base polymer for hot-melt adhesive according to claim 1 , wherein the olefinic polymer (B) is a copolymer of propylene, ethylene and 1-butene. 7. The base polymer for hot-melt adhesive according to claim 1 , wherein the propylenic polymer (A) has a melting point of 120° C. or lower. 8. The base polymer for hot-melt adhesive according to claim 1 , wherein the olefinic polymer (B) has a melting point of 50° C. or higher and 160° C. or lower. 9. A hot-melt adhesive, comprising: a base polymer for hot-melt adhesive according to claim 1 ; and at least one selected from the group consisting of (C) a tackifier resin and (D) an oil. 10. The hot-melt adhesive according to claim 9 , which satisfies the following (1) and (2): (1) the tensile modulus of elasticity at 23° C. of the base polymer is 400 MPa or less; and (2) the semi-crystallization time at 25° C. of the hot-melt adhesive is 5 minutes or less. 11. A method of bonding a substrate to another substrate, the method comprising melting a hot-melt adhesive according to claim 9 , and applying the melted hot-melt adhesive to at least one substrate; and bonding another substrate to the applied hot-melt adhesive. 12. A sanitary article, comprising a hot-melt adhesive according to claim 9 .

Assignees

Inventors

Classifications

  • Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers · CPC title

  • Features of adhesives not provided for in group C09J9/00, e.g. additives · CPC title

  • having four to nine carbon atoms · CPC title

  • Polyethylene · CPC title

  • Homopolymers or copolymers of ethene · CPC title

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What does patent US10501663B2 cover?
A base polymer for hot-melt adhesive, containing a propylenic polymer (A) having a tensile modulus of elasticity of 60 MPa or more, and an olefinic polymer (B) having a tensile modulus of elasticity of less than 60 MPa, wherein, relative to 100 parts by mass of the total amount of the propylenic polymer (A) and the olefinic polymer (B), the content of the propylenic polymer (A) is 1 part by mas…
Who is the assignee on this patent?
Idemitsu Kosan Co
What technology area does this patent fall under?
Primary CPC classification C09J123/14. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Dec 10 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).