Epoxy composition containing copolyamide and block copolymer with polyamide and polyether blocks

Patent metadata

Field	Value
Publication number	US-10501619-B2
Application number	US-201515534028-A
Country	US
Kind code	B2
Filing date	Dec 2, 2015
Priority date	Dec 15, 2014
Publication date	Dec 10, 2019
Grant date	Dec 10, 2019

Abstract

A composition that toughens and impact modifies epoxy resin based compositions comprising one or more co-polyamides and one or more block copolymers with polyamide and polyether blocks. The disclosure also relates to epoxy resin compositions containing the composition comprising one or more co-polyamides and one or more block copolymers with polyamide and polyether blocks and films, adhesives, foamable compositions and foamed compositions containing such a composition.

First claim

What is claimed is:

1. A composition comprising:
a) from about 17 to about 70 parts by weight of one or more block co-polymers having one or more polyamide blocks and one or more polyether blocks;
b) from about 30 to about 83 parts by weight of one or more co-polyamides; and
c) a curable composition containing one or more epoxy functional materials;
wherein the total parts by weight of components a) and b) are present in a molar ratio of about 2:1 to 1:6.

2. A composition according to claim 1 , wherein the melting point of the one or more co-polyamides is about 140° C. or less.

3. A composition according to claim 1 wherein the one or more block co-polymers haying one or more polyamide blocks and one or more polyether blocks comprise polyether blocks of polyalkylene oxides.

4. A composition according to claim 1 wherein the one or more co-polyamides comprise random copolymers containing at least two different amide units.

5. A composition according to claim 1 , wherein from about 5 to about 30 parts by weight of a copolymer comprising one or more copolyamide sections and one or more polyether blocks or a mixture of from about 3 to about 12 parts by weight of one or more block co-polymers having one or more polyamide blocks and one or more polyether blocks; and from about 5 to about 15 parts by weight of one or more co-polyamides are added to the arable composition containing one or more epoxy functional materials.

6. The composition according to claim 1 , including an elastomers-containing adduct.

7. The composition of claim 6 , wherein the adduct is present in an amount of 5 parts by weight or greater.

8. The composition of claim 1 , wherein the composition includes from about 10 parts by weight to about 30 parts by weight of a phenoxy resin component.

9. The composition of claim 1 , wherein the composition includes from about 10 parts by weight to about 20 parts by weight of a core-shell component.

10. The composition of claim 9 , wherein the core-shell component is an acrylate-based core-shell material.

11. The composition of claim 1 , wherein the composition is foamable upon exposure to elevated temperatures.

12. The composition of claim 11 , wherein the expansion percentage upon foaming is from about 50% to about 200%.

13. The composition of claim 11 , wherein the composition does not foam upon exposure to elevated temperatures.

14. The composition of claim 1 , wherein the T g of the composition is at least about 80° C. and less than about 120° C.

15. A method comprising;
applying a composition according to claim 1 to a first substrate;
contacting a second substrate with the first substrate with the applied composition disposed between the substrates; and
exposing the contacted substrates to temperatures at which the applied composition cures and the substrates are bonded together.

16. A method according to claim 15 including curing the formed composition.

17. A method according to claim 16 wherein the cured formed composition exhibits a modulus of about 1000 MPa or greater and an elongation of about 10 percent or greater when measured according to ISO 527.

18. The method of claim 15 , wherein the composition is applied as a film or foamable structure.

19. The method of claim 15 , wherein the cured composition exhibits a modulus of about 1000 MPa or greater and an elongation of about 10 percent or greater when measured according to ISO 527.

Assignees

• Zephyros Inc

Inventors

• Duclos Vincent

Classifications

• C08G69/40

  Polyamides containing oxygen in the form of ether groups (C08G69/12, C08G69/32 take precedence) · CPC title

• C08L77/02

  Polyamides derived from omega-amino carboxylic acids or from lactams thereof (C08L77/10 takes precedence) · CPC title

• C08L71/12

  Polyphenylene oxides · CPC title

• C08L77/10

  Polyamides derived from aromatically bound amino and carboxyl groups of amino-carboxylic acids or of polyamines and polycarboxylic acids · CPC title

• C08K3/22

  of metals · CPC title