Wire processing system

US10501283B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10501283-B2
Application numberUS-201615190119-A
CountryUS
Kind codeB2
Filing dateJun 22, 2016
Priority dateJun 22, 2016
Publication dateDec 10, 2019
Grant dateDec 10, 2019

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  1. Title

    What the patent document calls the invention.

  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A wire processing system includes a tray having at least one tray surface configured to sequentially receive a first wire and a second wire from a wire feed system of a wire processing machine. The tray surface has a surface feature configured to provide a wire-to-surface coefficient of friction between the tray surface and the first wire higher than a wire-to-wire coefficient of friction between the first wire and the second wire laying on top of the first wire. The wire-to-surface coefficient of friction reduces movement of at least a portion of the first wire relative to the tray surface during movement of the second wire relative to the first wire.

First claim

Opening claim text (preview).

What is claimed is: 1. A wire processing system, comprising: a tray having at least one tray surface configured to sequentially receive a first wire and a second wire from a wire feed system of a wire processing machine; the at least one tray surface having a surface feature configured to provide a wire-to-surface coefficient of friction between the at least one tray surface and the first wire higher than a wire-to-wire coefficient of friction between the first wire and the second wire laying on top of the first wire; and the wire-to-surface coefficient of friction reducing movement of at least a portion of the first wire relative to the at least one tray surface during movement of the second wire relative to the first wire. 2. The wire processing system of claim 1 , wherein the surface feature comprises: at least one of a material layer and a material coating applied over the at least one tray surface and providing the wire-to-surface coefficient of friction higher than the wire-to-wire coefficient of friction. 3. The wire processing system of claim 2 , wherein the material layer comprises: at least one of bare metal, coated metal, painted metal, rubber, plastic, foam, fabric, cloth, rubber-impregnated cloth. 4. The wire processing system of claim 2 , wherein: the material layer is one of a rubber mat or a plastic mat. 5. The wire processing system of claim 2 , wherein: the material coating is a polymeric material. 6. The wire processing system of claim 1 , wherein the surface feature comprises: a surface texture including a plurality of geometric shapes configured to provide an increased amount of contact area between the first wire and the at least one tray surface relative to the contact area between the first wire and a tray surface without the surface texture. 7. The wire processing system of claim 6 , wherein the plurality of geometric shapes comprises: a pattern of concave and/or convex surface features sized and spaced apart at a feature spacing providing at least two discrete contact patches between the first wire and the surface features when the first wire is viewed in cross-section. 8. The wire processing system of claim 7 , wherein: the concave and/or convex surface features each have a surface feature height and a surface feature width; and the surface feature height and the surface feature width being smaller than a diameter of the first wire. 9. The wire processing system of claim 6 , wherein the plurality of geometric shapes include at least one of: pyramids, cones, cylinders, hemispheres, and raised orthogonal shapes. 10. The wire processing system of claim 6 , wherein the plurality of geometric shapes comprises: a plurality of divots. 11. The wire processing system of claim 1 , further including: at least one separator device associated with the tray and configured to promote physical separation of the first wire from the second wire. 12. The wire processing system of claim 11 , wherein the at least one separator device comprises: at least one separator post extending upwardly from the at least one tray surface and configured to have at least one of the first wire and the second wire wrap around the at least one separator post; and the at least one separator post performing at least one of the following: separating at least a portion of wire lengths of the first wire on each side of the at least one separator post; and separating at least a portion of the wire lengths of the second wire on each side of the at least one separator post. 13. The wire processing system of claim 12 , wherein the at least one separator post comprises: a plurality of separator posts including a first separator post and a second separator post positioned at spaced locations along a tray lengthwise direction in correspondence with different lengths of the first wire and the second wire. 14. The wire processing system of claim 12 , wherein the at least one separator post comprises: at least two separator posts each being individually laterally movable relative to one another to facilitate physical separation of at least a portion of the first wire from the second wire. 15. The wire processing system of claim 12 , wherein: the at least one separator post is rotatable about a vertical post axis. 16. The wire processing system of claim 12 , wherein: the at least one separator post is cone shaped. 17. The wire processing system of claim 12 , wherein: the tray has a tray end opposite the wire feed system; and the at least one separator post is located at the tray end. 18. The wire processing system of claim 12 , wherein the at least one separator post comprises: at least two separator posts laterally spaced apart from one another. 19. The wire processing system of claim 11 , wherein the separator device comprises: a vertical conveyor system mounted to the tray and having a plurality of baskets including a first basket and a second basket coupled to a vertically-oriented conveyor belt; and the vertical conveyor system configured to sequentially position the first basket at an uppermost position on the conveyor belt in a manner allowing the first basket to receive the first wire, rotate the second basket into position above the first basket to receive the second wire in the second basket, and cause the first basket and the second basket to sequentially drop the first wire and the second wire onto the tray surface during rotation of the conveyor belt. 20. A wire processing system, comprising: a long-wire supporting tray of a wire processing machine having a loop puller mechanism configured to sequentially pull a first wire and a second wire from a wire feed system along a lengthwise direction of the long-wire supporting tray and form a loop in the first wire and the second wire on the long-wire supporting tray; the long-wire supporting tray having a tray surface including a surface feature configured to provide a wire-to-surface coefficient of friction between the tray surface and the first wire higher than a wire-to-wire coefficient of friction between the first wire and the second wire laying on top of the first wire; and the wire-to-surface coefficient of friction reducing movement of at least a portion of the first wire relative to the tray surface during movement of the second wire relative to the first wire.

Assignees

Inventors

Classifications

  • H01R43/28Primary

    for wire processing before connecting to contact members, not provided for in groups H01R43/02 - H01R43/26 · CPC title

  • for joining or terminating cables · CPC title

  • Wires · CPC title

  • Separating a bundle of forwarding filamentary materials into a plurality of groups · CPC title

  • B65H59/10Primary

    by devices acting on running material and not associated with supply or take-up devices (by controlling speed of driving mechanism of material-forwarding devices B65H59/38) · CPC title

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What does patent US10501283B2 cover?
A wire processing system includes a tray having at least one tray surface configured to sequentially receive a first wire and a second wire from a wire feed system of a wire processing machine. The tray surface has a surface feature configured to provide a wire-to-surface coefficient of friction between the tray surface and the first wire higher than a wire-to-wire coefficient of friction betwe…
Who is the assignee on this patent?
Boeing Co
What technology area does this patent fall under?
Primary CPC classification H01R43/28. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Dec 10 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).