Online die face monitoring

US10500765B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10500765-B2
Application numberUS-201615383109-A
CountryUS
Kind codeB2
Filing dateDec 19, 2016
Priority dateDec 19, 2016
Publication dateDec 10, 2019
Grant dateDec 10, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A die face monitoring system may include an upper die having an upper die face and an upper die opening extending towards the upper die face. Similarly, a lower die may include a lower die face and a lower die opening extending towards the lower die face. The lower die face is arranged to confront the upper die face and form a concavity therebetween. Furthermore, a plurality of sensors are mounted on a press, with each sensor corresponding to each one of the upper and lower die openings. Each sensor emits a beam of light towards and receives a reflection from a target surface within the upper and lower die openings in order to calculate a distance thereto.

First claim

Opening claim text (preview).

What is claimed is: 1. A die face monitoring system, comprising: an upper die having an upper die face and an upper die opening extending towards the upper die face; a lower die having a lower die face and a lower die opening extending towards the lower die face, the lower die face arranged to confront the upper die face and form a concavity therebetween; and a plurality of sensors mounted on a press, wherein each sensor corresponds to each one of the upper and lower die openings, and wherein each sensor emits a beam of light towards and receives a reflection from a target surface within the upper and lower die openings in order to calculate a distance thereto; an insert arranged between the upper die and the lower die, the insert having an insert opening extending towards an insert face, wherein the insert opening is continuous with one of the upper and lower die openings. 2. The die face monitoring system of claim 1 , wherein the upper and lower die openings are tapered. 3. The die face monitoring system of claim 1 , further comprising: a controller for receiving, calculating, and storing the distances between each sensor and surface within the upper and lower die openings. 4. The die face monitoring system of claim 3 , wherein each of the upper die openings are aligned with a lower die opening. 5. The die face monitoring system of claim 4 , wherein the controller records a distance between the plurality of sensors corresponding to each of the aligned upper and lower die openings. 6. The die face monitoring system of claim 4 , wherein the controller records a distance between the sensor and the corresponding target surface. 7. The die face monitoring system of claim 4 , wherein the controller records a distance between target surfaces of the upper and lower die openings. 8. The die face monitoring system of claim 7 , wherein the distance between target surfaces of the upper and lower die openings is calculated at mold close with no tonnage and at mold close with tonnage. 9. The die face monitoring system of claim 3 , wherein the controller compares the distances between each sensor and surface within the upper and lower die openings to a predetermined baseline value. 10. A method for monitoring a condition of a die face, the method comprising: providing a die set having an upper die and a lower die, each of the upper and lower dies having a tapered opening terminating with a target surface; emitting a first beam of light from a first sensor towards the upper die target surface and receiving a first reflected signal therefrom; emitting a second beam of light from a second sensor towards the lower die target surface and receiving a second reflected signal therefrom; and calculating a distance between the upper die target surface and the lower die target surface, wherein the upper die has an upper die face and the tapered opening in the upper die extends towards the upper die face, and wherein the lower die has a lower die face and the tapered opening in the lower die extends towards the lower die face, the lower die face arranged to confront the upper die face and form a concavity therebetween. 11. The method of claim 10 , further comprising: comparing the distance between the upper die target surface and the lower die target surface to a predetermined baseline value. 12. The method of claim 10 , wherein each upper die opening is aligned with a lower die opening, and further comprising: recording a distance between the plurality of sensors corresponding to each of the aligned upper and lower die openings. 13. The method of claim 10 , wherein a graphical user interface provides instantaneous feedback regarding the calculated distance between the upper die target surface and the lower die target surface in comparison with a predetermined baseline distance. 14. The method of claim 12 , further comprising: calculating a distance between target surfaces of the upper and lower die openings at mold close with no tonnage and at mold close with tonnage.

Assignees

Inventors

Classifications

  • and impregnating the reinforcements in the closed mould, e.g. resin transfer moulding [RTM] {, e.g. by vacuum} · CPC title

  • B29C33/22Primary

    by rectilinear movement · CPC title

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What does patent US10500765B2 cover?
A die face monitoring system may include an upper die having an upper die face and an upper die opening extending towards the upper die face. Similarly, a lower die may include a lower die face and a lower die opening extending towards the lower die face. The lower die face is arranged to confront the upper die face and form a concavity therebetween. Furthermore, a plurality of sensors are moun…
Who is the assignee on this patent?
Gm Global Tech Operations Llc
What technology area does this patent fall under?
Primary CPC classification B29C33/22. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Dec 10 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).