Endoscope

Patent metadata

Field	Value
Publication number	US-10499798-B2
Application number	US-201715428147-A
Country	US
Kind code	B2
Filing date	Feb 8, 2017
Priority date	Mar 3, 2016
Publication date	Dec 10, 2019
Grant date	Dec 10, 2019

Abstract

An endoscope has an imaging unit at a tip portion of an insertion unit to be inserted into a body cavity, and the imaging unit includes: a solid-state imaging device which is disposed in such a manner that a photodetecting surface thereof crosses a longitudinal direction of the insertion unit and which performs photoelectric conversion on an optical image formed on the photodetecting surface; a circuit board having a connection surface which is opposed to a surface, opposite to the photodetecting surface and formed with connection terminals, of the solid-state imaging device and which serves for electrical connection to the connection terminals of the solid-state imaging device, wherein the circuit board is a rigid board that is L-shaped as defined herein; and a first leg and a second leg that constitute the L-shaped circuit board and are perpendicular to each other are provided as defined herein.

First claim

What is claimed is:

1. An endoscope having an imaging unit at a tip portion of an insertion unit to be inserted into a body cavity, the imaging unit comprising:
a solid-state imaging device which is disposed in such a manner that a photodetecting surface thereof crosses a longitudinal direction of the insertion unit and which performs photoelectric conversion on an optical image formed on the photodetecting surface;
a circuit board having a connection surface which is opposed to a surface, opposite to the photodetecting surface and formed with connection terminals, of the solid-state imaging device and which serves for electrical connection to the connection terminals of the solid-state imaging device, wherein:
the circuit board is a rigid board that is L-shaped when viewed in a width direction of the circuit board that is perpendicular to the longitudinal direction of the insertion unit; and
of a first leg and a second leg that constitute the L-shaped circuit board and are perpendicular to each other, the first leg which is opposed to the solid-state imaging device has the connection surface on the side of the solid-state imaging device and transmission cables are electrically connected to an inner surface of the second leg, the inner surface having a smaller area, than an area of an outer surface of the second leg, in a plane including the longitudinal direction of the insertion unit and the width direction of the circuit board, the outer surface being opposite to the inner surface,
wherein the transmission cables have four or more cables including a first cable and a second cable;
a diameter of the first cable is greater than a diameter of the second cable;
the four or more cables are arranged on the inner surface of the second leg of the circuit board in the width direction of the circuit board; and
the first cable is located at an outermost position in the width direction of the circuit board,
wherein an outer size of the solid-state imaging device is smaller than or equal to a 1-mm square when viewed perpendicularly to the photodetecting surface of the solid-state imaging device,
wherein the first leg of the circuit board has a through-hole which penetrates through the first leg from the connection surface of the first leg to a space adjacent to the inner surface of the second leg; and
the endoscope further comprises:
a heat transfer member provided in the through-hole; and
a heat radiation member which is disposed in the space and connected to the heat transfer member.

2. The endoscope according to claim 1 , wherein the circuit board is disposed so that an outermost edge of the circuit board coincides with an outermost edge of the solid-state imaging device when the circuit board and the solid-state imaging device are projected onto a plane that is perpendicular to the longitudinal direction of the insertion unit.

3. The endoscope according to claim 1 , further comprising a treatment tool channel which is disposed parallel with the longitudinal direction of the insertion unit in such a manner that the inner surface or the outer surface, opposite to the inner surface, of the second leg of the circuit board is adjacent to a side surface of the treatment tool channel when viewed in the longitudinal direction of the insertion unit.

4. The endoscope according to claim 2 , further comprising a treatment tool channel which is disposed parallel with the longitudinal direction of the insertion unit in such a manner that the inner surface or the outer surface, opposite to the inner surface, of the second leg of the circuit board is adjacent to a side surface of the treatment tool channel when viewed in the longitudinal direction of the insertion unit.

5. The endoscope according to claim 1 , wherein the heat transfer member is an electric wire.

6. The endoscope according to claim 1 , wherein:
the first cable is a coaxial cable in which a center conductor is shielded by a shield conductor that surrounds the center conductor; and
the shield conductor is electrically connected to a conductive cover member that covers the transmission cables partially.

7. The endoscope according to claim 1 , wherein a clock signal cable and an output signal cable are provided as first cables.

8. The endoscope according to claim 6 , wherein a clock signal cable and an output signal cable are provided as first cables.

9. The endoscope according to claim 1 , wherein the connection surface of the circuit board is directly connected to the connection terminals of the solid-state imaging device.

10. The endoscope according to claim 2 , wherein the connection surface of the circuit board is directly connected to the connection terminals of the solid-state imaging device.

Assignees

• Fujifilm Corp

Inventors

• Kitano Ryo

Classifications

• H04N23/55

  Optical parts specially adapted for electronic image sensors; Mounting thereof · CPC title

• H04N23/54

  Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils · CPC title

• H04N23/57

  Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices · CPC title

• H04N23/555

  for picking-up images in sites, inaccessible due to their dimensions or hazardous conditions, e.g. endoscopes or borescopes · CPC title

• A61B1/00018

  using electrical cables · CPC title