Cooking vessel with a thermal sensor

US10499759B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10499759-B2
Application numberUS-201715427677-A
CountryUS
Kind codeB2
Filing dateFeb 8, 2017
Priority dateFeb 11, 2016
Publication dateDec 10, 2019
Grant dateDec 10, 2019

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

According to one example, a cookware apparatus includes a vessel. The vessel includes a bottom, and a sidewall surrounding the bottom and extending upward from the bottom so as to form a fluid retaining interior region. The sidewall terminates at a rim. The vessel also includes a channel extending through a portion of the bottom and further extending upward into and through a portion of the sidewall. The channel has an opening positioned in an external surface of the sidewall. The cookware apparatus further includes a thermal sensor positioned within the channel. The thermal sensor extends through the portion of the bottom and further extends upward into and through the portion of the sidewall.

First claim

Opening claim text (preview).

What is claimed is: 1. A method, comprising: a. providing a preform, the preform having: i. a first bottom with a first diameter; and ii. a first upward extending sidewall surrounding the first bottom and extending upward from the first bottom so as to form a fluid retaining interior region of the preform, the first sidewall terminating at a first rim and having a first height; b. forming a first channel in the first bottom, the first channel having an opening in an external surface of the first bottom; c. drawing the preform into the shape of a vessel, the vessel having: i. a second bottom with a second diameter that is smaller than the first diameter; ii. a second upward extending sidewall surrounding the second bottom and extending upward from the second bottom so as to form a fluid retaining interior region of the vessel, the second sidewall terminating at a second rim and having a second height that is greater than the first height; and iii. a second channel extending through a portion of the second bottom and further extending upward into and through a portion of the second sidewall, the second channel having an opening positioned in an external surface of the second sidewall; d. positioning a thermal sensor within the second channel so that a thermal sensing device of the thermal sensor is positioned within the portion of the second bottom, and further so that one or more sensor leads of the thermal sensor extend from the portion of the second bottom upward into and through the portion of the second sidewall, and further so that the one or more sensor leads extend out of the opening in the external surface of the second sidewall; e. routing the one or more sensor leads within a flange of a handle; f. coupling the flange of the handle to the vessel, wherein the flange is coupled to the vessel in a position over the opening in the external surface of the second sidewall, wherein an electronic circuit is positioned on or in the handle; and g. coupling the one or more sensor leads to the electronic circuit. 2. A method, comprising: a. providing a preform, the preform having: i. a first bottom with a first diameter; ii. a first upward extending sidewall surrounding the first bottom and extending upward from the first bottom so as to form a fluid retaining interior region of the preform, the first sidewall terminating at a first rim and having a first height; and iii. a first channel formed in the first bottom and having an opening in an external surface of the first bottom; b. changing the preform into the shape of a vessel, the vessel having: i. a second bottom with a second diameter that is smaller than the first diameter; ii. a second upward extending sidewall surrounding the second bottom and extending upward from the second bottom so as to form a fluid retaining interior region of the vessel, the second sidewall terminating at a second rim and having second height that is greater than the first height; and iii. a second channel extending through a portion of the second bottom and further extending upward into and through a portion of the second sidewall, the second channel having an opening positioned in an external surface of the second sidewall; and c. positioning a thermal sensor within the second channel, the thermal sensor extending through the portion of the second bottom and further extending upward into and through the portion of the second sidewall. 3. The method of claim 2 , further comprising forming the first channel in the first bottom of the preform. 4. The method of claim 2 , further comprising forming the preform from a disk. 5. The method of claim 2 , wherein changing the preform into the shape of the vessel comprises drawing the preform into the shape of the vessel. 6. The method of claim 2 , further comprising: a. coupling a handle to the vessel, the handle having an electronic circuit positioned on or in the handle; and b. coupling a portion of the thermal sensor to the electronic circuit. 7. The method of claim 6 , wherein coupling the handle to the vessel comprises coupling a flange of the handle to the vessel, wherein the flange is coupled to the vessel in a position over the opening in the external surface of the second sidewall. 8. The method of claim 2 , wherein the thermal sensor comprises: a. a thermal sensing device; and b. one or more sensor leads communicatively coupled to the thermal sensing device. 9. The method of claim 8 , further comprising: a. coupling a handle to the vessel, the handle having an electronic circuit positioned on or in the handle; and b. coupling the one or more sensor leads to the electronic circuit. 10. The method of claim 2 , wherein the vessel is a pot, a pan, a skillet, a sauté pan, a stock pot, or a chefs pan.

Assignees

Inventors

Classifications

  • with food recipients having temperature sensing capability · CPC title

  • Handles having indicating means, e.g. for temperature (A47J45/07 takes precedence) · CPC title

  • Saucepan, frying-pan handles (A47J45/07 takes precedence) · CPC title

  • for cooking plates or the like · CPC title

  • Cook-top or cookware capable of communicating with each other · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US10499759B2 cover?
According to one example, a cookware apparatus includes a vessel. The vessel includes a bottom, and a sidewall surrounding the bottom and extending upward from the bottom so as to form a fluid retaining interior region. The sidewall terminates at a rim. The vessel also includes a channel extending through a portion of the bottom and further extending upward into and through a portion of the sid…
Who is the assignee on this patent?
Meyer Intellectual Properties Ltd
What technology area does this patent fall under?
Primary CPC classification A47J27/002. Mapped technology areas include Human Necessities.
When was this patent published?
Publication date Tue Dec 10 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).