Thermal head with a thermal barrier for integrated circuit die processing

Patent metadata

Field	Value
Publication number	US-10499461-B2
Application number	US-201514976881-A
Country	US
Kind code	B2
Filing date	Dec 21, 2015
Priority date	Dec 21, 2015
Publication date	Dec 3, 2019
Grant date	Dec 3, 2019

Abstract

A thermal heat for integrated circuit die processing is described that includes a thermal barrier. In one example, the thermal head has a ceramic heater configured to carry an integrated circuit die, a metal base, and a thermal barrier between the heater and the base.

First claim

What is claimed is:

1. An apparatus comprising:
a ceramic heater configured to carry an integrated circuit die after having been diced for thermal test;
a metal base;
a composite thermal barrier having at least three layers between the heater and the base, wherein the thermal barrier comprises a ceramic coating adjacent the ceramic heater, a ceramic coating adjacent the metal base, and a polyimide between the ceramic coatings; and
fluid channels in the metal base, extending through the composite thermal barrier, and in the ceramic heater.

2. The apparatus of claim 1 , wherein the thermal barrier comprises an epoxy sheet.

3. The apparatus of claim 2 , wherein the epoxy sheet includes thermally conductive ceramic fillers.

4. The apparatus of claim 2 , wherein the epoxy sheet includes metallic alloy fillers.

5. The apparatus of claim 2 , wherein the thermal barrier comprises a first adhesive layer between the epoxy sheet and the ceramic heater and a second adhesive layer between the epoxy sheet and the metal base.

6. The apparatus of claim 1 , further comprising a surface treatment on the metal base to improve adhesion to the thermal barrier.

7. The apparatus of claim 1 , further comprising an electrical integrated circuit connector over the ceramic heater to connect to the integrated circuit die to test the integrated circuit die through different thermal loads while being heated by the ceramic heater.

8. The apparatus of claim 1 , wherein the fluid channels control the temperature of the ceramic heater.

9. The apparatus of claim 1 , wherein the integrated circuit die is in a package.

10. An integrated circuit package test system comprising:
a heater plate having fluid channels to carry a fluid to control the temperature of the heater plate;
an integrated circuit package socket on the heater plate to carry a packaged integrated circuit die;
a base plate to support the heater plate;
a composite thermal barrier having at least three layers attached to the heater plate and to the base plate, wherein the fluid channels of the heater plate extend through the at least three layers of the composite thermal barrier, and are in the base plate, wherein the thermal barrier comprises a ceramic coating adjacent the heater plate, a ceramic coating adjacent the base plate, and a polyimide between the ceramic coatings; and
a test controller coupled to the socket to drive the packaged integrated circuit die during a test.

11. The system of claim 10 , further comprising a heat exchanger connected to the fluid channels to control the temperature of a fluid in the fluid channels.

12. A method comprising:
placing a packaged integrated circuit die into a socket, the socket being on a heater plate, the heater plate being supported by a base plate and attached to the base plate by a composite thermal barrier having at least three layers between the heater plate and the base plate, wherein the thermal barrier comprises a ceramic coating adjacent the heater plate, a ceramic coating adjacent the base plate, and a polyimide between the ceramic coatings;
controlling the temperature of the heater plate using a fluid in fluid channels of the heater plate, wherein the fluid channels of the heater plate extend through the at least three layers of the composite thermal barrier, and are in the base plate; and
applying test signals to the die through the socket.

13. The method of claim 12 , wherein controlling the temperature comprises heating a fluid in a heat exchanger and driving the fluid through the fluid channels.

Assignees

• Intel Corp

Inventors

• Mamodia Mohit
• Yazzie Kyle
• Xu Dingying
• Liu Kuang
• Diglio Paul J
• Malatkar Pramod

Classifications

• G01R31/2875

  related to heating · CPC title

• H05B3/267 Primary

  the insulating base being an organic material, e.g. plastic (H05B3/262 takes precedence) · CPC title

• G01R31/2867

  Handlers or transport devices, e.g. loaders, carriers, trays · CPC title