Microphone assembly with digital feedback loop

Patent metadata

Field	Value
Publication number	US-10499150-B2
Application number	US-201615202404-A
Country	US
Kind code	B2
Filing date	Jul 5, 2016
Priority date	Jul 5, 2016
Publication date	Dec 3, 2019
Grant date	Dec 3, 2019

Abstract

A microphone assembly includes a transducer and a processing circuit. The processing circuit includes an analog-to-digital converter (ADC) configured to receive, sample and quantize an electrical signal generated by the transducer to generate a corresponding digital signal. The processing circuit includes a feedback path including a digital loop filter configured to receive and filter the digital signal to provide a first digital feedback signal and a digital-to-analog converter (DAC) configured to convert the first digital feedback signal into a corresponding analog feedback signal. The processing circuit additionally includes a summing node configured to combine the electrical signal and the analog feedback signal.

First claim

What is claimed is:

1. A microphone assembly comprising:
a capacitive transducer having first and second spaced-apart plates and configured to convert sound into an electrical signal at a transducer output;
a forward signal processing path comprising:
a signal conditioning circuit comprising an input node connected to the transducer output for receipt of the electrical signal, the signal conditioning circuit configured to amplify or buffer the electrical signal; and
an analog-to-digital converter (ADC) configured to receive, sample and quantize the amplified or buffered electrical signal to generate a digital signal; and

a feedback signal processing path comprising:
a pulse modulator configured to generate a digital control signal based on the digital signal obtained from the forward signal processing path; and
a current converter circuit having an input coupled to the pulse modulator and configured to generate a sequence of variable current pulses based on the digital control signal, an output of the current converter circuit coupled to one of the first and second spaced-apart plates of the transducer, wherein the variable current pulses add charge to, or subtract charge from, the capacitive transducer such that low frequencies of the electrical signal are suppressed before the electrical signal is input to the signal conditioning circuit.

2. The microphone assembly of claim 1 , wherein the feedback signal processing path further comprises a digital loop filter disposed between the forward signal processing path and the pulse modulator, wherein the electrical signal at least partially reduces low frequency overload and distortion of the signal conditioning circuit.

3. The microphone assembly of claim 2 , wherein the ADC comprises:
a sigma-delta modulator configured to generate an N-Bit digital signal at a first sampling frequency, wherein N>0;
a decimator between the sigma-delta modulator and the digital loop filter, the decimator configured to convert the N-Bit digital signal into an M-Bit digital signal at a second sampling frequency, wherein the second sampling frequency is lower than the first sampling frequency and wherein M>1; and
wherein the M-bit digital signal is input to the digital loop filter.

4. The microphone assembly of claim 2 , wherein the digital loop filter is a low pass filter comprising a fixed or configurable transfer function.

5. The microphone assembly of claim 2 , further comprising a housing having a port, wherein the transducer is a microelectromechanical systems (MEMS) transducer, and wherein the transducer is disposed in the housing.

6. The microphone assembly of claim 5 , wherein the transducer has a capacitance between 0.5 pF and 10 pF.

7. The microphone assembly of claim 2 , further comprising a command and control interface for receipt of filter configuration data from a host processor, wherein the digital loop filter is programmable with the filter configuration data.

8. The microphone assembly of claim 2 , wherein the feedback signal processing path further comprises a noise-shaping quantizer disposed between the digital loop filter and the pulse modulator.

9. The microphone assembly of claim 1 , wherein the output of the current converter circuit is directly connected to one of the first and second spaced-apart plates of the transducer.

10. The microphone assembly of claim 1 , further comprising a housing comprising a sound port, the housing enclosing the transducer, the signal conditioning circuit, the ADC, the pulse modulator, and the current converter circuit.

11. The microphone assembly of claim 10 , wherein the pulse modulator is a pulse width and pulse amplitude modulator.

12. The microphone assembly of claim 10 in combination with a portable communication device.

13. The microphone assembly of claim 10 , wherein the input node of the signal conditioning circuit is DC-coupled to the transducer output.

14. A semiconductor die comprising:
a forward signal processing path comprising:
a conditioning circuit comprising an input node connectable to a capacitive microelectromechanical systems (MEMS) transducer having first and second plates, the conditioning circuit configured to amplify or buffer an analog electrical signal output by the transducer when connected thereto; and
an analog-to-digital converter (ADC) configured to receive, sample and quantize the amplified or buffered electrical signal to generate a digital signal; and

a feedback path comprising:
a pulse modulator configured to generate a control signal based on the digital signal obtained from the forward signal processing path; and
a current converter circuit having an input coupled to the pulse modulator and configured to generate a sequence of variable current pulses based on the control signal, wherein the variable current pulses add charge to, or subtract charge from, the capacitive transducer such that low frequencies of the electrical signal are suppressed before the electrical signal is input to the conditioning circuit when an output of the current converter circuit is coupled to one of the first or second plates of the transducer.

15. The semiconductor die of claim 14 , wherein the feedback path further comprises a digital loop filter disposed between the ADC and the pulse modulator, and a noise-shaping quantizer disposed between the digital loop filter and the pulse modulator, wherein the electrical signal at least partially reduces low frequency overload and distortion of the forward signal processing path.

16. A microphone assembly comprising:
a capacitive microelectromechanical systems (MEMS) transducer having first and second electrodes, the transducer configured to generate an electrical signal in response to detecting a change in air pressure, the electrical signal including frequencies in a first frequency range and frequencies in a second frequency range, the first frequency range higher than DC and the second frequency range higher than the first frequency range;
a processing circuit coupled to the transducer, the processing circuit configured to generate an output audio signal based on the electrical signal generated by the transducer, the processing circuit comprising an analog to digital converter configured to generate a digital signal; and
a compensation circuit coupled to the processing circuit and the first or second electrode of the transducer, the compensation circuit configured to generate a variable feedback signal based on the digital signal and provide the variable feedback signal to the first or second electrode of the transducer;
wherein the variable feedback signal adds charge to, or subtracts charge from, the capacitive transducer such that frequencies in the first frequency range are suppressed before the electrical signal is applied to the processing circuit.

17. The microphone of claim 16 , wherein the first frequency range includes frequencies below a human audible range of frequencies and the second frequency range includes frequencies within the human audible range, and wherein the compensation circuit is configured to cancel frequencies below the human audible range from the electrical signal before the electrical signal is applied to the processing circuit.

18. The microphone assembly of claim 17 , further comprising a housing, the transducer, the processing circuit, and the compensation circuit disposed in the housing and an output of the processing circuit coupled to an electrical interface contact of the microphone assembly.

19. The microphone assembly of claim 18 , the c

Assignees

• Knowles Electronics Llc

Inventors

• Shajaan Mohammad
• Fürst Claus Erdmann
• Høvesten Per Flemming
• Berthelsen Kim Spetzler
• Thomsen Henrik

Classifications

• H03F3/34

  DC amplifiers in which all stages are DC-coupled (H03F3/45 takes precedence) · CPC title

• H03M3/48

  characterised by the type of range control, e.g. limiting · CPC title

• H03M1/181

  in feedback mode, i.e. by determining the range to be selected from one or more previous digital output values · CPC title

• H03G3/30

  in amplifiers having semiconductor devices · CPC title

• H04R3/04 Primary

  for correcting frequency response · CPC title