Three-dimensional power distribution interconnect structure

Patent metadata

Field	Value
Publication number	US-10498116-B2
Application number	US-201715813696-A
Country	US
Kind code	B2
Filing date	Nov 15, 2017
Priority date	Jun 4, 2014
Publication date	Dec 3, 2019
Grant date	Dec 3, 2019

Abstract

An electrical power distribution system for a mobile platform, and a method for making such, includes a forming a substrate having a first panel connected to a second panel. The first panel resides in a first plane that differs from a second plan in which the second panel resides. One or more bus bars are arranged on the first panel, with one or more power electronic devices arranged on the first panel and connected to the one or more bus bars. One or more connectors are arranged on the second panel and electrically connected to the one or more bus bars. Finally, one or more thermal relief devices are arranged in contact with the substrate.

First claim

The invention claimed is:

1. A method of making an electrical power distribution system for a mobile platform, comprising:
forming a substrate comprising a first panel and a second panel, the first panel residing in a first plane and the second panel residing in a second plane that differs from the first plane;
disposing an electrically insulating layer on the first panel;
arranging a control circuit on the electrically insulating layer including one or more bus bars;
arranging one or more connectors on the second panel of the substrate;
disposing one or more power electronics devices on the one or more bus bars; and
arranging one or more thermal relief devices in contact with the substrate.

2. The method of claim 1 , further comprising arranging the substrate in a housing, the second panel being attached to a wall of the housing, the one or more connectors extending through the wall of the housing.

3. The method of claim 1 , wherein the step of forming the substrate is performed by an additive process.

4. The method of claim 1 , wherein the step of disposing the one or more power electronics devices is performed via low temperature transient liquid phase sintering.

5. The method of claim 1 , wherein the step of arranging the control circuit comprises depositing a wiring pattern and the bus bars via cold spray.

Assignees

• Hamilton Sundstrand Corp

Inventors

• Pal Debabrata
• Krenz Michael
• Horowy John
• Karlen Eric

Classifications

• H05K7/2089 Primary

  for power electronics, e.g. for inverters for controlling motor · CPC title

• B60R16/02

  electric {constitutive elements} · CPC title

• H02B1/20

  Bus-bar or other wiring layouts, e.g. in cubicles, in switchyards (installations of bus-bars H02G5/00) · CPC title

• H02B1/015

  Boards, panels, desks; Parts thereof or accessories therefor · CPC title

• H02B1/56 Primary

  Cooling; Ventilation · CPC title