Molded interconnect substrate for a cable assembly

Patent metadata

Field	Value
Publication number	US-10498085-B2
Application number	US-201815909367-A
Country	US
Kind code	B2
Filing date	Mar 1, 2018
Priority date	Mar 1, 2018
Publication date	Dec 3, 2019
Grant date	Dec 3, 2019

Abstract

An electrical device includes a molded interconnect substrate having a top surface and a bottom surface, the substrate having a mold component and a laser direct structuring component. A conductive circuit is formed along the top surface having one or more signal contacts and one or more ground contacts. The electrical device includes a communication cable having a differential pair of signal conductors and a grounding element. The communication cable has a cable jacket surrounding the signal conductors and the grounding element. Each signal conductor has a wire-terminating end that is coupled to a corresponding signal contact, the wire-terminating end projecting beyond a jacket edge of the cable jacket.

First claim

What is claimed is:

1. An electrical device comprising:
a molded interconnect substrate having a top surface and a bottom surface, the substrate having a three-dimensional molding component molded on the top surface and a laser direct structuring component embedded with the molding component;
a conductive circuit formed from the laser direct structuring component along the molding component of the top surface, the conductive circuit having one or more signal contacts and one or more ground contacts; and
a communication cable including a differential pair of signal conductors and a grounding element providing electrical shielding for the signal conductors; wherein the communication cable has a cable jacket surrounding the signal conductors and the grounding element; wherein each signal conductor has a wire-terminating end that is coupled to a corresponding signal contact, the wire-terminating end projecting beyond a jacket edge of the cable jacket, wherein the grounding element is coupled to a corresponding ground contact.

2. The electrical device of claim 1 , wherein the one or more signal contacts are positioned at a first level being coplanar with the top surface, and the one or more ground contacts are positioned at a second level adjacent the grounding element.

3. The electrical device of claim 1 , further comprising one or more alignment elements positioned along the top surface of the molded interconnect substrate and configured to align the signal conductors and grounding element of the communication cable with corresponding signal contacts and corresponding ground contacts of the conductive circuit.

4. The electrical device of claim 1 , further comprising a ground-terminating component electrically coupled to the one or more ground contacts, the ground-terminating component having a main panel with a connective terminal electrically coupled to the grounding element.

5. The electrical device of claim 1 , wherein the molded interconnect substrate has a manufacturing tolerance of about +/−0.05 or less.

6. The electrical device of claim 1 , wherein the molded interconnect substrate includes positioning elements configured for engagement during automated assembly.

7. The electrical device of claim 1 , wherein the molded interconnect substrate is nonplanar having three dimensional features.

8. The electrical device of claim 1 , wherein the conductive circuit is established via laser structuring technology.

9. The electrical device of claim 1 , further comprising a second conductive circuit formed along the bottom surface, the second conductive circuit having one or more signal contacts and one or more ground contacts;
a second communication cable including a differential pair of signal conductors and a grounding element; wherein the second communication cable has a cable jacket surrounding the signal conductors and the grounding element; wherein each signal conductor has a wire-terminating end that is coupled to a corresponding signal contact of the second conductive circuit, the wire-terminating end projecting beyond a jacket edge of the cable jacket, wherein the grounding element of the second communication cable is coupled to a corresponding ground contact of the second conductive circuit; and
a second ground-terminating component electrically coupled to the one or more ground contacts of the second conductive circuit, the second ground-terminating component having a main panel with a connective terminal electrically coupled to the grounding element of the second communication cable.

10. An electrical device comprising:
a molded interconnect substrate having a top surface, the molded interconnect substrate formed from a three-dimensional molding component molded on the top surface and a laser direct structuring component embedded with the molding component;
a conductive circuit formed from the laser direct structuring component along the molding component of the top surface, the conductive circuit having one or more signal contacts and one or more ground contacts configured to electrically couple with one or more communication cables; and
an alignment element positioned along the top surface of the molded interconnect substrate and configured for alignment of one or more communication cables with the corresponding one or more signal contacts and one or more ground contacts of the conductive circuit.

11. The electrical device of claim 10 , wherein the signal contacts are positioned at a first level being coplanar with the top surface, and the ground contacts are positioned at a second level being non-coplanar with the first level.

12. The electrical device of claim 10 , further comprising a ground-terminating component configured to electrically couple to the at least one ground contact, the ground-terminating component having a main panel with a connective terminal configured to electrically couple to the one or communication cables.

13. The electrical device of claim 10 , wherein the molded interconnect substrate has with a manufacturing tolerance of about +/−0.05 or less.

14. The electrical device of claim 10 , wherein the molded interconnect substrate includes positioning elements configured for engagement during automated assembly.

15. The electrical device of claim 10 , wherein the molded interconnect substrate is nonplanar having three dimensional features.

16. The electrical device of claim 10 , wherein the conductive circuit is established via laser structuring technology.

17. The electrical device of claim 10 , further comprising a second conductive circuit formed along a bottom surface of the molded interconnect substrate, the second conductive circuit having one or more signal contacts and one or more ground contacts configured to electrically and mechanically couple with one or more communication cables;
a second alignment element positioned along the bottom surface of the molded interconnect substrate and configured for alignment of one or more communication cables with the corresponding one or more signal contacts and one or more ground contacts of the second conductive circuit.

18. A cable assembly, comprising:
a molded interconnect substrate having a top surface, the substrate having a three-dimensional molding component molded on the top surface and a laser direct structuring component embedded with the molding component;
a conductive circuit established from the laser direct structuring component along the molding component of the top surface via laser direct structuring technology, the conductive circuit having one or more signal contacts and one or more ground contacts;
a communication cable including a differential pair of signal conductors and a grounding element; wherein the communication cable has a cable jacket surrounding the signal conductors and the grounding element; wherein each signal conductor has a wire-terminating end that is coupled to a corresponding signal contact, the wire-terminating end projecting beyond a jacket edge of the cable jacket, wherein the grounding element is coupled to a corresponding ground contact; and
an alignment element formed from the three dimensional molding component positioned along the top surface of the molded interconnect substrate and configured to align the signal conductors and grounding element of the communication cable with corresponding one or more signal contacts and ground contacts of the conductive circuit.

19. The cable assembly of claim 18 , wherein the one or more signal contacts are positioned at a first level being coplanar with the top surface, and t

Assignees

• Te Connectivity Corp

Inventors

• Dill Iii Gustaf Emil

Classifications

• H05K2201/10356

  Cables · CPC title

• H05K1/119

  Details of rigid insulating substrates therefor, e.g. three-dimensional details (H05K1/117 takes precedence) · CPC title

• H01R12/55

  characterised by the terminals · CPC title

• H01R12/53

  connecting to cables except for flat or ribbon cables · CPC title

• H05K3/403

  Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof (H05K3/4092 takes precedence) · CPC title