Integrated piezoelectric microelectromechanical ultrasound transducer (PMUT) on integrated circuit (IC) for fingerprint sensing

Patent metadata

Field	Value
Publication number	US-10497747-B2
Application number	US-201514829404-A
Country	US
Kind code	B2
Filing date	Aug 18, 2015
Priority date	Nov 28, 2012
Publication date	Dec 3, 2019
Grant date	Dec 3, 2019

Abstract

Microelectromechanical (MEMS) devices and associated methods are disclosed. Piezoelectric MEMS transducers (PMUTs) suitable for integration with complementary metal oxide semiconductor (CMOS) integrated circuit (IC), as well as PMUT arrays having high fill factor for fingerprint sensing, are described.

First claim

What is claimed is:

1. A microelectromechanical systems (MEMS) device, comprising:
a MEMS ultrasonic transducer (MUT) structure and a piezoelectric material disposed over a plurality of cavities within the MEMS device comprising a piezoelectric MUT (PMUT) array of a fingerprint sensor adapted to sense a characteristic of a fingerprint placed adjacent to the MUT structure;
a first metal conductive layer deposited on a first side of the piezoelectric material; and
a second conductive layer on a second side of the piezoelectric material configured to form electrical connections between the first metal conductive layer, the piezoelectric material, and an active complementary metal oxide semiconductor (CMOS) structure of a CMOS layer, wherein the MUT structure and the CMOS layer are vertically stacked, wherein the PMUT array comprises the MUT structure in an array of MUT structures, and wherein the MUT structure and the array of MUT structures comprise a first two of the array of MUT structures in a rhombus configuration and a second two of the array of MUT structures in a hexagonal configuration arranged as a unit cell.

2. The MEMS device of claim 1 , wherein
the first metal conductive layer and the second conductive layer are connected to a plurality of electrodes with the CMOS layer.

3. The MEMS device of claim 2 , wherein
the MEMS device is configured to have a voltage applied to the piezoelectric material via the plurality of electrodes.

4. The MEMS device of claim 2 , wherein the first metal conductive layer and the second conductive layer comprise at least one of Molybdenum, Aluminum, Ruthenium, Tungsten, or Platinum.

5. The MEMS device of claim 4 , wherein the CMOS layer is configured to at least one of transmit or receive signals to or from the MEMS device.

6. The MEMS device of claim 2 , further comprising:
at least one bond pad that connects at least one of the first metal conductive layer and the second conductive layer to the CMOS layer.

7. The MEMS device of claim 1 , wherein the piezoelectric material comprises at least one of aluminum nitride, lead zirconate titanate (PZT), zinc oxide, polyvinylidene difluoride (PVDF), lithium niobate (LiNbO 3 ).

8. The MEMS device of claim 1 , further comprising:
a piezoelectric layer comprising an aluminum nitride (AlN) seed layer, disposed between a bottom metal layer, and an aluminum nitride (AlN) layer.

9. The MEMS device of claim 1 , wherein the PMUT array is formed integrally to a CMOS wafer comprising the CMOS layer and the active CMOS structure.

10. A microelectromechanical systems (MEMS) device:
a complementary metal oxide semiconductor (CMOS) device wafer associated with a piezoelectric MEMS ultrasound transducer (PMUT) array of a fingerprint sensor, wherein the CMOS device wafer has a plurality of cavities within the CMOS device wafer and configured in an array;
a first metal conductive layer disposed over the CMOS device wafer and over the plurality of cavities;
a piezoelectric material disposed on the first metal conductive layer; and
a second metal conductive layer, adjacent to the piezoelectric material, electrically coupling the second metal conductive layer and at least one CMOS device wafer electrode, and electrically coupling the first metal conductive layer to at least one other CMOS device wafer electrode, wherein the plurality of cavities, the piezoelectric material, the first metal conductive layer, and the second metal conductive layer are configured as a plurality of PMUT structures, wherein the plurality of PMUT structures comprise a first two of the plurality of PMUT structures in a rhombus configuration and a second two of the plurality of PMUT structures in a hexagonal configuration arranged as a unit cell.

11. The MEMS device of claim 10 , wherein the plurality of PMUT structures are formed integrally to a CMOS structure, and wherein the fingerprint sensor is adapted to sense a characteristic of a fingerprint placed adjacent to the PMUT array and opposite the plurality of cavities.

12. The MEMS device of claim 10 , wherein the piezoelectric material comprises at least one of aluminum nitride, lead zirconate titanate (PZT), zinc oxide, polyvinylidene difluoride (PVDF), lithium niobate (LiNbO 3 ).

13. The MEMS device of claim 10 , further comprising:
at least one bottom electrode electrically coupled to at least one top electrode via the piezoelectric material.

14. The MEMS device of claim 13 , further comprising:
an acoustic propagation layer disposed over the at least one top electrode.

Assignees

• Invensense Inc

Inventors

• Tsai Julius Ming-Lin
• Daneman Michael

Classifications

• G01N2291/023

  Solids · CPC title

• G01N29/2437

  Piezoelectric probes · CPC title

• B81C1/00246

  Monolithic integration, i.e. micromechanical structure and electronic processing unit are integrated on the same substrate · CPC title

• H01L27/20 Primary

  Electricity · mapped topic

• G06K9/00006

  Physics · mapped topic