Light-emitting device

Patent metadata

Field	Value
Publication number	US-10497681-B2
Application number	US-201815924461-A
Country	US
Kind code	B2
Filing date	Mar 19, 2018
Priority date	Sep 18, 2015
Publication date	Dec 3, 2019
Grant date	Dec 3, 2019

Abstract

A light-emitting device includes a substrate, a light-emitting component, a wavelength conversion component, an adhesive and a reflective layer. The light-emitting component is disposed on the substrate. The wavelength conversion component includes a high-density phosphor layer and a lower-density phosphor layer. The adhesive is formed between the light-emitting device and the high-density phosphor layer. The reflective layer is formed above the substrate and covers a lateral surface of the light-emitting component, a lateral surface of the adhesive and a lateral surface of the wavelength conversion component.

First claim

What is claimed is:

1. A light-emitting device, comprises:
a substrate;
a light-emitting component disposed on the substrate and electrically connected thereto;
a wavelength conversion layer, disposed on the light-emitting component and having a high-density phosphor layer and a low-density phosphor layer stacked vertically, wherein the high-density phosphor layer has a substantially uniform thickness;
an adhesive layer disposed between the light-emitting component and the substrate and covering an upper surface and a portion of a lateral surface of the light-emitting component, wherein the high-density phosphor layer is spaced from the upper surface of the light-emitting component by the adhesive layer; and
a reflective layer disposed above the substrate and at least surrounding the light-emitting component and the adhesive layer, wherein the reflective layer has an inclined reflective surface, the inclined reflective surface contacts a portion of the light-emitting component and is gradually away from the light-emitting component along a direction from the substrate toward the wavelength conversion layer.

2. The light-emitting device according to claim 1 , wherein the high-density phosphor layer is disposed between the low-density phosphor layer and the light-emitting component.

3. The light-emitting device according to claim 1 wherein the inclined reflective surface is a convex surface facing the wavelength conversion layer, the adhesive layer and the light-emitting component.

4. The light-emitting device according to claim 1 , wherein the reflective layer covers at least a portion of a lateral surface of the wavelength conversion layer.

5. The light-emitting device according to claim 1 , wherein an area of a bottom surface of the wavelength conversion layer is larger than an area of the upper surface of the light-emitting component.

6. The light-emitting device according to claim 1 , wherein the light-emitting device has a flat top surface comprising the reflective layer and the wavelength conversion layer surrounded by the reflective layer.

7. The light-emitting device according to claim 1 , wherein the light-emitting device has a flat lateral surface comprising the reflective layer and the substrate.

8. A light-emitting device, comprises:
a substrate;
a light-emitting component disposed on the substrate and electrically connected thereto;
a wavelength conversion layer disposed on the light-emitting component and at least covering an upper surface of the light-emitting component, wherein the wavelength conversion layer has a substantially uniform thickness and is spaced from the upper surface of the light-emitting component by an adhesive layer adhering the wavelength conversion layer to the light-emitting component; and
a reflective layer disposed above the substrate and surrounding the light-emitting component and the wavelength conversion layer, wherein the reflective layer has a reflective surface, the reflective surface contacts at least a portion of the light-emitting component and a portion of the wavelength conversion layer.

9. The light-emitting device according to claim 8 , wherein the wavelength conversion layer comprises a high-density phosphor layer and a low-density phosphor layer stacked vertically.

10. The light-emitting device according to claim 9 , wherein the high-density phosphor layer is disposed between the low-density phosphor layer and the light-emitting component.

11. The light-emitting device according to claim 8 , wherein the reflective layer covers at least a portion of a lateral surface of the wavelength conversion layer.

12. The light-emitting device according to claim 8 , wherein an area of a bottom surface of the wavelength conversion layer is equal to an area of the upper surface of the light-emitting component.

13. The light-emitting device according to claim 8 , wherein the light-emitting device has a flat lateral surface comprising the reflective layer and the substrate.

14. A light-emitting device, comprises:
a substrate;
a light-emitting component disposed on the substrate and electrically connected thereto;
a wavelength conversion layer disposed on the light-emitting component, wherein the wavelength conversion layer has a substantially uniform thickness;
an adhesive layer disposed between the light-emitting component and the substrate and covering an upper surface and at least a portion of the lateral surface of the light-emitting component, wherein the wavelength conversion layer is spaced from the upper surface of the light-emitting component by the adhesive layer; and
a reflective layer disposed above the substrate and surrounding the light-emitting component, the adhesive layer and the wavelength conversion layer, wherein the reflective layer has an inclined reflective surface, the inclined reflective surface contacts a portion of the light-emitting component and a portion of the wavelength conversion layer, and the inclined reflective surface is gradually away from the light-emitting component along a direction from the substrate toward the wavelength conversion layer;
wherein the light-emitting device has a flat lateral surface comprising the reflective layer and the substrate.

15. The light-emitting device according to claim 14 , wherein the wavelength conversion layer comprises a high-density phosphor layer and a low-density phosphor layer stacked vertically.

16. The light-emitting device according to claim 15 , wherein the high-density phosphor layer is disposed between the low-density phosphor layer and the light-emitting component.

17. The light-emitting device according to claim 14 wherein the inclined reflective surface is a convex surface facing the wavelength conversion layer, the adhesive layer and the light-emitting component.

18. The light-emitting device according to claim 14 , wherein the reflective layer covers at least a portion of a lateral surface of the wavelength conversion layer.

Assignees

• Genesis Photonics Inc

Inventors

• Hung Cheng-Wei
• Chang Jui-Fu
• Hung Chin-Hua
• Lin Yu-Feng

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/00 Primary

  Package configurations · CPC title

• H01L33/508

  Electricity · mapped topic

• H01L33/56

  Electricity · mapped topic

• H01L33/486

  Electricity · mapped topic