Integrated power semiconductor packaging apparatus and power converter

Patent metadata

Field	Value
Publication number	US-10497642-B2
Application number	US-201815981975-A
Country	US
Kind code	B2
Filing date	May 17, 2018
Priority date	May 17, 2017
Publication date	Dec 3, 2019
Grant date	Dec 3, 2019

Abstract

The present disclosure relates to an integrated power semiconductor packaging apparatus and a power converter containing the integrated power semiconductor packaging apparatus. The integrated power semiconductor packaging apparatus comprises a plurality of power semiconductor devices and an electrically insulative substrate formed integrally. The electrically insulative substrate comprises a flat surface, at least one separation wall protruding from the flat surface and a flow channel inside the electrically insulative substrate. The at least one separation wall is configured to separate the flat surface into a plurality of flat areas, and each of the plurality of flat areas is configured to receive one of the plurality of power semiconductor devices. The flow channel is configured for allowing a coolant flowing through to remove heat from the plurality of power semiconductor devices.

First claim

The invention claimed is:

1. An integrated power semiconductor packaging apparatus, comprising:
a plurality of power semiconductor devices; and
an electrically insulative substrate formed integrally, comprising:
a flat surface;
at least one separation wall protruding from the flat surface and configured to separate the flat surface into a plurality of flat areas, wherein each of the flat areas is configured to receive one of the power semiconductor devices; and a flow channel inside the electrically insulative substrate for allowing a coolant flowing through to remove heat from the plurality of power semiconductor devices, wherein one power semiconductor device is fixed on a metal plate, the metal plate is installed on one of the flat areas, and the one flat area comprises a hole to realize direct contact between the coolant in the flow channel and the metal plate.

2. The apparatus of claim 1 , wherein the metal plate is installed on the one flat area through a fastener and a sealing ring.

3. The apparatus of claim 1 , wherein the electrically insulative substrate comprises a plastic material, a ceramic matrix composite material or a polymer matrix composite material.

4. The apparatus of claim 1 , wherein the electrically insulative substrate is formed by injection molding or additive manufacturing process.

5. The apparatus of claim 1 , wherein the coolant comprises deionized water.

6. The apparatus of claim 1 , wherein the flow channel is a serpentine channel.

7. The apparatus of claim 1 , wherein one of the power semiconductor devices comprises an insulated-gate bipolar transistor, a metal-oxide-semiconductor field-effect transistor, or a diode.

8. The apparatus of claim 1 , wherein one of the power semiconductor devices comprises a silicon carbide power semiconductor device or a gallium nitride power semiconductor device.

9. A power converter, comprising an integrated power semiconductor packaging apparatus, the integrated power semiconductor packaging apparatus comprising:
a plurality of power semiconductor devices; and
an electrically insulative substrate formed integrally, comprising:
a flat surface;
at least one separation wall protruding from the flat surface and configured to separate the flat surface into a plurality of flat areas, wherein each of the flat areas is configured to receive one of the power semiconductor devices; and a flow channel inside the electrically insulative substrate for allowing a coolant flowing through to remove heat from the plurality of power semiconductor devices, wherein one power semiconductor device is fixed on a metal plate, the metal plate is installed on one of the flat areas, and the one flat area comprises a hole to realize direct contact between the coolant in the flow channel and the metal plate.

Assignees

• Gen Electric

Inventors

• Mao Saijun
• Qu Bo
• Shi Jingkui
• Xu He
• Shen Jie
• Lan Lin
• Li Rui
• Yuan Zhihui
• Waddell Alistair Martin
• Schroeder Stefan
• Mechlinski Marius Michael
• Chan Mark Aaron

Classifications

• H10W90/00

  Package configurations · CPC title

• H10W40/22

  characterised by their shape, e.g. having conical or cylindrical projections · CPC title

• H10W40/47 Primary

  by flowing liquids, e.g. forced water cooling · CPC title

• H01L23/367

  Electricity · mapped topic

• H01L25/072

  Electricity · mapped topic