Systems and methods for a smart module directly embedded on a lighting fixture

Patent metadata

Field	Value
Publication number	US-10495292-B2
Application number	US-201916246803-A
Country	US
Kind code	B2
Filing date	Jan 14, 2019
Priority date	Jun 7, 2017
Publication date	Dec 3, 2019
Grant date	Dec 3, 2019

Abstract

Examples of the present disclosure are related to systems and methods for lighting fixtures. More particularly, embodiments disclose directly embedded a smart module with a lighting fixture utilizing metal core PCB (MCPCB).

First claim

The invention claimed is:

1. A light fixture comprising:
a rectangular substrate having a length and a width, the substrate formed of metal core PCB;
a first grouping of light sources embedded on the substrate and comprising a plurality of rows along the width of the substrate;
a second grouping of light sources embedded on the substrate and comprising a plurality of rows along the width of the substrate, wherein there is a space between the first grouping of light sources and the second grouping of light sources; and
a smart module including at least one sensor being embedded on the substrate within the space.

2. The light fixture of claim 1 , wherein traces associated with the smart module are directly embedded on the substrate, the traces being configured to electrically couple the first grouping of light sources, the second grouping of light sources, and electronic components associated with the smart module.

3. The light fixture of claim 1 , wherein the smart module includes a housing configured to cover the smart module.

4. The light fixture of claim 3 , wherein the substrate includes a first bend, a second bend, and a planer surface extending between a proximal end of the first bend and a proximal end of the second bend, and the housing extends from a distal end of the first bend to a distal end of the second bend.

5. The light fixture of claim 3 , wherein the housing is comprised of plastic or metal.

6. The light fixture of claim 1 , further comprising:
a heat sink attached to the substrate, wherein the heat sink is formed of a folded fin or extrusions.

7. The light fixture of claim 1 , wherein the at least one sensor comprises at least one of a CO2 sensor, a temperature sensor, a humidity sensor, a Photosynthetic Photon Flux sensor, a radiometer, a visible camera, a spectrometer, a fluorimeter, a pyrometer, and a bolometer.

8. The light fixture of claim 1 , wherein the substrate is coupled with a heat sink.

9. The light fixture of claim 1 , wherein the smart module includes at least one antenna configured to transmit data associated with the at least one sensor.

10. The light fixture of claim 9 , wherein the at least one antenna is embedded within the substrate.

11. A method of forming a light fixture comprising:
embedding a first grouping of light sources on a rectangular substrate having a length and a width and formed of metal core PCB, wherein the first grouping of light sources comprises a plurality of rows along the width of the substrate;
embedding a second grouping of light sources the substrate, wherein the second grouping of light sources comprises a plurality of rows along the width of the substrate, and there is a space between the first grouping of light sources and the second grouping of light sources;
embedding a smart module including at least one sensor on the substrate within the space, wherein the at least one sensor collects plant growth data from plants directly illuminated by the first grouping of light sources and the second grouping of light sources; and
electrically coupling the smart module with the first grouping of light sources and the second grouping of light sources via traces that are directly embedded on the substrate.

12. The method of claim 11 , further comprising:
electrically coupling the smart module with the first grouping of light sources and the second grouping of light sources via traces that are directly embedded on the substrate.

13. The method of claim 11 , wherein the smart module includes a housing configured to cover the smart module.

14. The method of claim 13 , wherein the substrate includes a first bend, a second bend, and a planer surface extending between a proximal end of the first bend and a proximal end of the second bend, and the housing extends from a distal end of the first bend to a distal end of the second bend.

15. The method of claim 13 , wherein the housing is comprised of plastic or metal.

16. The method of claim 11 , further comprising:
attaching a heat sink to the substrate, wherein the heat sink is formed of a folded fin or extrusions.

17. The method of claim 11 , wherein the at least one sensor comprises at least one of a CO2 sensor, a temperature sensor, a humidity sensor, a Photosynthetic Photon Flux sensor, a radiometer, a visible camera, a spectrometer, a fluorimeter, a pyrometer, and a bolometer.

18. The method of claim 11 , wherein the substrate is coupled with a heat sink.

19. The method of claim 11 , wherein the smart module includes at least one antenna configured to transmit data associated with the at least one sensor.

20. The method of claim 19 , wherein the at least one antenna is embedded within the substrate.

Assignees

• Fluence Bioengineering
• Fluence Bioengineering Inc

Inventors

• Duong Dung
• Johnson Randy
• Klase Nick

Classifications

• A01G9/249

  Lighting means (with special arrangements for promoting growth A01G7/045) · CPC title

• H05B47/105

  in response to determined parameters · CPC title

• H05B45/10

  Controlling the intensity of the light · CPC title

• H05K2201/09009

  Substrate related · CPC title

• H05K2201/066

  Heatsink mounted on the surface of the printed circuit board [PCB] · CPC title