Semiconductor lamp and method for producing a semiconductor lamp

Patent metadata

Field	Value
Publication number	US-10495266-B2
Application number	US-201816118649-A
Country	US
Kind code	B2
Filing date	Aug 31, 2018
Priority date	Aug 31, 2017
Publication date	Dec 3, 2019
Grant date	Dec 3, 2019

Abstract

A semiconductor lamp includes a housing with a cavity to accommodate a light source, preferably an LED, and a driver for the light source. The housing has at least one injection channel for injection of an encapsulation material into the cavity of the housing. A semiconductor lamp is produced by providing a housing with a cavity and inserting a driver and a light source into the cavity. Following the insertion of the driver and the light source into the cavity, an encapsulation material is introduced into at least a part of the cavity through at least one injection channel of the housing.

First claim

The invention claimed is:

1. A semiconductor lamp, comprising:
a light source;
a housing with a cavity at least occupied by the light source;
a driver electrically connected to the light source; and
at least one injection channel in the housing for injection of an encapsulation material into the cavity of the housing.

2. The semiconductor lamp according to claim 1 , wherein the housing comprises a main body and a cover, and wherein the at least one injection channel is arranged in at least one of the main body or in the cover.

3. The semiconductor lamp according to claim 2 , wherein the housing further comprises a lens optically positioned to focus light emitted by the light source, wherein the at least one injection channel is formed at least partially in the lens, wherein the cover preferably comprises the lens.

4. The semiconductor lamp according to claim 1 , wherein the encapsulation material introduced through the at least one injection channel into the cavity of the housing is in contact at least with a part of the driver and at least a part of the housing, wherein the injected encapsulation material thermally connects at least two of the part of the driver, a part of a cooling element and a light source printed circuit board, wherein the light source printed circuit board comprises the light source and at least the part of the housing.

5. The semiconductor lamp according to claim 1 , wherein a partition wall provided in the cavity forms at least one separating chamber independent from a remainder of the cavity, wherein the separating chamber is inaccessible to the at least one injection channel.

6. The semiconductor lamp according to claim 1 , further comprising a closing element in the at least one injection channel for closing the at least one injection channel, wherein the closing element comprises an item selected from the group consisting of:
a plug;
a contacting pin for electrical contacting of the semiconductor lamp with a current supply; and
a cured encapsulation material.

7. The semiconductor lamp according to claim 1 , wherein the at least one injection channel further comprises a ventilation channel for venting the cavity during introduction of the encapsulation material.

8. The semiconductor lamp according to claim 1 , wherein the housing further comprises a base part and a top part, wherein the base part is made from plastic and the top part is made from glass, and wherein the at least one injection channel is formed in the base part.

9. A method of producing a semiconductor lamp, the method comprising the following steps:
providing a housing with a cavity; and
inserting a driver and a light source into the cavity;
introducing an encapsulation material at least into a part of the cavity through at least one injection channel of the housing.

10. The method according to claim 9 , further comprising closing the housing after the insertion of the driver and the light source into the cavity, wherein the introduction of the encapsulation material takes place following the closing of the housing.

11. The method according to claim 9 , wherein introducing the encapsulation material further comprises bringing the encapsulation material into contact at least with a part of the driver and at least a part of the housing, wherein the encapsulation material conducts heat between the driver and the housing.

12. The method according to claim 9 , further comprising inserting a partition wall into the cavity for partitioning a separating chamber from the rest of the cavity.

13. The method according to claim 9 , further comprising plugging the at least one injection channel with a plug after the introduction of the encapsulation material.

14. The method according to claim 9 , further comprising curing at least a portion of the encapsulation material within the at least one injection channel to close the at least one injection channel.

15. The method according to claim 9 , wherein the at least one injection channel further comprises at least one opening for the introduction of a contacting pin and the method further comprising the step of inserting a contacting pin into the opening for electrical contact between the semiconductor lamp and a current supply, wherein the contacting pin plugs the at least one injection channel.

16. The method according to claim 9 , wherein the at least one injection channel further comprises a ventilation channel and the method further comprising ventilating the cavity during the introduction of the encapsulation material with the ventilation channel.

Assignees

• Ledvance Gmbh

Inventors

• Dendorfer Christian
• Klafta Thomas
• Kotal Patrick
• Novak Krisztian
• Seitz Wolfgang
• Streppel Henrike

Classifications

• F21K9/90

  Methods of manufacture · CPC title

• F21V31/04

  Provision of filling media · CPC title

• F21V23/005

  the substrate is supporting also the light source · CPC title

• F21V29/87

  Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor · CPC title

• F21Y2115/10

  Light-emitting diodes [LED] · CPC title