Fluid ejection device and printhead

Patent metadata

Field	Value
Publication number	US-10493758-B2
Application number	US-201815884186-A
Country	US
Kind code	B2
Filing date	Jan 30, 2018
Priority date	Mar 28, 2017
Publication date	Dec 3, 2019
Grant date	Dec 3, 2019

Abstract

Ejection device for fluid, comprising a solid body including: first semiconductor body including a chamber for containing the fluid, an ejection nozzle in fluid connection with the chamber, and an actuator operatively connected to the chamber to generate, in use, one or more pressure waves in the fluid such as to cause ejection of the fluid from the ejection nozzle; and a second semiconductor body including a channel for feeding the fluid to the chamber, coupled to the first semiconductor body, in such a way that the channel is in fluid connection with the chamber. The second semiconductor body integrates a damping cavity over which extends a damping membrane, the damping cavity and the damping membrane extending laterally to the channel for feeding the fluid.

First claim

The invention claimed is:

1. An ejection device, comprising:
a body including:
a chamber configured to hold a fluid;
an ejection nozzle in fluidic communication with the chamber;
an actuator operatively coupled to the chamber to generate, in use, one or more pressure waves in the fluid to cause an ejection of the fluid from the ejection nozzle;
a fluidic path in fluidic communication with the chamber and configured to provide the fluid to the chamber; and
a buried damping cavity and a damping membrane suspended over the damping cavity, the damping membrane being arranged, at least in part, upstream from the fluidic path and has a surface in fluid communication with the fluid before the fluid is provided to the fluidic path,

wherein the body includes a first monolithic body that forms the buried damping cavity, the damping membrane, and at least a portion of the fluidic path.

2. The ejection device according to claim 1 , wherein the first monolithic body includes an inlet hole fluidically coupled to the fluidic path, the damping membrane being arranged laterally to the inlet hole.

3. The ejection device according to claim 1 , wherein the body includes a plurality of layers that form the chamber, the ejection nozzle, and the actuator.

4. The ejection device according to claim 3 , wherein the body includes a duct that forms a remaining portion of the fluidic path.

5. The ejection device according to claim 1 , wherein the damping membrane is located between the damping cavity and the surface in fluid communication with the fluid.

6. The ejection device according claim 1 , wherein the damping membrane has a thickness between 0.5 μm and 50 μm.

7. The ejection device according to claim 1 , comprising a filter integrated in the monolithic body and extending, at least in part, in the fluidic path.

8. The ejection device according to claim 7 , wherein the filter has a lattice structure forming a plurality of apertures having sub-micrometric or micrometric dimensions.

9. The ejection device according to claim 7 , wherein the monolithic body is made of glass, germanium, or silicon.

10. The ejection device according to claim 1 , wherein the damping cavity is in fluid communication with an environment external to the ejection device and configured to receive an environmental pressure of the external environment.

11. The ejection device according to claim 1 , wherein the actuator comprises an actuation membrane operatively coupled to the chamber and a piezoelectric element located on the actuation membrane, wherein the piezoelectric element is controllable so as to cause a movement of the actuation membrane at least one of: towards the chamber and away from the chamber.

12. A printhead, comprising:
a reservoir having a reservoir chamber configured to contain a fluid;
a plurality of ejection devices, each ejection device including a body including:
a chamber configured to hold a fluid;
an ejection nozzle in fluidic communication with the chamber;
an actuator operatively coupled to the chamber to generate, in use, one or more pressure waves in the fluid to cause an ejection of the fluid from the ejection nozzle;
a fluidic path in fluidic communication with the chamber and configured to provide the fluid to the chamber;
a buried damping cavity in fluid communication with the fluidic path and configured to provide the fluid to the fluidic path; and
a damping membrane suspended over the damping cavity;
wherein the buried damping cavity and the damping membrane are formed in a monolithic body, and

a manifold structure between the reservoir and the plurality of ejection devices, wherein the manifold structure is configured to place the reservoir in fluidic communication with the plurality of ejection devices.

13. A printer comprising the printhead according to claim 12 .

14. A method for manufacturing an ejection device, comprising:
forming in a first body, a chamber configured to hold a fluid, an ejection nozzle in fluidic connection with the chamber, and an actuator operatively coupled to the chamber to generate, in use, one or more pressure waves in the fluid to cause an ejection of the fluid from the ejection nozzle;
forming, in the first body, a fluidic path in fluidic connection with the chamber configured to provide fluid to the chamber, and
forming, in a monolithic body, a damping cavity, a damping membrane, and an inlet, wherein the damping membrane is suspended over the damping cavity, wherein the damping membrane is located upstream from the fluidic path and configured to provide fluid to the fluidic path; and
coupling the monolithic body to the first body such that the inlet of the monolithic body is in fluid communication with the fluidic path of the first body.

15. The method according to claim 14 , wherein the damping membrane is located laterally to the inlet.

16. The method according to claim 15 , wherein forming the fluidic path includes forming a duct, in direct fluidic communication with the chamber.

17. The method according to claim 14 , wherein the monolithic body is a semiconductor body, wherein forming the damping cavity comprises:
forming first trenches in a surface portion of a substrate of semiconductor material;
etching through the first trenches to form a first open area in the substrate below the first trenches and in fluidic communication with the first trenches;
growing, on the surface portion of the substrate, a first surface layer, forming, with the substrate, the second structural element and closing the trenches at the top; and
heat treating the second structural element and forming the damping cavity buried in the second structural element.

18. The method according to claim 17 , further comprising:
forming, above the first surface layer, an etching mask forming a lattice structure;
forming a second surface layer above the etching mask; and
etching, at said lattice structure, selective portions of the second surface layer and of the first surface layer not protected by the etching mask and forming part of the fluidic path and a filter integrated in the second structural element and in the fluidic path.

19. The method according to claim 18 , wherein the filter is formed from a remaining portion of the first surface layer covered by the etching mask.

20. The method according to claim 18 , wherein the filter and the damping membrane are formed, at least in part, of a same material, including one of: glass, germanium, and silicon.

Assignees

• St Microelectronics Srl
• St Microelectronics Inc

Inventors

• Giusti Domenico
• Ferrera Marco
• Prelini Carlo Luigi
• Dodd Simon

Classifications

• B41J2/055 Primary

  Devices for absorbing or preventing back-pressure · CPC title

• B41J2/1626

  etching · CPC title

• B41J2002/14419

  Manifold · CPC title

• B41J2002/14403

  including a filter · CPC title

• B41J2/1629

  wet etching · CPC title