Void-containing heat-shrinkable polyester film

US10493734B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10493734-B2
Application numberUS-201716089840-A
CountryUS
Kind codeB2
Filing dateMar 28, 2017
Priority dateMar 31, 2016
Publication dateDec 3, 2019
Grant dateDec 3, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The void-containing heat-shrinkable polyester film is a multilayer structure having a non-foamed layer on both outer sides of the foamed layer, and by controlling the film thickness, density, and number of moles of the amorphous component on both outer sides, specific heat shrinkage characteristics and gloss can be improved.

First claim

Opening claim text (preview).

The invention claimed is: 1. A void-containing heat-shrinkable polyester film comprising a structure having three or more layers including at least one polyester resin layer containing voids and at least two layers sandwiching the void-containing layer, wherein the void-containing heat-shrinkable polyester film satisfies the following requirements (1) to (7): (1) heat shrinkage in a main shrinkage direction is 30% or more and 85% or less when being treated in hot water at a treatment temperature of 90° C. for a treatment time of 10 seconds; (2) gloss on both sides of the film measured at an angle of 60 degrees is 40% or more and 150% or less; (3) a thickness difference between both outermost layers of the film is 2 μm or less; (4) thicknesses of both outermost layers of the film are 3 μm or more and 12 μm or less; (5) a density difference between both outermost layers of the film is 0.005 g/cm3 or less; (6) a difference in the number of moles of an amorphous component between both outermost layers of the film is 1 mol % or less; and (7) light transmittance is 40% or less. 2. The void-containing heat-shrinkable polyester film according to claim 1 , wherein the film has at least one layer containing titanium oxide. 3. The void-containing heat-shrinkable polyester film according to claim 2 , wherein a solvent adhesive strength is 2 N/15 mm width or more and 10 N/15 mm width or less. 4. The void-containing heat-shrinkable polyester film according to claim 1 , wherein a solvent adhesive strength is 2 N/15 mm width or more and 10 N/15 mm width or less. 5. The void-containing heat-shrinkable polyester film according to claim 1 , wherein a solvent adhesive strength is 2 N/15 mm width or more and 10 N/15 mm width or less. 6. The void-containing heat-shrinkable polyester film according to claim 1 , wherein a maximum value of heat shrinkage stress in hot air at 90° C. is 9 MPa or less. 7. The void-containing heat-shrinkable polyester film according to claim 6 , wherein the film has at least one layer containing titanium oxide. 8. The void-containing heat-shrinkable polyester film according to claim 7 , wherein a solvent adhesive strength is 2 N/15 mm width or more and 10 N/15 mm width or less. 9. A heat-shrinkable label including the void-containing heat-shrinkable polyester film according to claim 8 . 10. A package comprising the heat-shrinkable label according to claim 9 covering at least a portion of an outer periphery of an object to be packaged. 11. A heat-shrinkable label including the void-containing heat-shrinkable polyester film according to claim 1 . 12. A package comprising the heat-shrinkable label according to claim 11 covering at least a portion of an outer periphery of an object to be packaged. 13. A method for producing the void-containing heat-shrinkable polyester film according to claim 1 , comprising positively cooling both outermost layers to reduce the density difference between both outermost layers in a step of forming an undrawn film from a molten resin. 14. A method for producing the void-containing heat-shrinkable polyester film according to claim 1 , comprising, as a step of positively cooling both outermost layers in a step of forming an undrawn film from a molten resin, cooling one layer with a cooling roll and applying cooling air to the layer on the opposite side to cool the layer by using an apparatus adjusted such that a wind speed difference in a longitudinal direction is 1 m/sec or less. 15. A method for producing the void-containing heat-shrinkable polyester film according to claim 8 , comprising positively cooling both outermost layers to reduce the density difference between both outermost layers in a step of forming an undrawn film from a molten resin. 16. A method for producing the void-containing heat-shrinkable polyester film according to claim 8 , comprising, as a step of positively cooling both outermost layers in a step of forming an undrawn film from a molten resin, cooling one layer with a cooling roll and applying cooling air to the layer on the opposite side to cool the layer by using an apparatus adjusted such that a wind speed difference in a longitudinal direction is 1 m/sec or less.

Assignees

Inventors

Classifications

  • parallel with the direction of feed · CPC title

  • B29C61/06Primary

    Making preforms having internal stresses, e.g. plastic memory · CPC title

  • B32B27/08Primary

    of synthetic resin · CPC title

  • Shrunk on the bottle · CPC title

  • With nonvoid component of specified composition · CPC title

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What does patent US10493734B2 cover?
The void-containing heat-shrinkable polyester film is a multilayer structure having a non-foamed layer on both outer sides of the foamed layer, and by controlling the film thickness, density, and number of moles of the amorphous component on both outer sides, specific heat shrinkage characteristics and gloss can be improved.
Who is the assignee on this patent?
Toyo Boseki
What technology area does this patent fall under?
Primary CPC classification B29C61/06. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Dec 03 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).