Mold attaching method to mold clamping device

Patent metadata

Field	Value
Publication number	US-10493679-B2
Application number	US-201514688174-A
Country	US
Kind code	B2
Filing date	Apr 16, 2015
Priority date	Apr 17, 2014
Publication date	Dec 3, 2019
Grant date	Dec 3, 2019

Abstract

When a plurality of sets of molds, spaced a predetermined distance along a circumferential direction of a rotary platen, are attached through predetermined clamp portions to a mold attachment surface of the rotary platen supported by a movable platen included in a mold clamping device and a mold attachment surface of a fixed platen opposite this mold attachment surface, at least a mold clamping force, when the mold is attached, is previously limited to a limited mold clamping force lower than a mold clamping force at the time of molding. A mold attaching mode is set that has an interlock function of preventing the limitation from being cancelled until a condition under which all the clamp portions are turned on is satisfied. The selected mold attaching mode is performed when the molds are attached and the plurality of sets of molds are sequentially attached set by set.

First claim

The invention claimed is:

1. A mold attaching method comprising the following steps:
providing a mold clamping device including:
a rotary platen having a predetermined number of clamp portions corresponding to a number of molds and a mold attachment surface;
a movable platen supporting the mold attachment surface of the rotary platen; and
a fixed platen having a mold attachment surface that is opposite to the mold attachment surface of the rotary platen and having a predetermined number of clamp portions corresponding to the number of molds,

providing only a first mold between the movable platen and the fixed platen,
exerting a mold clamping force to only the first mold that is limited to a limited mold clamping force lower than a mold clamping force at a time of molding,
setting a mold attaching mode having an interlock function of preventing the mold clamping force from being cancelled until a condition under which all the clamp portions are actuated is satisfied, then
providing a second mold between the movable platen and the fixed platen, and then
exerting a mold clamping force to the second mold that is limited to the limited mold clamping force,
wherein in the mold attaching mode, a number of all the clamp portions is previously set at a setting value, and the interlock function is cancelled on condition that a number of clamp portions which are turned on when the mold is attached, is counted, and that a count value counted reaches the setting value, wherein the setting value is greater than one,
wherein after completing the mold attaching mode, performing post-attachment processing comprising the following steps:
setting each of the clamp portions to a maximum mold clamping force,
determining a thickness of the molds,
performing a primary mold closing step for the molds,
turning off at least one of the clamp portions,
performing a secondary mold closing step for the molds,
turning on the at least one clamp portion, and
setting each of the clamp portions to the maximum mold clamping force, and

wherein the limited mold clamping force is set within a range of 5 to 25% of the maximum mold clamping force to allow for the adjustability of the respective mold to ensure that the mold clamping force for each of the molds are balanced with respect to the other molds, and to allow for the removal of a mold that is improperly clamped.

2. The mold attaching method to a mold clamping device according to claim 1 , wherein in the mold attaching mode, the mold attachment of which is completed is detected with a sensor, and based on a result of the detection, the interlock function is canceled.

3. The mold attaching method to a mold clamping device according to claim 1 , wherein after completion of a plurality of attaching steps in the mold attaching mode, when the interlock function is not cancelled, error processing is performed.

4. The mold attaching method to a mold clamping device according to claim 1 , wherein in the mold attaching mode, a mold clamping pressure is displayed on a key display for mold clamping, the key display being displayed on an operation screen.

5. The mold attaching method to a mold clamping device according to claim 1 , wherein as the clamp portion, an electromagnetic clamper is used.

6. The mold attaching method to a mold clamping device according to claim 1 , wherein as the clamp portion, a hydraulic clamper is used.

7. The mold attaching method to a mold clamping device according to claim 1 , wherein as the clamp portion, an air clamper is used.

8. The mold attaching method to a mold clamping device according to claim 1 , wherein as the clamp portion, a bolt and nut is used.

9. The mold attaching method to a mold clamping device according to claim 1 , wherein the molds include at least a mold in a multi-color molding injection molding machine.

10. The mold attaching method to a mold clamping device according to claim 1 , wherein the plurality of sets of molds include a plurality of movable molds and a plurality of fixed molds equal in number to the movable molds.

11. The mold attaching method to a mold clamping device according to claim 1 , wherein the plurality of sets of molds include a single movable mold and a plurality of fixed molds.

12. The mold attaching method to a mold clamping device according to claim 1 , wherein the mold attachment surfaces of the rotary platen and the fixed platen are vertical surfaces.

13. The mold attaching method to a mold clamping device according to claim 1 , wherein the mold attachment surfaces of the rotary platen and the fixed platen are horizontal surfaces.

14. The mold attaching method to a mold clamping device according to claim 2 , wherein after completion of a plurality of attaching steps in the mold attaching mode, when the interlock function is not cancelled, error processing is performed.

Assignees

• Nissei Plastics Ind Co

Inventors

• Tozawa Keiichi

Classifications

• B29L2031/757

  Moulds, cores, dies · CPC title

• B29C45/1756 Primary

  Handling of moulds or mould parts, e.g. mould exchanging means (moulds per se B29C45/26) · CPC title

• B29C45/1615

  The materials being injected at different moulding stations · CPC title

• B29C45/1742

  Mounting of moulds; Mould supports (mounting of exchangeable mould inserts B29C45/2675) · CPC title

• B29C45/7653

  mould clamping forces · CPC title