Semiconductor device and semiconductor device mounting method

Patent metadata

Field	Value
Publication number	US-10491083-B2
Application number	US-201515576701-A
Country	US
Kind code	B2
Filing date	May 29, 2015
Priority date	May 29, 2015
Publication date	Nov 26, 2019
Grant date	Nov 26, 2019

Abstract

A semiconductor device includes a device main body that is semi-annular, the device main body having an inner circumferential surface formed arcuate in plan view and an outer circumferential surface formed arcuate in plan view. Cutout portions are formed on a first end surface, on one end side, in a circumferential direction, of the device main body and a second end surface, on an other end side, in the circumferential direction, of the device main body. The cutout portions are used for inserting screws for fixing the device main body to a base portion.

First claim

The invention claimed is:

1. A semiconductor device comprising:
a device main body that is semi-annular in plan view, the device main body having at least an inner circumferential side surface that is arcuate in plan view, an outer circumferential side surface that is arcuate in plan view, a first radial side surface, and a second radial side surface, the device main body having first to fourth corner portions, the first corner portion being defined by the first radial side surface and the outer circumferential side surface, the second corner portion being defined by the first radial side surface and the inner circumferential side surface, the third corner portion being defined by the second radial side surface and the outer circumferential side surface, and the fourth corner portion being defined by the second radial side surface and the inner circumferential side surface, wherein
at least one of the first and second corner portions and at least one of the third and fourth corner portions have cutout portions each having
a flat side surface extending radially from the outer or inner circumferential side surface, and
a curved side surface extending arcuately and connecting the flat side surface and the first or second radial side surface,

the flat side surface is parallel, and not aligned, with the first or second radial side surface, and
the semiconductor device is configured to be arranged adjacent to another same-structured semiconductor device to form an annular shape in plan view, so that the two mutually-facing same-shaped adjacent cutout portions of the two semiconductor devices form a single screw hole into which a screw is fitted to fix the device main bodies of the two semiconductor devices to a base portion of an electric motor.

2. The semiconductor device according to claim 1 , wherein
the inner circumferential side surface and the outer circumferential side surface are concentric to each other in plan view,
the first and third corner portions, or the second and fourth corner portions, have the cutout portions, and
the cutout potions of the first and third corner portions, or the cutout portions of the second and fourth corner portions, are equidistant from a center of arc of the device main body.

3. The semiconductor device according to claim 1 , wherein
all of the first to fourth corner positions have the cutout portions.

4. The semiconductor device according to claim 1 , wherein
the outer circumferential side surface of the device main body has at least two cutout portions each having
two flat side surfaces extending radially inward from the outer circumferential side surface, and
a curved side surface extending arcuately and connecting the two flat side surfaces,

the at least two cutout portions are circumferentially arranged at equal intervals, and the at least two cutout portions are used for inserting screws to fix the device main body to the base portion.

5. The semiconductor device according to claim 1 , wherein the first radial side surface has a lower concave engaging portion and an upper convex engaging portion protruding circumferentially outward with respect to the lower concave engaging portion, and the second radial side surface has an upper concave engaging portion and a lower convex engaging portion protruding circumferentially outward with respect to the upper concave engaging portion.

6. The semiconductor device according to claim 1 , wherein
each of the first radial side surface and the second radial side surface has a cutout portion in a radially center thereof,
the device main body further has a top surface and a bottom surface opposing the top surface, and
the semiconductor device further comprises:
a ground conductor on the top surface, adjacent along the cut out portion in plan view, and configured to be in contact with a screw with conductivity when the screw is inserted into the cutout portion.

7. A semiconductor device mounting method comprising:
preparing first and second semiconductor devices each comprising a device main body that is semi-annular in plan view, the device main body having at least an inner circumferential side surface that is arcuate in plan view, an outer circumferential side surface that is arcuate in plan view, a first radial side surface, and a second radial side surface, the device main body having first to fourth corner portions, the first corner portion being defined by the first radial side surface and the outer circumferential side surface, the second corner portion being defined by the first radial side surface and the inner circumferential side surface, the third corner portion being defined by the second radial side surface and the outer circumferential side surface, and the fourth corner portion being defined by the second radial side surface and the inner circumferential side surface, wherein
at least one of the first and second corner portions and at least one of the third and fourth corner portions have cutout portions each having
a flat side surface extending radially from the outer or inner circumferential side surface, and
a curved side surface extending arcuately and connecting the flat side surface and the first or second radial side surface, and

the flat side surface is parallel, and not aligned, with the first or second radial side surface;

adjacently arranging the first and second semiconductor devices to form an annular shape, in plan view, so that the two mutually-facing same-shaped adjacent cutout portions of the two semiconductor devices form a single screw hole; and
fitting by insertion a screw into the single screw hole to fix the device main bodies of the two semiconductor devices to a base portion of an electric motor.

8. The semiconductor device mounting method according to claim 7 , wherein the first radial side surface has a lower concave engaging portion and an upper convex engaging portion protruding circumferentially outward with respect to the lower concave engaging portion, the second radial side surface has an upper concave engaging portion and a lower convex engaging portion protruding circumferentially outward with respect to the upper concave engaging portion, and adjacently arranging the two the two semiconductor devices further comprises: engaging the upper convex engaging portion of the first semiconductor device with the upper concave engaging portion of the second semiconductor device.

Assignees

• Shindengen Electric Mfg

Inventors

• Sasaki Mitsumasa

Classifications

• H02K11/38

  Control circuits or drive circuits associated with geared commutator motors of the worm-and-wheel type · CPC title

• H02K11/00

  Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection (casings, enclosures or supports H02K5/00) · CPC title

• H02M7/003

  Constructional details, e.g. physical layout, assembly, wiring or busbar connections · CPC title

• H02K11/33

  Drive circuits, e.g. power electronics (H02K11/38 takes precedence) · CPC title

• H10W90/00

  Package configurations · CPC title