Board to board contactless interconnect system using waveguide sections connected by conductive gaskets

Patent metadata

Field	Value
Publication number	US-10490874-B2
Application number	US-201715459783-A
Country	US
Kind code	B2
Filing date	Mar 15, 2017
Priority date	Mar 18, 2016
Publication date	Nov 26, 2019
Grant date	Nov 26, 2019

Abstract

A board to board contactless interconnect system includes a first circuit board for launching at st one microwave signal into a cavity of a first waveguide secured thereto. A second waveguide, secured to a second circuit board, is coupleable to the first waveguide to receive the at least one microwave signal in a cavity of the second waveguide and conduct the at least one microwave signal onto a microwave receiver aligned with the cavity on the second circuit board. The waveguides may be separable and may include additional waveguides. Conductive gaskets with apertures for microwave signals to pass through are positioned between the waveguides and between each circuit board and a waveguide to prevent leakage of microwave energy therebetween. Some embodiments may pass signals through a sealed boundary and maintain integrity of the seal. Such embodiments may have a third waveguide interposed between the first and second waveguides.

First claim

What is claimed is:

1. A board to board contactless interconnect system, comprising:
a first circuit board having a transceiver for launching or receiving a microwave signal into or from a first waveguide cavity extending through a first portion of a waveguide, the first portion of the waveguide having a first end and a second end, the first end securable to the first circuit board with the transceiver aligned with the first waveguide cavity;
a first conductive gasket positioned between the first circuit board and the first end of the first portion of the waveguide, the first conductive gasket having an aperture aligned with the first waveguide cavity, the aperture having a cross-sectional shape and dimensions of a cross-section of the first waveguide cavity;
a second portion of the waveguide having a first end and a second end, the first end of the second portion of the waveguide coupleable to the second end of the first portion of the waveguide, the second portion of the waveguide having a second waveguide cavity with the same cross-sectional shape and dimensions of the cross-section of the first waveguide cavity for receiving or passing the microwave signal;
a second conductive gasket positioned between the second end of the first portion of the waveguide and the first end of the second portion of the waveguide, the second conductive gasket having an aperture of the second conductive gasket aligned with the first waveguide cavity and the second waveguide cavity, the aperture having the cross-sectional shape and dimensions of the cross-section of the second waveguide cavity;
a second circuit board having a transceiver for receiving or launching the microwave signal from or into the second waveguide cavity, the second circuit board is oriented orthogonal to the first circuit board, the second end of the second portion of the waveguide securable to the second circuit board with the transceiver of the second circuit board aligned with the second waveguide cavity; and
a third conductive gasket positioned between the second end of the second portion of the waveguide and the second circuit board, the third conductive gasket having an aperture of the third conductive gasket aligned with the second waveguide cavity, the aperture having the cross-sectional shape and dimensions of the cross-section of the second waveguide cavity.

2. A board to board contactless interconnect system as recited in claim 1 , wherein a cross section of the first cavity of the first portion of the waveguide and the second cavity in the second portion of the waveguide is selected from the group consisting of circular, rectangular, and double ridge.

3. A board to board contactless interconnect system as recited in claim 2 , wherein the microwave signal is transmitted from the transceiver of the first circuit board, the transceiver of the first circuit board selected from the group consisting of an integrated circuit and a board pad.

4. A board to board contactless interconnect system as recited in claim 2 , wherein the microwave signal is received on the transceiver of the first circuit board, the transceiver of the first circuit board selected from the group consisting of an integrated circuit and a board pad.

5. A board to board contactless interconnect system as recited in claim 1 , further comprising the transceiver of the first circuit board comprising:
a stripline-waveguide transition comprising a conductive transmission line arranged and disposed between first and second ground planes, the conductive transmission line being dielectrically isolated from first and second ground planes by dielectric;
a conductive stripline antenna extending into an opening in the first ground plane, the antenna coupled to the conductive transmission line, the antenna being a radiating/receiving element antenna of a fixed length and width;
the first portion of the waveguide arranged and disposed aligned with the opening in the first ground plane;
wherein the radio frequency energy transitions between a TEM mode propagation in the transmission line and a TE mode propagation in the waveguide; and
wherein the stripline-waveguide transition is a transmitter which transitions radio frequency energy between a TE mode propagation in the waveguide and a TEM mode propagation in the antenna and transmission line as a receiver.

6. A board to board contactless interconnect system as recited in claim 1 , wherein the microwave signal is transmitted from the transceiver of the first circuit board, the transceiver of the first circuit board selected from the group consisting of an integrated circuit and a board pad.

7. A board to board contactless interconnect system as recited in claim 1 , wherein the microwave signal is received on the transceiver of the first circuit board, the transceiver of the first circuit board selected from the group consisting of an integrated circuit and a board pad.

8. A board to board contactless interconnect system as recited in claim 1 , wherein the first portion of the waveguide and the second portion of the waveguide are a 90° arc of a circle.

9. A board to board contactless interconnect system comprising:
a first circuit board having a transceiver for launching or receiving a microwave signal into or from a waveguide assembly, a first waveguide of the waveguide assembly having a first end and a second end, the first end securable to the first circuit board with the transceiver and the first waveguide having a first waveguide cavity;
a first conductive gasket positioned between the first circuit board and the first end of the first waveguide, the first conductive gasket having an aperture aligned with the first waveguide cavity, the aperture having a cross-sectional shape and dimensions of a cross-section of the first waveguide cavity;
a second waveguide of the waveguide assembly having a first end and a second end, the second waveguide having a second waveguide cavity with the same cross-sectional shape and dimensions of the cross-section of the first waveguide cavity for receiving or passing the microwave signal;
a second conductive gasket an aperture aligned with the first waveguide cavity, the aperture of the second conductive gasket having the cross-sectional shape and dimensions of the cross-section of the first waveguide cavity;
a second circuit board having a transceiver for receiving or launching the microwave signal from or into the second waveguide cavity, the second end of the second waveguide securable to the second circuit board with the transceiver of the second circuit board aligned with the second waveguide cavity;
a third conductive gasket positioned between the second end of the second waveguide and the second circuit board, the third conductive gasket having an aperture aligned with the second waveguide cavity, the aperture of the third conductive gasket having the cross-sectional shape and dimensions of the cross-section of the second waveguide cavity;
a third waveguide interposed between the first waveguide and the second waveguide, the third waveguide having a third waveguide cavity with the same cross-sectional shape and dimensions of the cross-section of the first waveguide cavity and the second waveguide cavity, the third waveguide cavity for receiving and passing the microwave signal between first and second ends of the third waveguide, the first end of the third waveguide couplable to the second end of the first waveguide with the second conductive gasket therebetween, the second end of the third waveguide securable to a first side of a sealed boundary barrier, the third waveguide having a flange passing through an aperture in the sealed boundary barrier, the second end of the third waveguide member couplable with the first end of the

Assignees

• Te Connectivity Corp

Inventors

• Smith Jr Graham Harry
• Morley Stephen T
• Nguyen Hung Thai
• Cina Michael Frank

Classifications

• H04W4/80

  Services using short range communication, e.g. near-field communication [NFC], radio-frequency identification [RFID] or low energy communication · CPC title

• H01P5/08 Primary

  for linking dissimilar lines or devices (H01P1/16, H01P5/04 take precedence; linking lines of the same kind but with different dimensions H01P5/02) · CPC title

• H01P3/08

  Microstrips; Strip lines · CPC title

• H01P5/107

  Hollow-waveguide/strip-line transitions · CPC title

• H01P1/042

  Hollow waveguide joints · CPC title